TW200803704A - Method of fabricating direct-assembled heat dissipation apparatus for heat transfer - Google Patents
Method of fabricating direct-assembled heat dissipation apparatus for heat transfer Download PDFInfo
- Publication number
- TW200803704A TW200803704A TW95122506A TW95122506A TW200803704A TW 200803704 A TW200803704 A TW 200803704A TW 95122506 A TW95122506 A TW 95122506A TW 95122506 A TW95122506 A TW 95122506A TW 200803704 A TW200803704 A TW 200803704A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat pipe
- groove
- fin
- bonding
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 40
- 238000003825 pressing Methods 0.000 claims abstract description 24
- 238000005452 bending Methods 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 102000000591 Tight Junction Proteins Human genes 0.000 claims description 3
- 108010002321 Tight Junction Proteins Proteins 0.000 claims description 3
- 210000001578 tight junction Anatomy 0.000 claims description 3
- 230000004048 modification Effects 0.000 claims 1
- 238000012986 modification Methods 0.000 claims 1
- 230000001360 synchronised effect Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95122506A TW200803704A (en) | 2006-06-22 | 2006-06-22 | Method of fabricating direct-assembled heat dissipation apparatus for heat transfer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95122506A TW200803704A (en) | 2006-06-22 | 2006-06-22 | Method of fabricating direct-assembled heat dissipation apparatus for heat transfer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200803704A true TW200803704A (en) | 2008-01-01 |
| TWI303971B TWI303971B (enrdf_load_stackoverflow) | 2008-12-01 |
Family
ID=44765705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95122506A TW200803704A (en) | 2006-06-22 | 2006-06-22 | Method of fabricating direct-assembled heat dissipation apparatus for heat transfer |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200803704A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI781515B (zh) * | 2021-01-15 | 2022-10-21 | 邁萪科技股份有限公司 | 散熱結構及其製造方法 |
-
2006
- 2006-06-22 TW TW95122506A patent/TW200803704A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI303971B (enrdf_load_stackoverflow) | 2008-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |