TW200801492A - Surface inspection device - Google Patents

Surface inspection device

Info

Publication number
TW200801492A
TW200801492A TW096117188A TW96117188A TW200801492A TW 200801492 A TW200801492 A TW 200801492A TW 096117188 A TW096117188 A TW 096117188A TW 96117188 A TW96117188 A TW 96117188A TW 200801492 A TW200801492 A TW 200801492A
Authority
TW
Taiwan
Prior art keywords
wafer
illumination light
inspection device
inspection
surface inspection
Prior art date
Application number
TW096117188A
Other languages
English (en)
Inventor
Yoshihiko Fujimori
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200801492A publication Critical patent/TW200801492A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00—General purpose image data processing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/20—Image enhancement or restoration by the use of local operators
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
TW096117188A 2006-05-15 2007-05-15 Surface inspection device TW200801492A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006135228 2006-05-15

Publications (1)

Publication Number Publication Date
TW200801492A true TW200801492A (en) 2008-01-01

Family

ID=38694011

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096117188A TW200801492A (en) 2006-05-15 2007-05-15 Surface inspection device

Country Status (6)

Country Link
US (1) US20090074285A1 (zh)
JP (1) JPWO2007132925A1 (zh)
KR (1) KR20090008185A (zh)
CN (1) CN101443649A (zh)
TW (1) TW200801492A (zh)
WO (1) WO2007132925A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101941012B (zh) * 2009-07-03 2012-04-25 泰怡凯电器(苏州)有限公司 清洁机器人及其脏物识别装置和该机器人的清洁方法
JP5471477B2 (ja) * 2010-01-15 2014-04-16 ウシオ電機株式会社 ネジ山の検査装置
CN103620392B (zh) * 2011-04-28 2017-05-17 皇家飞利浦有限公司 具有光学不均匀性的测定的评估方法及装置
CN103353459A (zh) * 2013-06-18 2013-10-16 深圳市华星光电技术有限公司 一种检测装置及检测方法
KR20150010392A (ko) * 2013-07-19 2015-01-28 케이맥(주) 결정화된 실리콘의 검사 방법 및 장치
CN103743761B (zh) * 2013-12-31 2017-06-23 江苏大学附属医院 一种镜片水印疵病图像检测装置
CN107991310B (zh) * 2017-11-27 2020-11-06 上海卫星装备研究所 一种应用于航天器表面osr粘贴胶层缺陷检测方法及系统
CN108827181B (zh) * 2018-03-14 2021-04-09 浙江大学山东工业技术研究院 一种基于视觉的板材表面检测方法
JP2020005142A (ja) * 2018-06-28 2020-01-09 キヤノン株式会社 撮像装置及びその制御方法、プログラム、記憶媒体

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62124448A (ja) * 1985-11-26 1987-06-05 Hitachi Electronics Eng Co Ltd 表面検査装置
JPH02173873A (ja) * 1988-12-26 1990-07-05 Nec Corp 欠陥判定器
JPH03154807A (ja) * 1989-11-13 1991-07-02 Matsushita Electron Corp パターン検査方法
EP0638801B1 (en) * 1993-08-12 1998-12-23 International Business Machines Corporation Method of inspecting the array of balls of an integrated circuit module
US5663569A (en) * 1993-10-14 1997-09-02 Nikon Corporation Defect inspection method and apparatus, and defect display method
JP3216033B2 (ja) * 1995-04-20 2001-10-09 オムロン株式会社 検査結果出力装置および検査結果出力方法、ならびにこの検査結果出力装置を用いた基板検査システムおよびこの検査結果出力方法を用いた基板検査方法
US5963328A (en) * 1997-08-28 1999-10-05 Nissan Motor Co., Ltd. Surface inspecting apparatus
JP2000214099A (ja) * 1999-01-25 2000-08-04 Hitachi Ltd 結晶欠陥計測方法および装置
US6097482A (en) * 1999-06-08 2000-08-01 Philip Morris Incorporated High speed flaw detecting system for reflective material
JP2001195035A (ja) * 2000-01-14 2001-07-19 Fujitsu General Ltd コントラスト調整回路
WO2001071323A1 (en) * 2000-03-24 2001-09-27 Olympus Optical Co., Ltd. Apparatus for detecting defect
TWI285738B (en) * 2000-09-26 2007-08-21 Olympus Corp Defect detecting apparatus and computer readable medium
JP5288672B2 (ja) * 2001-07-11 2013-09-11 株式会社ニコン 表面欠陥検査装置
JP2003091725A (ja) * 2001-09-18 2003-03-28 M I L:Kk 外観検査における瑕疵強調アルゴリズム
EP1450153B1 (en) * 2001-11-30 2011-06-29 International Business Machines Corporation Inspection device and inspection method for pattern profiles
JP4041042B2 (ja) * 2003-09-17 2008-01-30 大日本スクリーン製造株式会社 欠陥確認装置および欠陥確認方法
JP2006023221A (ja) * 2004-07-09 2006-01-26 Tokyo Seimitsu Co Ltd 外観検査装置及び投影方法
US7609373B2 (en) * 2005-05-31 2009-10-27 Kla-Tencor Technologies Corporation Reducing variations in energy reflected from a sample due to thin film interference

Also Published As

Publication number Publication date
JPWO2007132925A1 (ja) 2009-09-24
WO2007132925A1 (ja) 2007-11-22
CN101443649A (zh) 2009-05-27
US20090074285A1 (en) 2009-03-19
KR20090008185A (ko) 2009-01-21

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