TW200742505A - Plasma generation apparatus and work process apparatus - Google Patents

Plasma generation apparatus and work process apparatus

Info

Publication number
TW200742505A
TW200742505A TW096102449A TW96102449A TW200742505A TW 200742505 A TW200742505 A TW 200742505A TW 096102449 A TW096102449 A TW 096102449A TW 96102449 A TW96102449 A TW 96102449A TW 200742505 A TW200742505 A TW 200742505A
Authority
TW
Taiwan
Prior art keywords
microwave
plasma generation
work process
generates
main body
Prior art date
Application number
TW096102449A
Other languages
English (en)
Chinese (zh)
Other versions
TWI343764B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Kazuhiro Yoshida
Ryuichi Iwasaki
Hirofumi Mankawa
Original Assignee
Noritsu Koki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritsu Koki Co Ltd filed Critical Noritsu Koki Co Ltd
Publication of TW200742505A publication Critical patent/TW200742505A/zh
Application granted granted Critical
Publication of TWI343764B publication Critical patent/TWI343764B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32229—Waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32311—Circuits specially adapted for controlling the microwave discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
TW096102449A 2006-02-20 2007-01-23 Plasma generation apparatus and work process apparatus TW200742505A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006042197A JP4699235B2 (ja) 2006-02-20 2006-02-20 プラズマ発生装置およびそれを用いるワーク処理装置

Publications (2)

Publication Number Publication Date
TW200742505A true TW200742505A (en) 2007-11-01
TWI343764B TWI343764B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2011-06-11

Family

ID=38426875

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102449A TW200742505A (en) 2006-02-20 2007-01-23 Plasma generation apparatus and work process apparatus

Country Status (5)

Country Link
US (1) US7682482B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP4699235B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR100884663B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN101026920B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW200742505A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7562638B2 (en) * 2005-12-23 2009-07-21 Lam Research Corporation Methods and arrangement for implementing highly efficient plasma traps
JP2009099721A (ja) * 2007-10-16 2009-05-07 Dainippon Screen Mfg Co Ltd 基板冷却方法および基板冷却装置
TW200930158A (en) * 2007-12-25 2009-07-01 Ind Tech Res Inst Jet plasma gun and plasma device using the same
KR20100025249A (ko) * 2008-08-27 2010-03-09 (주)쎄미시스코 공정챔버의 리크 검출 방법
US8808456B2 (en) * 2008-08-29 2014-08-19 Tokyo Electron Limited Film deposition apparatus and substrate process apparatus
US9297072B2 (en) * 2008-12-01 2016-03-29 Tokyo Electron Limited Film deposition apparatus
US8841629B2 (en) * 2012-06-27 2014-09-23 Applied Materials, Inc. Microwave excursion detection for semiconductor processing
US9284210B2 (en) * 2014-03-31 2016-03-15 Corning Incorporated Methods and apparatus for material processing using dual source cyclonic plasma reactor
US10079135B1 (en) * 2018-04-18 2018-09-18 Consolidated Nuclear Security, LLC Gas-sealed stub tuner for microwave systems
JP7043608B2 (ja) * 2018-08-23 2022-03-29 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、基板処理方法及びプログラム
KR20210147031A (ko) * 2019-04-05 2021-12-06 파이로웨이브 인크 마이크로파 열분해 시스템을 위한 커플러
DE112019008000T5 (de) * 2019-12-24 2022-10-27 Fuji Corporation Plasmavorrichtung
CN112844949A (zh) * 2020-12-31 2021-05-28 上海爱声生物医疗科技有限公司 一种医用导管涂层涂覆设备

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378170A (en) * 1976-12-22 1978-07-11 Toshiba Corp Continuous processor for gas plasma etching
CN2064507U (zh) * 1990-03-17 1990-10-24 地方国营宿迁无线电厂 微波泄漏检测器
US5645796A (en) * 1990-08-31 1997-07-08 Abtox, Inc. Process for plasma sterilizing with pulsed antimicrobial agent treatment
FR2691035B1 (fr) * 1992-05-07 1994-06-17 France Telecom Dispositif et machine a plasma de traitement chimique et procede utilisant ce dispositif.
JPH06244140A (ja) * 1992-10-28 1994-09-02 Nec Kyushu Ltd ドライエッチング装置
JPH07135196A (ja) * 1993-06-29 1995-05-23 Nec Kyushu Ltd 半導体基板アッシング装置
JP3137810B2 (ja) * 1993-07-29 2001-02-26 キヤノン株式会社 マイクロ波プラズマ放電停止検知方法、マイクロ波プラズマ処理方法及びマイクロ波プラズマ処理装置
JP4044397B2 (ja) 2001-10-15 2008-02-06 積水化学工業株式会社 プラズマ表面処理装置
JP3977114B2 (ja) * 2002-03-25 2007-09-19 株式会社ルネサステクノロジ プラズマ処理装置
US20060057016A1 (en) * 2002-05-08 2006-03-16 Devendra Kumar Plasma-assisted sintering
AU2003230267A1 (en) * 2002-05-08 2003-11-11 Dana Corporation Plasma-assisted enhanced coating
US6769288B2 (en) * 2002-11-01 2004-08-03 Peak Sensor Systems Llc Method and assembly for detecting a leak in a plasma system
JP4233348B2 (ja) * 2003-02-24 2009-03-04 シャープ株式会社 プラズマプロセス装置
CN2704179Y (zh) 2004-05-14 2005-06-08 徐仁本 微波炉安全防护罩
US7164095B2 (en) * 2004-07-07 2007-01-16 Noritsu Koki Co., Ltd. Microwave plasma nozzle with enhanced plume stability and heating efficiency
US7806077B2 (en) 2004-07-30 2010-10-05 Amarante Technologies, Inc. Plasma nozzle array for providing uniform scalable microwave plasma generation
US20060021980A1 (en) 2004-07-30 2006-02-02 Lee Sang H System and method for controlling a power distribution within a microwave cavity
CN100456898C (zh) * 2004-11-11 2009-01-28 南开大学 具有在线实时显示微波泄漏的微波协助化学反应谐振腔
JP4022590B2 (ja) * 2005-03-25 2007-12-19 株式会社エーイーティー マイクロ波プラズマ発生装置

Also Published As

Publication number Publication date
US7682482B2 (en) 2010-03-23
CN101026920B (zh) 2010-10-06
JP2007220586A (ja) 2007-08-30
KR20070083176A (ko) 2007-08-23
US20070193516A1 (en) 2007-08-23
CN101026920A (zh) 2007-08-29
JP4699235B2 (ja) 2011-06-08
KR100884663B1 (ko) 2009-02-18
TWI343764B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2011-06-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees