TW200744852A - Screen printing equipment - Google Patents

Screen printing equipment

Info

Publication number
TW200744852A
TW200744852A TW096105542A TW96105542A TW200744852A TW 200744852 A TW200744852 A TW 200744852A TW 096105542 A TW096105542 A TW 096105542A TW 96105542 A TW96105542 A TW 96105542A TW 200744852 A TW200744852 A TW 200744852A
Authority
TW
Taiwan
Prior art keywords
snap
mask
individual
bump electrodes
screen printing
Prior art date
Application number
TW096105542A
Other languages
Chinese (zh)
Other versions
TWI316468B (en
Inventor
Noriaki Mukai
Masafumi Wada
Makoto Homma
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Publication of TW200744852A publication Critical patent/TW200744852A/en
Application granted granted Critical
Publication of TWI316468B publication Critical patent/TWI316468B/zh

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Engineering & Computer Science (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

To improve performances of paste filling and snap off, to make a contribution to enabling high-speed, high-yield and stable production of bump electrodes, to enable a user to simply use equipment and to attain stable printing properties, since the snap off begins gradually from the peripheral part of a metal mask and occurs lastly in the central part thereof, owing to the force of adhesion of the paste transferred by a large number of groups of openings to the metal mask, and this phenomenon causes printing faults such as nonuniformity in the thickness of a printed film and a lack in print, in regard to formation of the bump electrodes by a screen printing method. The mask having a connective portion that connects together individual mask pieces corresponding to individual component patterns put on a board to be printed or to individual patterns occupying a prescribed areas, with a different thickness, a different material or a different spring constant from that of the mask pieces, and a snap-off adjusting means being capable of reproducing an optional snap-off curve in conformity to the conditions of connection, are provided for the equipment.
TW096105542A 2006-03-28 2007-02-14 Screen printing equipment TW200744852A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006086840A JP4893056B2 (en) 2006-03-28 2006-03-28 Screen printing device

Publications (2)

Publication Number Publication Date
TW200744852A true TW200744852A (en) 2007-12-16
TWI316468B TWI316468B (en) 2009-11-01

Family

ID=38634473

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105542A TW200744852A (en) 2006-03-28 2007-02-14 Screen printing equipment

Country Status (4)

Country Link
JP (1) JP4893056B2 (en)
KR (1) KR100856101B1 (en)
CN (1) CN101045360B (en)
TW (1) TW200744852A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464067B (en) * 2012-01-20 2014-12-11 Transonic Prec Ind Inc Metal printing stencil for forming different coating thicknesses in single time printing

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5270958B2 (en) * 2008-05-17 2013-08-21 富士機械製造株式会社 Squeegee paste separation method and screen printing apparatus
JP5446131B2 (en) * 2008-05-28 2014-03-19 株式会社リコー Screen plate and method for forming a plurality of individual electrodes
JP2010234799A (en) * 2009-01-30 2010-10-21 Kobelco Kaken:Kk Mesh member for screen printing
JP2010284898A (en) * 2009-06-12 2010-12-24 Panasonic Corp Screen printing apparatus and screen printing method
ES2547680T5 (en) * 2011-01-31 2019-06-26 Shinetsu Chemical Co Silicon plate for solar panel and method to print a solar panel electrode
CN102848764A (en) * 2011-06-29 2013-01-02 群康科技(深圳)有限公司 Forme, circuit board printing method using same and manufactured printed circuit board
JP6087376B2 (en) * 2012-12-13 2017-03-01 富士機械製造株式会社 Viscous fluid printing device
JP6840978B2 (en) * 2015-11-18 2021-03-10 Ａｇｃ株式会社 Manufacturing method for screen printing equipment and base material with printing layer
JP6971579B2 (en) * 2017-01-27 2021-11-24 株式会社村田製作所 Combination screen version for contact printing
FR3072610B1 (en) * 2017-06-16 2022-07-22 Saint Gobain SCREEN PRINTING AND METHOD FOR OBTAINING GLAZING PROVIDED WITH ELECTROCONDUCTIVE PATTERNS
CN107471814A (en) * 2017-09-18 2017-12-15 肇庆市格朗自动化科技有限公司 Screen process press and screen printing system
EP3482935B1 (en) * 2017-11-10 2022-07-13 Exentis Group AG Screen unit for a printing device
EP3530463B1 (en) * 2018-02-26 2024-09-11 Koh Young Technology Inc. Apparatus and method of generating control parameter of screen printer
CN108925053B (en) * 2018-06-29 2020-05-22 武汉华星光电半导体显示技术有限公司 Flexible circuit board and manufacturing method thereof
US20220369469A1 (en) * 2019-02-06 2022-11-17 Tanazawa Hakkosha Co., Ltd. Method of manufacturing printed wiring board
EP3725524B1 (en) * 2019-04-18 2024-07-31 Exentis Knowledge GmbH Device and method for the preparation of three-dimensional screen printing workpieces
HUE065483T2 (en) * 2019-04-18 2024-05-28 Exentis Knowledge Gmbh Device and method for the preparation of three-dimensional screen printing workpieces
CN110600575A (en) * 2019-08-23 2019-12-20 宁波森联光电科技有限公司 Brush mechanism, solder strip manufacturing device and manufacturing method thereof
CN114290795A (en) * 2022-01-12 2022-04-08 河源市汇亮鑫光电科技股份有限公司 Automatic silk screen printing device for mobile phone touch screen
CN114987075B (en) * 2022-06-30 2023-09-01 无锡尚德太阳能电力有限公司 Screen printing process for solar cell

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63106661A (en) * 1986-10-23 1988-05-11 Mitsubishi Paper Mills Ltd Correcting method for planographic printing plate
JP3086066B2 (en) * 1991-10-29 2000-09-11 富士通株式会社 Cream solder printing method and electronic component soldering method
JPH05338112A (en) * 1992-06-10 1993-12-21 Tokuyama Soda Co Ltd Printing mask
JPH1174638A (en) 1997-08-29 1999-03-16 Toshiba Corp Cream solder printing method and metal mask
JP2000117932A (en) * 1998-10-16 2000-04-25 Tani Denki Kogyo Kk Screen printing plate, method for releasing plate, printer and printed matter
JP2001062993A (en) * 1999-08-31 2001-03-13 Minami Kk Screen printer
JP2001130160A (en) 1999-11-08 2001-05-15 Matsushita Electric Ind Co Ltd Method and device for screen printing, screen mask used in the method and device and circuit substrate thereof
CN2598749Y (en) * 2002-12-28 2004-01-14 鸿富锦精密工业（深圳）有限公司 Screen for screen printer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464067B (en) * 2012-01-20 2014-12-11 Transonic Prec Ind Inc Metal printing stencil for forming different coating thicknesses in single time printing

Also Published As

Publication number Publication date
KR100856101B1 (en) 2008-09-02
CN101045360B (en) 2011-08-17
TWI316468B (en) 2009-11-01
JP4893056B2 (en) 2012-03-07
CN101045360A (en) 2007-10-03
KR20070097304A (en) 2007-10-04
JP2007260993A (en) 2007-10-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees