WO2008146611A1 - Ink-receiving base and method for forming conductive pattern by using the same - Google Patents

Ink-receiving base and method for forming conductive pattern by using the same Download PDF

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Publication number
WO2008146611A1
WO2008146611A1 PCT/JP2008/058937 JP2008058937W WO2008146611A1 WO 2008146611 A1 WO2008146611 A1 WO 2008146611A1 JP 2008058937 W JP2008058937 W JP 2008058937W WO 2008146611 A1 WO2008146611 A1 WO 2008146611A1
Authority
WO
WIPO (PCT)
Prior art keywords
ink
conductive pattern
receiving base
base
same
Prior art date
Application number
PCT/JP2008/058937
Other languages
French (fr)
Japanese (ja)
Inventor
Toshimitsu Fujiwara
Yukako Taka
Original Assignee
Konica Minolta Holdings, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Holdings, Inc. filed Critical Konica Minolta Holdings, Inc.
Publication of WO2008146611A1 publication Critical patent/WO2008146611A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/50—Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
    • B41M5/52—Macromolecular coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Abstract

Disclosed is an ink-receiving base which enables to form a conductive pattern having good adhesion between the base and a conductive ink forming the conductive pattern. Also disclosed is a method for forming a conductive pattern by using such an ink-receiving base. Specifically disclosed is an ink-receiving base for forming a conductive pattern by using a conductive ink, which is characterized by comprising a base and an ink-receiving layer formed by applying a latex over a surface of the base on which the conductive ink is received.
PCT/JP2008/058937 2007-05-24 2008-05-15 Ink-receiving base and method for forming conductive pattern by using the same WO2008146611A1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007137598 2007-05-24
JP2007-137598 2007-05-24
JP2007209211 2007-08-10
JP2007-209211 2007-08-10
JP2007-213460 2007-08-20
JP2007213460 2007-08-20

Publications (1)

Publication Number Publication Date
WO2008146611A1 true WO2008146611A1 (en) 2008-12-04

Family

ID=40074877

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058937 WO2008146611A1 (en) 2007-05-24 2008-05-15 Ink-receiving base and method for forming conductive pattern by using the same

Country Status (1)

Country Link
WO (1) WO2008146611A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283194A (en) * 2009-06-05 2010-12-16 Toppan Forms Co Ltd Wiring board, and method for manufacturing the same
JP2012007148A (en) * 2010-05-28 2012-01-12 Seiko Epson Corp Ink set, textile printing method and printed textile
JP2012218318A (en) * 2011-04-11 2012-11-12 Dic Corp Resin composition for forming conductive ink absorbing layer, conductive ink absorbing base material, board for forming circuit, printed matter, conductive pattern, and circuit board
JP2012232434A (en) * 2011-04-28 2012-11-29 Dic Corp Resin composition for forming conductive ink absorbing layer, conductive ink absorbing base material and substrate for forming circuit as well as printed matter, conductive pattern and circuit substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09254521A (en) * 1996-03-19 1997-09-30 Konica Corp Recording sheet for ink-jet
JP2003264356A (en) * 2002-03-12 2003-09-19 Matsushita Electric Ind Co Ltd Destroyable base in fire, heat resistant substrate and method of manufacturing the same, method of manufacturing electronic component using the same base and heat resistant substrate
JP2005096285A (en) * 2003-09-25 2005-04-14 Fuji Photo Film Co Ltd Inkjet recording medium
JP2006165422A (en) * 2004-12-10 2006-06-22 Seiko Epson Corp Electric wiring forming method, wiring board manufacturing method, electro-optical element manufacturing method, electronic device manufacturing method, wiring board, electro-optical element, and electronic device
JP2006253482A (en) * 2005-03-11 2006-09-21 Konica Minolta Holdings Inc Substrate for electrostatic suction ink jet, forming method of pattern and substrate with pattern

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09254521A (en) * 1996-03-19 1997-09-30 Konica Corp Recording sheet for ink-jet
JP2003264356A (en) * 2002-03-12 2003-09-19 Matsushita Electric Ind Co Ltd Destroyable base in fire, heat resistant substrate and method of manufacturing the same, method of manufacturing electronic component using the same base and heat resistant substrate
JP2005096285A (en) * 2003-09-25 2005-04-14 Fuji Photo Film Co Ltd Inkjet recording medium
JP2006165422A (en) * 2004-12-10 2006-06-22 Seiko Epson Corp Electric wiring forming method, wiring board manufacturing method, electro-optical element manufacturing method, electronic device manufacturing method, wiring board, electro-optical element, and electronic device
JP2006253482A (en) * 2005-03-11 2006-09-21 Konica Minolta Holdings Inc Substrate for electrostatic suction ink jet, forming method of pattern and substrate with pattern

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283194A (en) * 2009-06-05 2010-12-16 Toppan Forms Co Ltd Wiring board, and method for manufacturing the same
JP2012007148A (en) * 2010-05-28 2012-01-12 Seiko Epson Corp Ink set, textile printing method and printed textile
JP2012218318A (en) * 2011-04-11 2012-11-12 Dic Corp Resin composition for forming conductive ink absorbing layer, conductive ink absorbing base material, board for forming circuit, printed matter, conductive pattern, and circuit board
JP2012232434A (en) * 2011-04-28 2012-11-29 Dic Corp Resin composition for forming conductive ink absorbing layer, conductive ink absorbing base material and substrate for forming circuit as well as printed matter, conductive pattern and circuit substrate

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