TW200742008A - A packaging structure of flip chip camera module and its packaging method - Google Patents

A packaging structure of flip chip camera module and its packaging method

Info

Publication number
TW200742008A
TW200742008A TW095115277A TW95115277A TW200742008A TW 200742008 A TW200742008 A TW 200742008A TW 095115277 A TW095115277 A TW 095115277A TW 95115277 A TW95115277 A TW 95115277A TW 200742008 A TW200742008 A TW 200742008A
Authority
TW
Taiwan
Prior art keywords
conductive layer
camera module
flip chip
dam
packaging structure
Prior art date
Application number
TW095115277A
Other languages
English (en)
Inventor
Yu-Te Hsieh
Original Assignee
Optronics Technology Inc A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optronics Technology Inc A filed Critical Optronics Technology Inc A
Priority to TW095115277A priority Critical patent/TW200742008A/zh
Publication of TW200742008A publication Critical patent/TW200742008A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
TW095115277A 2006-04-28 2006-04-28 A packaging structure of flip chip camera module and its packaging method TW200742008A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095115277A TW200742008A (en) 2006-04-28 2006-04-28 A packaging structure of flip chip camera module and its packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095115277A TW200742008A (en) 2006-04-28 2006-04-28 A packaging structure of flip chip camera module and its packaging method

Publications (1)

Publication Number Publication Date
TW200742008A true TW200742008A (en) 2007-11-01

Family

ID=57914083

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115277A TW200742008A (en) 2006-04-28 2006-04-28 A packaging structure of flip chip camera module and its packaging method

Country Status (1)

Country Link
TW (1) TW200742008A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103716514A (zh) * 2012-09-28 2014-04-09 百辰光电股份有限公司 图像模块及其制造方法
CN104425477A (zh) * 2013-08-29 2015-03-18 矽格股份有限公司 光学传感器封装装置
TWI479644B (zh) * 2009-04-10 2015-04-01 Hynix Semiconductor Inc 影像感應模組

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479644B (zh) * 2009-04-10 2015-04-01 Hynix Semiconductor Inc 影像感應模組
CN103716514A (zh) * 2012-09-28 2014-04-09 百辰光电股份有限公司 图像模块及其制造方法
CN104425477A (zh) * 2013-08-29 2015-03-18 矽格股份有限公司 光学传感器封装装置

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