TW200739677A - Replacement method for treatment mechanism in treatment apparatus, and computer readable memory medium storing replacement program thereof - Google Patents

Replacement method for treatment mechanism in treatment apparatus, and computer readable memory medium storing replacement program thereof

Info

Publication number
TW200739677A
TW200739677A TW096104117A TW96104117A TW200739677A TW 200739677 A TW200739677 A TW 200739677A TW 096104117 A TW096104117 A TW 096104117A TW 96104117 A TW96104117 A TW 96104117A TW 200739677 A TW200739677 A TW 200739677A
Authority
TW
Taiwan
Prior art keywords
process instrument
replacement
computer readable
processing unit
medium storing
Prior art date
Application number
TW096104117A
Other languages
English (en)
Other versions
TWI332233B (zh
Inventor
Naoyuki Tajiri
Akifumi Suzuki
Daisuke Honma
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200739677A publication Critical patent/TW200739677A/zh
Application granted granted Critical
Publication of TWI332233B publication Critical patent/TWI332233B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49721—Repairing with disassembling
    • Y10T29/4973—Replacing of defective part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T483/00—Tool changing
    • Y10T483/10—Process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T483/00—Tool changing
    • Y10T483/11—Tool changing with safety means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T483/00—Tool changing
    • Y10T483/11—Tool changing with safety means
    • Y10T483/115—Guard
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T483/00—Tool changing
    • Y10T483/12—Tool changing with means to regulate operation by means of replaceable information supply [e.g., templet, tape, card, etc. ]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T483/00—Tool changing
    • Y10T483/14—Tool changing with signal or indicator

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096104117A 2006-02-06 2007-02-05 Replacement method for treatment mechanism in treatment apparatus, and computer readable memory medium storing replacement program thereof TW200739677A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006028379A JP4513102B2 (ja) 2006-02-06 2006-02-06 処理装置における処理器具の交換方法及び交換用プログラム

Publications (2)

Publication Number Publication Date
TW200739677A true TW200739677A (en) 2007-10-16
TWI332233B TWI332233B (zh) 2010-10-21

Family

ID=38334176

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096104117A TW200739677A (en) 2006-02-06 2007-02-05 Replacement method for treatment mechanism in treatment apparatus, and computer readable memory medium storing replacement program thereof

Country Status (5)

Country Link
US (2) US7815558B2 (zh)
JP (1) JP4513102B2 (zh)
KR (1) KR101277420B1 (zh)
CN (1) CN100541710C (zh)
TW (1) TW200739677A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4513102B2 (ja) * 2006-02-06 2010-07-28 東京エレクトロン株式会社 処理装置における処理器具の交換方法及び交換用プログラム
JP4994874B2 (ja) * 2007-02-07 2012-08-08 キヤノン株式会社 処理装置
WO2010032499A1 (ja) * 2008-09-18 2010-03-25 株式会社日立国際電気 基板処理装置
US8317450B2 (en) * 2008-10-30 2012-11-27 Lam Research Corporation Tactile wafer lifter and methods for operating the same
AT509708B1 (de) * 2010-09-02 2011-11-15 Trumpf Maschinen Austria Gmbh Werkzeugmagazin für einen manipulator
US9530676B2 (en) * 2011-06-01 2016-12-27 Ebara Corporation Substrate processing apparatus, substrate transfer method and substrate transfer device
US10224598B2 (en) * 2014-04-01 2019-03-05 Intel Corporation High-frequency rotor antenna
JP6956147B2 (ja) 2019-07-23 2021-10-27 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置およびプログラム

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW276353B (zh) * 1993-07-15 1996-05-21 Hitachi Seisakusyo Kk
JP3589548B2 (ja) * 1997-04-23 2004-11-17 三菱電機株式会社 放電加工装置
JP2000164480A (ja) * 1998-11-24 2000-06-16 Canon Inc 半導体製造装置およびデバイス製造方法
JP3730810B2 (ja) * 1999-07-09 2006-01-05 東京エレクトロン株式会社 容器の移動装置および方法
JP3913420B2 (ja) * 1999-10-26 2007-05-09 東京エレクトロン株式会社 基板処理装置およびそのメンテナンス方法
EP1116548A3 (en) * 2000-01-17 2002-04-17 Toyoda Koki Kabushiki Kaisha A machine tool having a vertical main spindle and a method of making the same
JP4780257B2 (ja) * 2000-02-03 2011-09-28 日清紡ホールディングス株式会社 燃料電池セパレータ及びその製造方法
JP2001345241A (ja) * 2000-05-31 2001-12-14 Tokyo Electron Ltd 基板処理システム及び基板処理方法
JP2002208622A (ja) * 2001-01-12 2002-07-26 Tokyo Electron Ltd 縦型熱処理装置
JP4012126B2 (ja) * 2003-07-10 2007-11-21 株式会社東芝 製造装置の異常検出システム、製造装置の異常検出方法及び製造装置の異常検出プログラム
JP4462912B2 (ja) * 2003-12-10 2010-05-12 大日本スクリーン製造株式会社 基板処理装置および基板処理装置の管理方法
JP4252935B2 (ja) * 2004-06-22 2009-04-08 東京エレクトロン株式会社 基板処理装置
US7692764B2 (en) * 2004-08-30 2010-04-06 Nikon Corporation Exposure apparatus, operation decision method, substrate processing system, maintenance management method, and device manufacturing method
JP4513102B2 (ja) * 2006-02-06 2010-07-28 東京エレクトロン株式会社 処理装置における処理器具の交換方法及び交換用プログラム
US20080032502A1 (en) * 2006-08-01 2008-02-07 Asm America, Inc. Safety features for semiconductor processing apparatus using pyrophoric precursor

Also Published As

Publication number Publication date
US7815558B2 (en) 2010-10-19
US20070183774A1 (en) 2007-08-09
KR20070080228A (ko) 2007-08-09
US20110005052A1 (en) 2011-01-13
TWI332233B (zh) 2010-10-21
CN101017770A (zh) 2007-08-15
JP2007208182A (ja) 2007-08-16
CN100541710C (zh) 2009-09-16
KR101277420B1 (ko) 2013-06-20
US8043200B2 (en) 2011-10-25
JP4513102B2 (ja) 2010-07-28

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