TW200745563A - Method of fabricating cantilever type probe and method of fabricating probe card using the same - Google Patents

Method of fabricating cantilever type probe and method of fabricating probe card using the same

Info

Publication number
TW200745563A
TW200745563A TW096118849A TW96118849A TW200745563A TW 200745563 A TW200745563 A TW 200745563A TW 096118849 A TW096118849 A TW 096118849A TW 96118849 A TW96118849 A TW 96118849A TW 200745563 A TW200745563 A TW 200745563A
Authority
TW
Taiwan
Prior art keywords
tip portion
fabricating
dummy
cantilever type
substrate
Prior art date
Application number
TW096118849A
Other languages
English (en)
Other versions
TWI326360B (en
Inventor
Han-Moo Lee
Yong-Hwi Jo
Original Assignee
Phicom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phicom Corp filed Critical Phicom Corp
Publication of TW200745563A publication Critical patent/TW200745563A/zh
Application granted granted Critical
Publication of TWI326360B publication Critical patent/TWI326360B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW096118849A 2006-06-07 2007-05-25 Method of fabricating cantilever type probe and method of fabricating probe card using the same TWI326360B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060050717A KR100749735B1 (ko) 2006-06-07 2006-06-07 캔틸레버형 프로브 제조 방법 및 이를 이용한 프로브 카드제조 방법

Publications (2)

Publication Number Publication Date
TW200745563A true TW200745563A (en) 2007-12-16
TWI326360B TWI326360B (en) 2010-06-21

Family

ID=38614632

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096118849A TWI326360B (en) 2006-06-07 2007-05-25 Method of fabricating cantilever type probe and method of fabricating probe card using the same

Country Status (7)

Country Link
US (1) US8114302B2 (zh)
JP (1) JP2009540291A (zh)
KR (1) KR100749735B1 (zh)
CN (1) CN101461050A (zh)
DE (1) DE112007001350T5 (zh)
TW (1) TWI326360B (zh)
WO (1) WO2007142413A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100749735B1 (ko) 2006-06-07 2007-08-16 주식회사 파이컴 캔틸레버형 프로브 제조 방법 및 이를 이용한 프로브 카드제조 방법
KR100905429B1 (ko) 2007-08-16 2009-07-02 (주)미코엠에스티 프로브 카드 구조체의 형성 방법
US8416247B2 (en) 2007-10-09 2013-04-09 Sony Computer Entertaiment America Inc. Increasing the number of advertising impressions in an interactive environment
KR20100025900A (ko) * 2008-08-28 2010-03-10 삼성전기주식회사 프로브 카드 및 그의 제조 방법
WO2013059670A2 (en) 2011-10-21 2013-04-25 Nanoink, Inc. Octahedral and pyramid-on-post tips for microscopy and lithography
WO2013134564A1 (en) * 2012-03-07 2013-09-12 Advantest Corporation Transferring electronic probe assemblies to space transformers
JP6068925B2 (ja) * 2012-10-23 2017-01-25 株式会社日本マイクロニクス プローブの製造方法
CN106663394B (zh) * 2014-07-23 2019-10-22 索尼公司 显示装置、制造显示装置的方法以及电子设备
KR101667856B1 (ko) * 2014-12-18 2016-10-20 한국산업기술대학교산학협력단 프로브 팁 제조방법
CN104701328B (zh) * 2015-03-25 2017-10-13 京东方科技集团股份有限公司 一种阵列基板及其制造方法、显示装置
JP7143315B2 (ja) 2017-03-01 2022-09-28 ビーエーエスエフ ソシエタス・ヨーロピア 粉末状ポリマーを製造するための装置および方法
CN113075430B (zh) * 2021-03-30 2023-03-31 云谷（固安）科技有限公司 针卡结构和测试设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68902141T2 (de) * 1989-08-16 1993-02-25 Ibm Verfahren fuer die herstellung mikromechanischer messfuehler fuer afm/stm-profilometrie und mikromechanischer messfuehlerkopf.
JPH05299015A (ja) * 1992-04-23 1993-11-12 Olympus Optical Co Ltd 走査型プローブ顕微鏡用カンチレバーの作製方法
US5347226A (en) * 1992-11-16 1994-09-13 National Semiconductor Corporation Array spreading resistance probe (ASRP) method for profile extraction from semiconductor chips of cellular construction
JP4573943B2 (ja) * 2000-04-20 2010-11-04 キヤノン株式会社 光走査光学装置及びそれを用いた画像形成装置
JP4733319B2 (ja) * 2000-09-18 2011-07-27 アイメック プローブチップ構造の製造方法
JP2003121469A (ja) 2001-10-17 2003-04-23 Japan Electronic Materials Corp プローブの製造方法及びプローブカードの製造方法
AU2002353582A1 (en) 2002-02-05 2003-09-02 Oug-Ki Lee Method for manufacturing electric contact element for testing electro device and electric contact element thereby
JP4217468B2 (ja) 2002-12-03 2009-02-04 株式会社アドバンテスト プローブピンの配線基板への接続方法、及びプローブカードの製造方法
KR100523745B1 (ko) * 2003-03-24 2005-10-25 주식회사 유니테스트 전자소자 검사용 마이크로 프로브 및 그 제조 방법
US20040228962A1 (en) * 2003-05-16 2004-11-18 Chang Liu Scanning probe microscopy probe and method for scanning probe contact printing
KR100513662B1 (ko) * 2003-09-08 2005-09-09 엘지전자 주식회사 캔틸레버의 제조방법
JP2006038457A (ja) 2004-07-22 2006-02-09 Toray Eng Co Ltd フィルムプローブの製造方法
JP4155241B2 (ja) 2004-07-30 2008-09-24 ダイキン工業株式会社 給湯装置
KR100586675B1 (ko) 2004-09-22 2006-06-12 주식회사 파이컴 수직형 전기적 접촉체의 제조방법 및 이에 따른 수직형전기적 접촉체
KR100749735B1 (ko) 2006-06-07 2007-08-16 주식회사 파이컴 캔틸레버형 프로브 제조 방법 및 이를 이용한 프로브 카드제조 방법

Also Published As

Publication number Publication date
US8114302B2 (en) 2012-02-14
DE112007001350T5 (de) 2009-04-16
JP2009540291A (ja) 2009-11-19
CN101461050A (zh) 2009-06-17
KR100749735B1 (ko) 2007-08-16
WO2007142413A1 (en) 2007-12-13
TWI326360B (en) 2010-06-21
US20090173712A1 (en) 2009-07-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees