TW200745563A - Method of fabricating cantilever type probe and method of fabricating probe card using the same - Google Patents
Method of fabricating cantilever type probe and method of fabricating probe card using the sameInfo
- Publication number
- TW200745563A TW200745563A TW096118849A TW96118849A TW200745563A TW 200745563 A TW200745563 A TW 200745563A TW 096118849 A TW096118849 A TW 096118849A TW 96118849 A TW96118849 A TW 96118849A TW 200745563 A TW200745563 A TW 200745563A
- Authority
- TW
- Taiwan
- Prior art keywords
- tip portion
- fabricating
- dummy
- cantilever type
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060050717A KR100749735B1 (ko) | 2006-06-07 | 2006-06-07 | 캔틸레버형 프로브 제조 방법 및 이를 이용한 프로브 카드제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200745563A true TW200745563A (en) | 2007-12-16 |
TWI326360B TWI326360B (en) | 2010-06-21 |
Family
ID=38614632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096118849A TWI326360B (en) | 2006-06-07 | 2007-05-25 | Method of fabricating cantilever type probe and method of fabricating probe card using the same |
Country Status (7)
Country | Link |
---|---|
US (1) | US8114302B2 (zh) |
JP (1) | JP2009540291A (zh) |
KR (1) | KR100749735B1 (zh) |
CN (1) | CN101461050A (zh) |
DE (1) | DE112007001350T5 (zh) |
TW (1) | TWI326360B (zh) |
WO (1) | WO2007142413A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI843252B (zh) * | 2022-10-25 | 2024-05-21 | 台灣光罩股份有限公司 | 微機電探針及其製造方法 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100749735B1 (ko) | 2006-06-07 | 2007-08-16 | 주식회사 파이컴 | 캔틸레버형 프로브 제조 방법 및 이를 이용한 프로브 카드제조 방법 |
KR100905429B1 (ko) | 2007-08-16 | 2009-07-02 | (주)미코엠에스티 | 프로브 카드 구조체의 형성 방법 |
US8416247B2 (en) * | 2007-10-09 | 2013-04-09 | Sony Computer Entertaiment America Inc. | Increasing the number of advertising impressions in an interactive environment |
KR20100025900A (ko) * | 2008-08-28 | 2010-03-10 | 삼성전기주식회사 | 프로브 카드 및 그의 제조 방법 |
WO2013059670A2 (en) | 2011-10-21 | 2013-04-25 | Nanoink, Inc. | Octahedral and pyramid-on-post tips for microscopy and lithography |
CN104254781B (zh) * | 2012-03-07 | 2021-10-15 | 爱德万测试公司 | 转移电子探针组件到空间变换器 |
JP6068925B2 (ja) * | 2012-10-23 | 2017-01-25 | 株式会社日本マイクロニクス | プローブの製造方法 |
CN110246850B (zh) * | 2014-07-23 | 2022-12-02 | 索尼公司 | 显示装置 |
KR101667856B1 (ko) * | 2014-12-18 | 2016-10-20 | 한국산업기술대학교산학협력단 | 프로브 팁 제조방법 |
CN104701328B (zh) * | 2015-03-25 | 2017-10-13 | 京东方科技集团股份有限公司 | 一种阵列基板及其制造方法、显示装置 |
US11332550B2 (en) | 2017-03-01 | 2022-05-17 | Basf Se | Device and method for producing powdered polymers |
CN113075430B (zh) * | 2021-03-30 | 2023-03-31 | 云谷(固安)科技有限公司 | 针卡结构和测试设备 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE68902141T2 (de) * | 1989-08-16 | 1993-02-25 | Ibm | Verfahren fuer die herstellung mikromechanischer messfuehler fuer afm/stm-profilometrie und mikromechanischer messfuehlerkopf. |
JPH05299015A (ja) | 1992-04-23 | 1993-11-12 | Olympus Optical Co Ltd | 走査型プローブ顕微鏡用カンチレバーの作製方法 |
US5347226A (en) * | 1992-11-16 | 1994-09-13 | National Semiconductor Corporation | Array spreading resistance probe (ASRP) method for profile extraction from semiconductor chips of cellular construction |
JP4573943B2 (ja) * | 2000-04-20 | 2010-11-04 | キヤノン株式会社 | 光走査光学装置及びそれを用いた画像形成装置 |
JP4733319B2 (ja) * | 2000-09-18 | 2011-07-27 | アイメック | プローブチップ構造の製造方法 |
JP2003121469A (ja) | 2001-10-17 | 2003-04-23 | Japan Electronic Materials Corp | プローブの製造方法及びプローブカードの製造方法 |
JP2005517192A (ja) | 2002-02-05 | 2005-06-09 | ファイコム・コーポレーション | 電子素子検査用の電気的接触体の製造方法及びこれによる電気的接触体 |
JP4217468B2 (ja) | 2002-12-03 | 2009-02-04 | 株式会社アドバンテスト | プローブピンの配線基板への接続方法、及びプローブカードの製造方法 |
KR100523745B1 (ko) * | 2003-03-24 | 2005-10-25 | 주식회사 유니테스트 | 전자소자 검사용 마이크로 프로브 및 그 제조 방법 |
US20040228962A1 (en) * | 2003-05-16 | 2004-11-18 | Chang Liu | Scanning probe microscopy probe and method for scanning probe contact printing |
KR100513662B1 (ko) * | 2003-09-08 | 2005-09-09 | 엘지전자 주식회사 | 캔틸레버의 제조방법 |
JP2006038457A (ja) | 2004-07-22 | 2006-02-09 | Toray Eng Co Ltd | フィルムプローブの製造方法 |
JP4155241B2 (ja) | 2004-07-30 | 2008-09-24 | ダイキン工業株式会社 | 給湯装置 |
KR100586675B1 (ko) * | 2004-09-22 | 2006-06-12 | 주식회사 파이컴 | 수직형 전기적 접촉체의 제조방법 및 이에 따른 수직형전기적 접촉체 |
KR100749735B1 (ko) | 2006-06-07 | 2007-08-16 | 주식회사 파이컴 | 캔틸레버형 프로브 제조 방법 및 이를 이용한 프로브 카드제조 방법 |
-
2006
- 2006-06-07 KR KR1020060050717A patent/KR100749735B1/ko not_active IP Right Cessation
-
2007
- 2007-05-16 WO PCT/KR2007/002390 patent/WO2007142413A1/en active Application Filing
- 2007-05-16 DE DE112007001350T patent/DE112007001350T5/de not_active Withdrawn
- 2007-05-16 CN CNA2007800205739A patent/CN101461050A/zh active Pending
- 2007-05-16 JP JP2009514191A patent/JP2009540291A/ja active Pending
- 2007-05-16 US US12/308,012 patent/US8114302B2/en not_active Expired - Fee Related
- 2007-05-25 TW TW096118849A patent/TWI326360B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI843252B (zh) * | 2022-10-25 | 2024-05-21 | 台灣光罩股份有限公司 | 微機電探針及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101461050A (zh) | 2009-06-17 |
TWI326360B (en) | 2010-06-21 |
KR100749735B1 (ko) | 2007-08-16 |
US20090173712A1 (en) | 2009-07-09 |
US8114302B2 (en) | 2012-02-14 |
DE112007001350T5 (de) | 2009-04-16 |
WO2007142413A1 (en) | 2007-12-13 |
JP2009540291A (ja) | 2009-11-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |