TW200740357A - Method of assembling heat conductive pipe and heat conductive base - Google Patents

Method of assembling heat conductive pipe and heat conductive base

Info

Publication number
TW200740357A
TW200740357A TW095112331A TW95112331A TW200740357A TW 200740357 A TW200740357 A TW 200740357A TW 095112331 A TW095112331 A TW 095112331A TW 95112331 A TW95112331 A TW 95112331A TW 200740357 A TW200740357 A TW 200740357A
Authority
TW
Taiwan
Prior art keywords
heat conductive
conductive base
assembling
base plate
pipe
Prior art date
Application number
TW095112331A
Other languages
English (en)
Chinese (zh)
Other versions
TWI313156B (enrdf_load_stackoverflow
Inventor
Shi-Ming Chen
Qiu-Zi Qin
Original Assignee
Shi-Ming Chen
Qiu-Zi Qin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shi-Ming Chen, Qiu-Zi Qin filed Critical Shi-Ming Chen
Priority to TW095112331A priority Critical patent/TW200740357A/zh
Publication of TW200740357A publication Critical patent/TW200740357A/zh
Application granted granted Critical
Publication of TWI313156B publication Critical patent/TWI313156B/zh

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW095112331A 2006-04-07 2006-04-07 Method of assembling heat conductive pipe and heat conductive base TW200740357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095112331A TW200740357A (en) 2006-04-07 2006-04-07 Method of assembling heat conductive pipe and heat conductive base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095112331A TW200740357A (en) 2006-04-07 2006-04-07 Method of assembling heat conductive pipe and heat conductive base

Publications (2)

Publication Number Publication Date
TW200740357A true TW200740357A (en) 2007-10-16
TWI313156B TWI313156B (enrdf_load_stackoverflow) 2009-08-01

Family

ID=45072730

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112331A TW200740357A (en) 2006-04-07 2006-04-07 Method of assembling heat conductive pipe and heat conductive base

Country Status (1)

Country Link
TW (1) TW200740357A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
TWI313156B (enrdf_load_stackoverflow) 2009-08-01

Similar Documents

Publication Publication Date Title
TWI559845B (zh) 攜帶式電子裝置之散熱裝置
WO2005112533A3 (en) Lightweight heat sink
US20120325430A1 (en) Fin type heat sink fixing assembly
MX2009005986A (es) Proceso para producir un troquel.
JP5380242B2 (ja) 電子部品搭載用基板の製造方法及び電子部品搭載用基板
CN101844189B (zh) 散热器散热片与热管的紧配组合结构
TW200709509A (en) Anisotropic conductive sheet and manufacturing method, connection method and inspection method of the same
TWI308052B (enrdf_load_stackoverflow)
TW200740357A (en) Method of assembling heat conductive pipe and heat conductive base
CN201541420U (zh) 扣具与导热构件组合结构
TW200908862A (en) Heat conductive module and manufacturing method thereof
CN104869783B (zh) 散热模组组合结构及其制造方法
US20120267068A1 (en) Thermal module and manufacturing method thereof
CN204859858U (zh) 一种导热结构及电子设备
TWI537540B (zh) 散熱模組組合結構及其製造方法
TW200719127A (en) A heat dissipation apparatus and method for manufacturing the same
JP5656163B2 (ja) エンボス金属板及びその製造方法
CN203775586U (zh) 散热模组组合结构
CN203748178U (zh) 携带式电子装置之散热装置
CN202028710U (zh) 散热器散热片与热管的紧配组合结构
TWI750694B (zh) 散熱模組及其製造方法
JP3108301U (ja) 導熱管を備えた放熱装置
CN203722994U (zh) 散热器结构
CN102709261A (zh) 散热模组及其制造方法
CN105025683B (zh) 散热模组及其制造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees