TW200804499A - A novel manufacturing process of two-sided lithography/etching and the composition of protection layer thereof - Google Patents
A novel manufacturing process of two-sided lithography/etching and the composition of protection layer thereof Download PDFInfo
- Publication number
- TW200804499A TW200804499A TW96101921A TW96101921A TW200804499A TW 200804499 A TW200804499 A TW 200804499A TW 96101921 A TW96101921 A TW 96101921A TW 96101921 A TW96101921 A TW 96101921A TW 200804499 A TW200804499 A TW 200804499A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- resin solution
- weight
- layer
- novel
- Prior art date
Links
- 238000005530 etching Methods 0.000 title claims abstract description 18
- 238000001459 lithography Methods 0.000 title claims abstract description 14
- 239000000203 mixture Substances 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 20
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 73
- 229920002120 photoresistant polymer Polymers 0.000 claims description 54
- 239000011241 protective layer Substances 0.000 claims description 30
- 239000002904 solvent Substances 0.000 claims description 16
- 239000000178 monomer Substances 0.000 claims description 15
- 239000005011 phenolic resin Substances 0.000 claims description 14
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 13
- 229920001568 phenolic resin Polymers 0.000 claims description 13
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 12
- 239000004094 surface-active agent Substances 0.000 claims description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 9
- 230000000996 additive effect Effects 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 229920003986 novolac Polymers 0.000 claims description 5
- 238000009835 boiling Methods 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- -1 cyclic olefin Chemical class 0.000 claims description 3
- 150000001925 cycloalkenes Chemical class 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 2
- 239000004922 lacquer Substances 0.000 claims 2
- NHXCUKIHMLHWQT-UHFFFAOYSA-N 1-propoxydecane Chemical compound CCCCCCCCCCOCCC NHXCUKIHMLHWQT-UHFFFAOYSA-N 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052684 Cerium Inorganic materials 0.000 claims 1
- NQHAZTDQFIYTQD-UHFFFAOYSA-N SOS Chemical compound SOS NQHAZTDQFIYTQD-UHFFFAOYSA-N 0.000 claims 1
- 239000013543 active substance Substances 0.000 claims 1
- 229910052788 barium Inorganic materials 0.000 claims 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical group [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 claims 1
- 150000001993 dienes Chemical class 0.000 claims 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims 1
- 229920005546 furfural resin Polymers 0.000 claims 1
- 238000005286 illumination Methods 0.000 claims 1
- 229930003658 monoterpene Natural products 0.000 claims 1
- 150000002773 monoterpene derivatives Chemical class 0.000 claims 1
- 235000002577 monoterpenes Nutrition 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- 125000005702 oxyalkylene group Chemical group 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000001035 drying Methods 0.000 abstract description 5
- 238000000206 photolithography Methods 0.000 abstract 1
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 10
- 239000011265 semifinished product Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 8
- 238000000354 decomposition reaction Methods 0.000 description 8
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000009472 formulation Methods 0.000 description 6
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 5
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 3
- 241000238631 Hexapoda Species 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- IXQBMTJJADIMOS-UHFFFAOYSA-N C(C)(=O)OC(COCCCCCCCCCC)C Chemical compound C(C)(=O)OC(COCCCCCCCCCC)C IXQBMTJJADIMOS-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- GYSCBCSGKXNZRH-UHFFFAOYSA-N 1-benzothiophene-2-carboxamide Chemical compound C1=CC=C2SC(C(=O)N)=CC2=C1 GYSCBCSGKXNZRH-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- DRLRGHZJOQGQEC-UHFFFAOYSA-N 2-(2-methoxypropoxy)propyl acetate Chemical compound COC(C)COC(C)COC(C)=O DRLRGHZJOQGQEC-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- GHVNFZFCNZKVNT-UHFFFAOYSA-N Decanoic acid Natural products CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- 241000237503 Pectinidae Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 241000270708 Testudinidae Species 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- ZFKUGRZNWFODEP-UHFFFAOYSA-N cyclohexene;phenol Chemical compound C1CCC=CC1.OC1=CC=CC=C1 ZFKUGRZNWFODEP-UHFFFAOYSA-N 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N methyl acetate Chemical compound COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 150000007965 phenolic acids Chemical class 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910001954 samarium oxide Inorganic materials 0.000 description 1
- 229940075630 samarium oxide Drugs 0.000 description 1
- FKTOIHSPIPYAPE-UHFFFAOYSA-N samarium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Sm+3].[Sm+3] FKTOIHSPIPYAPE-UHFFFAOYSA-N 0.000 description 1
- 235000020637 scallop Nutrition 0.000 description 1
- 239000005266 side chain polymer Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Materials For Photolithography (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96101921A TW200804499A (en) | 2007-01-18 | 2007-01-18 | A novel manufacturing process of two-sided lithography/etching and the composition of protection layer thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96101921A TW200804499A (en) | 2007-01-18 | 2007-01-18 | A novel manufacturing process of two-sided lithography/etching and the composition of protection layer thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200804499A true TW200804499A (en) | 2008-01-16 |
| TWI344478B TWI344478B (cg-RX-API-DMAC7.html) | 2011-07-01 |
Family
ID=44765850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96101921A TW200804499A (en) | 2007-01-18 | 2007-01-18 | A novel manufacturing process of two-sided lithography/etching and the composition of protection layer thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200804499A (cg-RX-API-DMAC7.html) |
-
2007
- 2007-01-18 TW TW96101921A patent/TW200804499A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWI344478B (cg-RX-API-DMAC7.html) | 2011-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100538531C (zh) | 水溶性树脂组合物和使用该组合物形成图案的方法 | |
| TWI417682B (zh) | 微細化圖案之形成方法及用於它之光阻基板處理液 | |
| JP6090777B2 (ja) | ナノ構造体を表面に備える基板の製造方法 | |
| KR101720967B1 (ko) | 기판 처리액 및 이것을 사용한 레지스트 기판 처리 방법 | |
| CN101230226B (zh) | 一种双面微影蚀刻新制程及其保护层的组成 | |
| TW201214508A (en) | Methods of forming photolithographic patterns | |
| KR20090027251A (ko) | 미세화된 레지스트 패턴의 형성방법 | |
| TWI838356B (zh) | 光阻移除劑組合物 | |
| TW200839451A (en) | Composition for producing antireflecting film and pattern forming method using the same | |
| TW573231B (en) | An anti-reflection coating composition and process for forming a resist pattern using the same | |
| TW200836025A (en) | Treatment liquid for developed resist substrate and treating method for resist substrate using therewith | |
| TWI566057B (zh) | 光阻圖案之表面處理方法、使用其之光阻圖案形成方法及使用於其之被覆層形成用組成物 | |
| TW200937129A (en) | Composition for producing antireflection firm, and method for producing a pattern using the same | |
| JP2021518584A (ja) | ネガ作動型超厚膜フォトレジスト | |
| CN103460136B (zh) | 上表面抗反射膜形成用组合物以及使用其的图案形成方法 | |
| JP2591644B2 (ja) | ホトレジストの剥離液 | |
| TW200804499A (en) | A novel manufacturing process of two-sided lithography/etching and the composition of protection layer thereof | |
| JPS5968735A (ja) | 感光性組成物 | |
| CN102662304B (zh) | 一种双面微影蚀刻制程 | |
| KR102214220B1 (ko) | 마스크 블랭크 및 전사용 마스크 | |
| CN101395537B (zh) | 感光性有机膜用显影液组合物 | |
| TW201030806A (en) | Method for producing a resist pattern | |
| TW202603492A (zh) | 用於邊緣保護層之永續且更環保之解決方案的微影組合物及其使用方法 | |
| TW202546552A (zh) | 形成半導體裝置的方法 |