TW200739078A - Moving apparatus and electronic component testing apparatus - Google Patents

Moving apparatus and electronic component testing apparatus

Info

Publication number
TW200739078A
TW200739078A TW096106668A TW96106668A TW200739078A TW 200739078 A TW200739078 A TW 200739078A TW 096106668 A TW096106668 A TW 096106668A TW 96106668 A TW96106668 A TW 96106668A TW 200739078 A TW200739078 A TW 200739078A
Authority
TW
Taiwan
Prior art keywords
piston
hollow chamber
electronic component
component testing
testing apparatus
Prior art date
Application number
TW096106668A
Other languages
English (en)
Inventor
Kenichi Shimada
Yoshiyuki Masuo
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200739078A publication Critical patent/TW200739078A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Specific Conveyance Elements (AREA)
TW096106668A 2006-03-02 2007-02-27 Moving apparatus and electronic component testing apparatus TW200739078A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006056712 2006-03-02

Publications (1)

Publication Number Publication Date
TW200739078A true TW200739078A (en) 2007-10-16

Family

ID=38509271

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096106668A TW200739078A (en) 2006-03-02 2007-02-27 Moving apparatus and electronic component testing apparatus

Country Status (6)

Country Link
US (1) US20090189631A1 (zh)
JP (1) JP5202297B2 (zh)
KR (1) KR20080099335A (zh)
CN (1) CN101395487A (zh)
TW (1) TW200739078A (zh)
WO (1) WO2007105435A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398638B (zh) * 2008-02-21 2013-06-11 Advantest Corp A method of removing the electronic component, and a control program for carrying out the method
TWI737060B (zh) * 2018-12-11 2021-08-21 韓商泰克元股份有限公司 電子部件測試用分選機
TWI783652B (zh) * 2019-06-19 2022-11-11 韓商泰克元股份有限公司 測試板及測試腔室

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011038297A1 (en) 2009-09-26 2011-03-31 Centipede Systems, Inc. Apparatus for holding microelectronic devices
JP2011163807A (ja) 2010-02-05 2011-08-25 Advantest Corp 電子部品試験装置
DE202010016048U1 (de) 2010-06-15 2011-03-10 Huhtamaki Forchheim Zweigniederlassung Der Huhtamaki Deutschland Gmbh & Co. Kg UV-Strahlung durchlässige Mehrschichtfolie
CN101885420B (zh) * 2010-07-20 2012-05-30 格兰达技术（深圳）有限公司 一种托盘装料方法及振动式托盘装料机
JP6351623B2 (ja) * 2013-12-03 2018-07-04 株式会社ハッピージャパン 電子デバイスのハンドラ
WO2015083240A1 (ja) * 2013-12-03 2015-06-11 東北精機工業株式会社 Ｉｃハンドラ
CN105083982A (zh) * 2015-08-26 2015-11-25 苏州金牛精密机械有限公司 一种基于单动力源实现自动移料的机构
WO2017073121A1 (ja) * 2015-10-28 2017-05-04 三井金属鉱業株式会社 プリント配線板の製造方法
TWI637889B (zh) * 2016-06-15 2018-10-11 萬潤科技股份有限公司 貼合製程之元件搬送方法及裝置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5708222A (en) * 1994-08-01 1998-01-13 Tokyo Electron Limited Inspection apparatus, transportation apparatus, and temperature control apparatus
KR0144230B1 (ko) * 1995-04-06 1998-08-17 김주용 웨이퍼 테스트용 프로브 스테이션의 프로브 카드 고정장치
US6166555A (en) * 1996-10-15 2000-12-26 Reliability Inc. Apparatus and method for seating and/or unseating printed circuit boards in a chamber
DE19740029C2 (de) * 1997-09-11 1999-07-15 Stabilus Gmbh Aktives Stellsystem
KR100292612B1 (ko) * 1997-12-08 2001-08-07 윤종용 반도체 웨이퍼 정렬시스템 및 이를 이용하는 웨이퍼 정렬방법
US6551122B2 (en) * 2000-10-04 2003-04-22 Teradyne, Inc. Low profile pneumatically actuated docking module with power fault release
JP3941914B2 (ja) * 2001-03-12 2007-07-11 日立ビアメカニクス株式会社 ワーク加工装置
US7919974B2 (en) * 2004-07-23 2011-04-05 Advantest Corporation Electronic device test apparatus and method of configuring electronic device test apparatus
WO2007094034A1 (ja) * 2006-02-13 2007-08-23 Advantest Corporation コンタクトプッシャ、コンタクトアーム及び電子部品試験装置
US7405582B2 (en) * 2006-06-01 2008-07-29 Advantest Corporation Measurement board for electronic device test apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398638B (zh) * 2008-02-21 2013-06-11 Advantest Corp A method of removing the electronic component, and a control program for carrying out the method
TWI737060B (zh) * 2018-12-11 2021-08-21 韓商泰克元股份有限公司 電子部件測試用分選機
TWI783652B (zh) * 2019-06-19 2022-11-11 韓商泰克元股份有限公司 測試板及測試腔室

Also Published As

Publication number Publication date
KR20080099335A (ko) 2008-11-12
JPWO2007105435A1 (ja) 2009-07-30
US20090189631A1 (en) 2009-07-30
WO2007105435A1 (ja) 2007-09-20
JP5202297B2 (ja) 2013-06-05
CN101395487A (zh) 2009-03-25

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