TWI313156B - - Google Patents
Download PDFInfo
- Publication number
- TWI313156B TWI313156B TW95112331A TW95112331A TWI313156B TW I313156 B TWI313156 B TW I313156B TW 95112331 A TW95112331 A TW 95112331A TW 95112331 A TW95112331 A TW 95112331A TW I313156 B TWI313156 B TW I313156B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat pipe
- conducting
- bottom plate
- group
- Prior art date
Links
- 238000000034 method Methods 0.000 claims description 68
- 238000003825 pressing Methods 0.000 claims description 30
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005056 compaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095112331A TW200740357A (en) | 2006-04-07 | 2006-04-07 | Method of assembling heat conductive pipe and heat conductive base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095112331A TW200740357A (en) | 2006-04-07 | 2006-04-07 | Method of assembling heat conductive pipe and heat conductive base |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200740357A TW200740357A (en) | 2007-10-16 |
| TWI313156B true TWI313156B (enrdf_load_stackoverflow) | 2009-08-01 |
Family
ID=45072730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095112331A TW200740357A (en) | 2006-04-07 | 2006-04-07 | Method of assembling heat conductive pipe and heat conductive base |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200740357A (enrdf_load_stackoverflow) |
-
2006
- 2006-04-07 TW TW095112331A patent/TW200740357A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200740357A (en) | 2007-10-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009170860A (ja) | 放熱フィンを有するラジエータの製造方法及びその構造 | |
| CN108617138B (zh) | 热管并列式散热装置及其制法 | |
| CN100543973C (zh) | 无底座的散热器 | |
| TWI313156B (enrdf_load_stackoverflow) | ||
| CN201541420U (zh) | 扣具与导热构件组合结构 | |
| CN100462159C (zh) | 直组式热传递散热装置制法 | |
| CN201066983Y (zh) | 散热器底座和热导管的紧配结构改良 | |
| CN202032928U (zh) | 导热座供多热管密合排列之组配结构 | |
| TW201122784A (en) | Method of tightly combining heat sink fins and hot pipe. | |
| TWI407897B (zh) | 具受熱部共面之導熱結構的製法 | |
| CN2907197Y (zh) | 导热块和热管紧结构造 | |
| TW200803704A (en) | Method of fabricating direct-assembled heat dissipation apparatus for heat transfer | |
| TWI537540B (zh) | 散熱模組組合結構及其製造方法 | |
| CN102802377A (zh) | 具有并列式热管的散热器及其制作方法 | |
| TW200719127A (en) | A heat dissipation apparatus and method for manufacturing the same | |
| CN100446917C (zh) | 热导管与鳍片穿压紧结方法与其应用装置 | |
| TWM303783U (en) | Direct mounting type heat conductive heat dissipation apparatus | |
| TWI270339B (en) | Heat conduits and method for forming heat-dissipating fins by squeeze-shaping | |
| JP2001257296A (ja) | ヒートシンク | |
| TWI271234B (en) | Method for press fitting of heat pipe and fin and its device | |
| CN203775586U (zh) | 散热模组组合结构 | |
| CN102984917B (zh) | 散热装置的制造方法 | |
| CN201062929Y (zh) | 热导管与散热鳍片的紧结构造 | |
| CN2935726Y (zh) | 热管式散热器的扣装结构 | |
| TW200907279A (en) | Method and fixture for manufacturing heat dissipation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |