TW200735138A - Multi-layer inductive element for integrated circuit - Google Patents

Multi-layer inductive element for integrated circuit

Info

Publication number
TW200735138A
TW200735138A TW095136598A TW95136598A TW200735138A TW 200735138 A TW200735138 A TW 200735138A TW 095136598 A TW095136598 A TW 095136598A TW 95136598 A TW95136598 A TW 95136598A TW 200735138 A TW200735138 A TW 200735138A
Authority
TW
Taiwan
Prior art keywords
ferromagnetic
inductive element
adjacent non
conducting segments
metal layer
Prior art date
Application number
TW095136598A
Other languages
English (en)
Inventor
Alma Anderson
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200735138A publication Critical patent/TW200735138A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
TW095136598A 2005-10-05 2006-10-02 Multi-layer inductive element for integrated circuit TW200735138A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US72424605P 2005-10-05 2005-10-05

Publications (1)

Publication Number Publication Date
TW200735138A true TW200735138A (en) 2007-09-16

Family

ID=37726901

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136598A TW200735138A (en) 2005-10-05 2006-10-02 Multi-layer inductive element for integrated circuit

Country Status (6)

Country Link
US (1) US20080252407A1 (zh)
EP (1) EP1934993A1 (zh)
JP (1) JP2009512183A (zh)
CN (1) CN101322201A (zh)
TW (1) TW200735138A (zh)
WO (1) WO2007039878A1 (zh)

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US8344478B2 (en) * 2009-10-23 2013-01-01 Maxim Integrated Products, Inc. Inductors having inductor axis parallel to substrate surface
US8093982B2 (en) 2010-03-25 2012-01-10 Qualcomm Incorporated Three dimensional inductor and transformer design methodology of glass technology
US8354325B1 (en) 2011-06-29 2013-01-15 Freescale Semiconductor, Inc. Method for forming a toroidal inductor in a semiconductor substrate
US8347490B1 (en) * 2011-06-30 2013-01-08 Chipbond Technology Corporation Method for fabricating a carrier with a three dimensional inductor
US8432017B2 (en) * 2011-09-28 2013-04-30 Chipbond Technology Corporation Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof
US9673268B2 (en) 2011-12-29 2017-06-06 Intel Corporation Integrated inductor for integrated circuit devices
US8803648B2 (en) 2012-05-03 2014-08-12 Qualcomm Mems Technologies, Inc. Three-dimensional multilayer solenoid transformer
DE102012216101B4 (de) * 2012-09-12 2016-03-24 Festo Ag & Co. Kg Verfahren zum Herstellen einer in einem Substrat integrierten Spule, Verfahren zur Herstellung einer mehrschichtigen Leiterplatte und elektronisches Gerät
US20140104284A1 (en) * 2012-10-16 2014-04-17 Qualcomm Mems Technologies, Inc. Through substrate via inductors
DE102012220022B4 (de) 2012-11-02 2014-09-25 Festo Ag & Co. Kg Verfahren zur Herstellung einer Spule und elektronisches Gerät
KR101328640B1 (ko) * 2013-01-24 2013-11-14 김형찬 도전성 잉크를 이용한 적층식 코일의 제조방법
US9767957B2 (en) * 2013-08-12 2017-09-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing a tunable three dimensional inductor
WO2015062155A1 (zh) * 2013-11-04 2015-05-07 北京嘉岳同乐极电子有限公司 微型电感及其制作方法
CN104616859B (zh) * 2013-11-04 2019-10-25 北京嘉岳同乐极电子有限公司 微型电感及其制作方法
CN104681232A (zh) * 2013-12-03 2015-06-03 北京嘉岳同乐极电子有限公司 微型电感及其制作方法
JP6526382B2 (ja) * 2014-01-27 2019-06-05 太陽誘電株式会社 コイル部品
US9685880B2 (en) * 2015-09-28 2017-06-20 Apple Inc. Power converters
FR3045921B1 (fr) * 2015-12-17 2019-07-12 Commissariat A L'energie Atomique Et Aux Energies Alternatives Circuit a inductance integrant une fonction de gestion thermique passive
US12002615B2 (en) 2018-11-02 2024-06-04 Delta Electronics (Shanghai) Co., Ltd. Magnetic element, manufacturing method of magnetic element, and power module
CN115359999A (zh) 2018-11-02 2022-11-18 台达电子企业管理（上海）有限公司 变压器模块及功率模块
CN112530680B (zh) * 2019-09-19 2022-04-19 台达电子企业管理（上海）有限公司 磁性元件、磁性元件的制作方法及功率模块
US11133750B2 (en) 2018-11-02 2021-09-28 Delta Electronics (Shanghai) Co., Ltd. Power module
CN111145996A (zh) 2018-11-02 2020-05-12 台达电子企业管理（上海）有限公司 磁性元件的制造方法及磁性元件
KR20230001770A (ko) * 2021-06-29 2023-01-05 엘지이노텍 주식회사 초슬림 자기 결합 장치
CN114121466A (zh) * 2021-10-11 2022-03-01 合泰盟方电子（深圳）股份有限公司 一种磁性薄膜电感器生产制造方法
EP4304053A1 (en) 2022-07-08 2024-01-10 STMicroelectronics S.r.l. Method of manufacturing a stator for an electric motor, stator, and electric motor
WO2024040517A1 (zh) * 2022-08-25 2024-02-29 京东方科技集团股份有限公司 滤波器及其制备方法、电子设备
WO2024076789A2 (en) * 2022-10-07 2024-04-11 Northeastern University Wafer-bonded inductors for power systems

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Also Published As

Publication number Publication date
CN101322201A (zh) 2008-12-10
US20080252407A1 (en) 2008-10-16
JP2009512183A (ja) 2009-03-19
EP1934993A1 (en) 2008-06-25
WO2007039878A1 (en) 2007-04-12

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