TW200744852A - Screen printing equipment - Google Patents

Screen printing equipment

Info

Publication number
TW200744852A
TW200744852A TW096105542A TW96105542A TW200744852A TW 200744852 A TW200744852 A TW 200744852A TW 096105542 A TW096105542 A TW 096105542A TW 96105542 A TW96105542 A TW 96105542A TW 200744852 A TW200744852 A TW 200744852A
Authority
TW
Taiwan
Prior art keywords
snap
mask
individual
bump electrodes
screen printing
Prior art date
Application number
TW096105542A
Other languages
English (en)
Chinese (zh)
Other versions
TWI316468B (https=
Inventor
Noriaki Mukai
Masafumi Wada
Makoto Homma
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Publication of TW200744852A publication Critical patent/TW200744852A/zh
Application granted granted Critical
Publication of TWI316468B publication Critical patent/TWI316468B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F23/00—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing
    • B41F23/08—Print finishing devices, e.g. for glossing prints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW096105542A 2006-03-28 2007-02-14 Screen printing equipment TW200744852A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006086840A JP4893056B2 (ja) 2006-03-28 2006-03-28 スクリーン印刷装置

Publications (2)

Publication Number Publication Date
TW200744852A true TW200744852A (en) 2007-12-16
TWI316468B TWI316468B (https=) 2009-11-01

Family

ID=38634473

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105542A TW200744852A (en) 2006-03-28 2007-02-14 Screen printing equipment

Country Status (4)

Country Link
JP (1) JP4893056B2 (https=)
KR (1) KR100856101B1 (https=)
CN (1) CN101045360B (https=)
TW (1) TW200744852A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464067B (zh) * 2012-01-20 2014-12-11 Transonic Prec Ind Inc 一次印刷形成不同膜厚之金屬印刷模板

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5270958B2 (ja) * 2008-05-17 2013-08-21 富士機械製造株式会社 スキージ・ペースト離間方法およびスクリーン印刷装置
JP5446131B2 (ja) * 2008-05-28 2014-03-19 株式会社リコー スクリーン版及び複数の個別電極の形成方法
JP2010234799A (ja) * 2009-01-30 2010-10-21 Kobelco Kaken:Kk スクリーン印刷用メッシュ部材
JP2010284898A (ja) * 2009-06-12 2010-12-24 Panasonic Corp スクリーン印刷装置およびスクリーン印刷方法
US9216607B2 (en) * 2011-01-31 2015-12-22 Shin-Etsu Chemical Co., Ltd. Screen printing plate for solar cell and method for printing solar cell electrode
CN102848764A (zh) * 2011-06-29 2013-01-02 群康科技(深圳)有限公司 印版及使用该印版的电路板印刷方法与制造的印刷电路板
WO2014091603A1 (ja) * 2012-12-13 2014-06-19 富士機械製造株式会社 粘性流体印刷装置
JP6840978B2 (ja) * 2015-11-18 2021-03-10 Ａｇｃ株式会社 スクリーン印刷装置、及び印刷層付き基材の製造方法
JP6971579B2 (ja) * 2017-01-27 2021-11-24 株式会社村田製作所 コンタクト印刷用コンビネーションスクリーン版
FR3072610B1 (fr) * 2017-06-16 2022-07-22 Saint Gobain Ecran de serigraphie et procede d'obtention de vitrages munis de motifs electroconducteurs
CN107471814A (zh) * 2017-09-18 2017-12-15 肇庆市格朗自动化科技有限公司 丝网印刷机及丝网印刷系统
EP3482935B1 (de) * 2017-11-10 2022-07-13 Exentis Group AG Siebeinheit für eine druckvorrichtung
US11379639B2 (en) 2018-02-26 2022-07-05 Koh Young Technology Inc. Apparatus and method of generating control parameter of screen printer
CN108925053B (zh) * 2018-06-29 2020-05-22 武汉华星光电半导体显示技术有限公司 柔性线路板及其制作方法
US20220369469A1 (en) * 2019-02-06 2022-11-17 Tanazawa Hakkosha Co., Ltd. Method of manufacturing printed wiring board
ES2988515T3 (es) 2019-04-18 2024-11-20 Exentis Knowledge Gmbh Procedimiento para la fabricación de piezas de trabajo de serigrafía tridimensionales
EP3725524B1 (de) * 2019-04-18 2024-07-31 Exentis Knowledge GmbH Vorrichtung und verfahren zur herstellung von dreidimensionalen siebdruckwerkstücken
PT3725523T (pt) 2019-04-18 2024-05-02 Exentis Knowledge Gmbh Dispositivo e método para a produção de peças serigrafadas tridimensionais
HUE065483T2 (hu) * 2019-04-18 2024-05-28 Exentis Knowledge Gmbh Berendezés és eljárás háromdimenziós szitanyomó munkadarabok elõállítására
CN110600575A (zh) * 2019-08-23 2019-12-20 宁波森联光电科技有限公司 电刷机构和焊带制造装置及其制造方法
CN114290795A (zh) * 2022-01-12 2022-04-08 河源市汇亮鑫光电科技股份有限公司 一种用于手机触摸屏的自动丝印装置
JP7801680B2 (ja) * 2022-03-31 2026-01-19 パナソニックＩｐマネジメント株式会社 印刷装置、マスク印刷方法および半田基板製造方法
CN114987075B (zh) * 2022-06-30 2023-09-01 无锡尚德太阳能电力有限公司 一种太阳能电池丝网印刷工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63106661A (ja) * 1986-10-23 1988-05-11 Mitsubishi Paper Mills Ltd 平版印刷版の修正方法
JP3086066B2 (ja) * 1991-10-29 2000-09-11 富士通株式会社 クリーム状はんだの印刷方法及び電子部品のソルダリング方法
JPH05338112A (ja) * 1992-06-10 1993-12-21 Tokuyama Soda Co Ltd 印刷用マスク
JPH1174638A (ja) 1997-08-29 1999-03-16 Toshiba Corp クリーム半田印刷方法及びメタルマスク
JP2000117932A (ja) * 1998-10-16 2000-04-25 Tani Denki Kogyo Kk スクリーン版と版離れ方法と印刷装置及び印刷物
JP2001062993A (ja) * 1999-08-31 2001-03-13 Minami Kk スクリーン印刷機
JP2001130160A (ja) 1999-11-08 2001-05-15 Matsushita Electric Ind Co Ltd スクリーン印刷方法とその装置及びそれらに用いるスクリーンマスクと回路基板
CN2598749Y (zh) * 2002-12-28 2004-01-14 鸿富锦精密工业（深圳）有限公司 网版印刷用网版

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464067B (zh) * 2012-01-20 2014-12-11 Transonic Prec Ind Inc 一次印刷形成不同膜厚之金屬印刷模板

Also Published As

Publication number Publication date
JP4893056B2 (ja) 2012-03-07
TWI316468B (https=) 2009-11-01
CN101045360A (zh) 2007-10-03
KR20070097304A (ko) 2007-10-04
KR100856101B1 (ko) 2008-09-02
CN101045360B (zh) 2011-08-17
JP2007260993A (ja) 2007-10-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees