TW200741934A - Wafer-shaped measuring apparatus and method for manufacturing the same - Google Patents
Wafer-shaped measuring apparatus and method for manufacturing the sameInfo
- Publication number
- TW200741934A TW200741934A TW096109151A TW96109151A TW200741934A TW 200741934 A TW200741934 A TW 200741934A TW 096109151 A TW096109151 A TW 096109151A TW 96109151 A TW96109151 A TW 96109151A TW 200741934 A TW200741934 A TW 200741934A
- Authority
- TW
- Taiwan
- Prior art keywords
- bonding layer
- measuring apparatus
- temperature measuring
- manufacturing
- wafer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006073052 | 2006-03-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200741934A true TW200741934A (en) | 2007-11-01 |
TWI331785B TWI331785B (zh) | 2010-10-11 |
Family
ID=38609155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096109151A TW200741934A (en) | 2006-03-16 | 2007-03-16 | Wafer-shaped measuring apparatus and method for manufacturing the same |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090085031A1 (zh) |
JP (1) | JP4896963B2 (zh) |
TW (1) | TW200741934A (zh) |
WO (1) | WO2007119359A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111742203A (zh) * | 2018-03-15 | 2020-10-02 | 贺利氏先进传感器技术有限公司 | 温度传感器元件 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE602007002805D1 (de) * | 2006-04-20 | 2009-11-26 | Nxp Bv | Verfahren und vorrichtung zur bestimmung der temperatur eines halbleitersubstrats |
JP2010519768A (ja) * | 2007-02-23 | 2010-06-03 | ケーエルエー−テンカー・コーポレーション | プロセス条件測定デバイス |
JP5476114B2 (ja) * | 2009-12-18 | 2014-04-23 | 東京エレクトロン株式会社 | 温度測定用装置 |
JP5314664B2 (ja) * | 2010-12-24 | 2013-10-16 | 東京エレクトロン株式会社 | 物理量計測装置及び物理量計測方法 |
CN104105960B (zh) * | 2011-12-23 | 2018-01-12 | 赛诺菲-安万特德国有限公司 | 用于药剂的包装物的传感器装置 |
WO2014136484A1 (ja) * | 2013-03-07 | 2014-09-12 | 住友ベークライト株式会社 | 装置、接着剤用組成物、接着シート |
CN103258772B (zh) * | 2013-05-02 | 2016-02-10 | 苏州日月新半导体有限公司 | 打线工艺的加热座及加热装置 |
JP6094392B2 (ja) * | 2013-06-11 | 2017-03-15 | 株式会社デンソー | 半導体装置 |
NL2016982A (en) | 2015-07-16 | 2017-01-19 | Asml Netherlands Bv | An Inspection Substrate and an Inspection Method |
KR102119757B1 (ko) * | 2018-08-22 | 2020-06-08 | 한국표준과학연구원 | 다층 저항-열전식 온도측정 웨이퍼 센서 및 그 제조 방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1018844B (zh) * | 1990-06-02 | 1992-10-28 | 中国科学院兰州化学物理研究所 | 防锈干膜润滑剂 |
US5141334A (en) * | 1991-09-24 | 1992-08-25 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Sub-kelvin resistance thermometer |
JP2839418B2 (ja) * | 1992-10-29 | 1998-12-16 | 京セラ株式会社 | 温度センサ |
JPH09166501A (ja) * | 1995-12-13 | 1997-06-24 | Oki Electric Ind Co Ltd | 温度測定装置及び温度測定方法 |
JPH109963A (ja) * | 1996-06-19 | 1998-01-16 | Yamari Sangyo Kk | 測温抵抗体素子によるシリコンウェハー等の温度計測構造 |
US6744346B1 (en) * | 1998-02-27 | 2004-06-01 | Micron Technology, Inc. | Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece |
JP2001289715A (ja) * | 2000-04-05 | 2001-10-19 | Yamari Sangyo Kk | 測温基板 |
JP2002202204A (ja) * | 2000-12-28 | 2002-07-19 | Sensarray Japan Corp | 温度計測用球状半導体デバイス |
JP4486289B2 (ja) * | 2001-03-30 | 2010-06-23 | 株式会社デンソー | フローセンサ及びその製造方法 |
US6919730B2 (en) * | 2002-03-18 | 2005-07-19 | Honeywell International, Inc. | Carbon nanotube sensor |
US6870270B2 (en) * | 2002-12-28 | 2005-03-22 | Intel Corporation | Method and structure for interfacing electronic devices |
JP2005340291A (ja) * | 2004-05-24 | 2005-12-08 | Komatsu Ltd | 基板熱状態測定装置及び基板熱状態分析制御方法 |
-
2007
- 2007-03-14 US US12/224,280 patent/US20090085031A1/en not_active Abandoned
- 2007-03-14 JP JP2008510776A patent/JP4896963B2/ja not_active Expired - Fee Related
- 2007-03-14 WO PCT/JP2007/055084 patent/WO2007119359A1/ja active Application Filing
- 2007-03-16 TW TW096109151A patent/TW200741934A/zh not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111742203A (zh) * | 2018-03-15 | 2020-10-02 | 贺利氏先进传感器技术有限公司 | 温度传感器元件 |
TWI729361B (zh) * | 2018-03-15 | 2021-06-01 | 德商賀利氏先進傳感器技術有限公司 | 溫度感測器元件及其輸送系統和生產方法 |
CN111742203B (zh) * | 2018-03-15 | 2023-03-10 | 贺利氏先进传感器技术有限公司 | 温度传感器元件 |
Also Published As
Publication number | Publication date |
---|---|
JP4896963B2 (ja) | 2012-03-14 |
TWI331785B (zh) | 2010-10-11 |
US20090085031A1 (en) | 2009-04-02 |
WO2007119359A1 (ja) | 2007-10-25 |
JPWO2007119359A1 (ja) | 2009-08-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |