WO2011155808A3 - 프린팅 공정 시뮬레이션 장치 및 방법 - Google Patents

프린팅 공정 시뮬레이션 장치 및 방법 Download PDF

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Publication number
WO2011155808A3
WO2011155808A3 PCT/KR2011/004315 KR2011004315W WO2011155808A3 WO 2011155808 A3 WO2011155808 A3 WO 2011155808A3 KR 2011004315 W KR2011004315 W KR 2011004315W WO 2011155808 A3 WO2011155808 A3 WO 2011155808A3
Authority
WO
WIPO (PCT)
Prior art keywords
printing process
process simulation
adhesion characteristics
present
simulation
Prior art date
Application number
PCT/KR2011/004315
Other languages
English (en)
French (fr)
Other versions
WO2011155808A2 (ko
Inventor
김광섭
김재현
장봉균
이학주
Original Assignee
한국기계연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국기계연구원 filed Critical 한국기계연구원
Publication of WO2011155808A2 publication Critical patent/WO2011155808A2/ko
Publication of WO2011155808A3 publication Critical patent/WO2011155808A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70608—Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

본 발명은 프린팅 공정 시뮬레이션 장치 및 방법에 대한 것으로서, 더 상세하게는 프린팅 공정용 소재 사이의 점착 특성 및 이에 대한 공정 조건의 영향을 자동으로 조사해 주는 프린팅 공정 시뮬레이션 장치 및 방법에 관한 것이다. 본 발명에 의하면, 하중 감지 센서 등을 이용하여 스탬프, 잉크, 모재, 기판 사이의 점착 특성을 자동적으로 계산하는 것이 가능하다.
PCT/KR2011/004315 2010-06-11 2011-06-13 프린팅 공정 시뮬레이션 장치 및 방법 WO2011155808A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100055248A KR101049396B1 (ko) 2010-06-11 2010-06-11 프린팅 공정 시뮬레이션 장치 및 방법
KR10-2010-0055248 2010-06-11

Publications (2)

Publication Number Publication Date
WO2011155808A2 WO2011155808A2 (ko) 2011-12-15
WO2011155808A3 true WO2011155808A3 (ko) 2012-04-19

Family

ID=44923628

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/004315 WO2011155808A2 (ko) 2010-06-11 2011-06-13 프린팅 공정 시뮬레이션 장치 및 방법

Country Status (2)

Country Link
KR (1) KR101049396B1 (ko)
WO (1) WO2011155808A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101640868B1 (ko) 2014-03-28 2016-07-20 한국기계연구원 나노 박막 전사 공정 시뮬레이션 장치 및 방법
CN109916903A (zh) * 2019-04-08 2019-06-21 浙江大学 可延展柔性集成器件转印技术测试表征和转印自动化平台
KR102243303B1 (ko) * 2019-09-25 2021-04-22 한국기계연구원 진공 패드 프린팅 장치 및 이를 이용한 진공 패드 프린팅 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070052505A (ko) * 2005-11-17 2007-05-22 삼성전자주식회사 잉크젯 프린팅 시스템 및 이를 이용한 유기 박막트랜지스터 표시판의 제조 방법
JP2007183641A (ja) * 2006-01-05 2007-07-19 Samsung Electronics Co Ltd インクジェットプリンティングシステム及びこれを用いた製造方法
KR20090109642A (ko) * 2008-04-16 2009-10-21 한국과학기술원 잉크젯 프린팅 시스템 및 그를 이용한 전극 패턴 막의형성방법
JP2010032993A (ja) * 2008-07-25 2010-02-12 Samsung Electronics Co Ltd インクジェットプリンティングシステム及びこれを利用した表示装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4919617B2 (ja) * 2005-05-27 2012-04-18 ヤマハファインテック株式会社 プリント基板の電気検査装置および電気検査方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070052505A (ko) * 2005-11-17 2007-05-22 삼성전자주식회사 잉크젯 프린팅 시스템 및 이를 이용한 유기 박막트랜지스터 표시판의 제조 방법
JP2007183641A (ja) * 2006-01-05 2007-07-19 Samsung Electronics Co Ltd インクジェットプリンティングシステム及びこれを用いた製造方法
KR20090109642A (ko) * 2008-04-16 2009-10-21 한국과학기술원 잉크젯 프린팅 시스템 및 그를 이용한 전극 패턴 막의형성방법
JP2010032993A (ja) * 2008-07-25 2010-02-12 Samsung Electronics Co Ltd インクジェットプリンティングシステム及びこれを利用した表示装置の製造方法

Also Published As

Publication number Publication date
WO2011155808A2 (ko) 2011-12-15
KR101049396B1 (ko) 2011-07-15

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