TW200736327A - Antiblocking photocurable resin composition, antiblocking structure comprising substrate and antiblocking photocurable resin composition applied and cured thereon, and production method thereof - Google Patents

Antiblocking photocurable resin composition, antiblocking structure comprising substrate and antiblocking photocurable resin composition applied and cured thereon, and production method thereof

Info

Publication number
TW200736327A
TW200736327A TW096100919A TW96100919A TW200736327A TW 200736327 A TW200736327 A TW 200736327A TW 096100919 A TW096100919 A TW 096100919A TW 96100919 A TW96100919 A TW 96100919A TW 200736327 A TW200736327 A TW 200736327A
Authority
TW
Taiwan
Prior art keywords
antiblocking
resin composition
photocurable resin
cured
substrate
Prior art date
Application number
TW096100919A
Other languages
English (en)
Inventor
Seiji Yamamichi
Hiromasa Minamino
Koichi Ueda
Original Assignee
Nippon Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Paint Co Ltd filed Critical Nippon Paint Co Ltd
Publication of TW200736327A publication Critical patent/TW200736327A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
TW096100919A 2006-01-10 2007-01-10 Antiblocking photocurable resin composition, antiblocking structure comprising substrate and antiblocking photocurable resin composition applied and cured thereon, and production method thereof TW200736327A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006002480A JP2007182519A (ja) 2006-01-10 2006-01-10 アンチブロッキング性光硬化性樹脂組成物、それを基材上に被覆硬化したアンチブロッキング性構造体およびその製法

Publications (1)

Publication Number Publication Date
TW200736327A true TW200736327A (en) 2007-10-01

Family

ID=38338877

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096100919A TW200736327A (en) 2006-01-10 2007-01-10 Antiblocking photocurable resin composition, antiblocking structure comprising substrate and antiblocking photocurable resin composition applied and cured thereon, and production method thereof

Country Status (4)

Country Link
JP (1) JP2007182519A (zh)
KR (1) KR20070075327A (zh)
CN (1) CN101037526A (zh)
TW (1) TW200736327A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8367768B2 (en) 2008-12-16 2013-02-05 Industrial Technology Research Institute Encapsulant compositions and method for fabricating encapsulant materials
TWI453767B (zh) * 2007-10-26 2014-09-21 Teijin Ltd Transparent conductive laminates and touch panels
TWI627061B (zh) * 2012-06-21 2018-06-21 迪愛生股份有限公司 活性能量線硬化型樹脂組成物、活性能量線硬化型樹脂組成物之製造方法、塗料、塗膜及薄膜

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2009128414A1 (ja) * 2008-04-14 2011-08-04 昭和電工株式会社 透明複合材料及びその製造方法
KR20150126980A (ko) 2008-12-26 2015-11-13 데이진 가부시키가이샤 투명 도전성 적층체 및 투명 터치 패널
JP5980465B2 (ja) * 2009-08-26 2016-08-31 コニカミノルタ株式会社 偏光板及びそれを用いた液晶表示装置
JP5700777B2 (ja) * 2009-11-18 2015-04-15 恵和株式会社 光学シート及びこれを用いたバックライトユニット
JP5755429B2 (ja) * 2009-11-18 2015-07-29 恵和株式会社 光学シート及びこれを用いたバックライトユニット
CN102073078B (zh) * 2009-11-18 2013-10-16 惠和株式会社 光学薄片以及使用它的背光单元
JP6110051B2 (ja) * 2009-11-18 2017-04-05 恵和株式会社 光学シート及びこれを用いたバックライトユニット
US8617778B2 (en) 2009-12-28 2013-12-31 Ricoh Company, Ltd. Image bearing member, image forming apparatus, and process cartridge
JP5502038B2 (ja) * 2010-08-12 2014-05-28 エルジー ケム． エルティーディ． 熱硬化性保護膜樹脂組成物
US8962741B2 (en) 2010-08-12 2015-02-24 Lg Chem, Ltd. Thermally curable resin composition for protective film
WO2012026446A1 (ja) * 2010-08-27 2012-03-01 大日本印刷株式会社 光学積層体、偏光板及び画像表示装置
JP5598308B2 (ja) * 2010-12-21 2014-10-01 コニカミノルタ株式会社 反射防止フィルムの製造方法
CN104204013B (zh) * 2012-03-30 2017-06-30 三菱化学株式会社 活性能量射线固化性树脂组合物、层积体和卷状层积体
JP6040828B2 (ja) * 2013-03-26 2016-12-07 住友大阪セメント株式会社 ハードコート膜形成用塗料、ハードコート膜形成用塗料の製造方法、ハードコート膜及びそれを備えたプラスチック基材、並びにタッチパネル
JP6656799B2 (ja) 2013-11-29 2020-03-04 王子ホールディングス株式会社 アンチニュートンリング積層体およびそのアンチニュートンリング積層体を用いた静電容量式タッチパネル
JP6367577B2 (ja) * 2014-02-28 2018-08-01 ソマール株式会社 ハードコート膜用コーティング組成物
JP2016121206A (ja) * 2014-12-24 2016-07-07 Dic株式会社 活性エネルギー線硬化性樹脂組成物、これを含有する塗料、その塗膜、及び該塗膜を有する積層フィルム
WO2018084052A1 (ja) * 2016-11-01 2018-05-11 アルプス電気株式会社 光学パネルおよびその製造方法ならびに機器
JP6778716B2 (ja) * 2018-07-05 2020-11-04 ソマール株式会社 ハードコート膜

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4377578B2 (ja) * 2001-12-17 2009-12-02 ダイセル化学工業株式会社 防眩性フィルム、それを用いた光学部材及び液晶表示装置
JP2004042653A (ja) * 2002-07-12 2004-02-12 Nitto Denko Corp ハードコートフィルム
JP4737915B2 (ja) * 2002-10-30 2011-08-03 株式会社きもと タッチパネルの製造方法及びタッチパネル
JP3998697B2 (ja) * 2004-01-29 2007-10-31 日本ペイント株式会社 防眩性コーティング組成物、防眩フィルムおよびその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI453767B (zh) * 2007-10-26 2014-09-21 Teijin Ltd Transparent conductive laminates and touch panels
US8367768B2 (en) 2008-12-16 2013-02-05 Industrial Technology Research Institute Encapsulant compositions and method for fabricating encapsulant materials
TWI422632B (zh) * 2008-12-16 2014-01-11 Ind Tech Res Inst 封裝材料之製造方法
TWI627061B (zh) * 2012-06-21 2018-06-21 迪愛生股份有限公司 活性能量線硬化型樹脂組成物、活性能量線硬化型樹脂組成物之製造方法、塗料、塗膜及薄膜

Also Published As

Publication number Publication date
KR20070075327A (ko) 2007-07-18
JP2007182519A (ja) 2007-07-19
CN101037526A (zh) 2007-09-19

Similar Documents

Publication Publication Date Title
TW200736327A (en) Antiblocking photocurable resin composition, antiblocking structure comprising substrate and antiblocking photocurable resin composition applied and cured thereon, and production method thereof
KR101382039B1 (ko) 입체 패턴을 포함하는 인테리어 필름 및 이를 제조하는 방법
KR100800971B1 (ko) 향상된 치수안정성의 광학용 용융압출 플라스틱 시트 및이를 포함하고 있는 액정 디바이스 윈도우
TW200700488A (en) Composite films suitable for use in opto-electronic and electronic devices
TWI644794B (zh) Method for manufacturing double-sided adhesive sheet for image display device
WO2005091949A3 (en) Metallization process and product produced thereby
EP1953183A3 (en) Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film
WO2009070643A3 (en) Hardcoat films for graphic substrates
TW200734430A (en) Release film and process for producing the film
EP2842763A3 (en) Image formation method, decorative sheet, decorative sheet molding, process for producing in-mold molded product, in-mold molded product, and ink set
WO2006083284A3 (en) A material composition for nano- and micro-lithography
TW200721524A (en) Method of releasing high temperature films and/or devices from metallic substrates
WO2008057643A3 (en) Metal coordinating and film-forming materials
WO2008105503A1 (ja) 撥水性領域のパターンを有する処理基材、その製造方法、および機能性材料の膜からなるパターンが形成された部材の製造方法
TW200801149A (en) Binder composition for polyester film and optical film using the same
EP2517878A4 (en) HARDENED SUBSTRATE WITH HARD COATING AND METHOD OF MANUFACTURING THEREOF
TW200609111A (en) Composition for hard coat, surface protecting film, and optical disc
WO2009056723A3 (fr) Procede de fabrication de stratifie polymere comportant une etape d'activation par traitement plasma
CN113322022B (zh) 用于3d曲面屏的uv光定型柔性保护膜及制备工艺
DE60335452D1 (de) Verfahren zur erzeugung eines films unter verwendung von elektrostatischen kräften
CN111372766A (zh) 脱模膜和层叠体的制造方法
DE50301504D1 (de) Kunststofffolie mit mehrschicht-interferenzbeschichtung
ATE554460T1 (de) Gespritzter gegenstand aus kunststoff und verfahren zu dessen herstellung
WO2006039647A3 (en) Low bake, low voc conductive primer
US20120037016A1 (en) Light guide plate and manufacturing method thereof