TW200735138A - Multi-layer inductive element for integrated circuit - Google Patents

Multi-layer inductive element for integrated circuit

Info

Publication number
TW200735138A
TW200735138A TW095136598A TW95136598A TW200735138A TW 200735138 A TW200735138 A TW 200735138A TW 095136598 A TW095136598 A TW 095136598A TW 95136598 A TW95136598 A TW 95136598A TW 200735138 A TW200735138 A TW 200735138A
Authority
TW
Taiwan
Prior art keywords
ferromagnetic
inductive element
adjacent non
conducting segments
metal layer
Prior art date
Application number
TW095136598A
Other languages
English (en)
Inventor
Alma Anderson
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200735138A publication Critical patent/TW200735138A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0033Printed inductances with the coil helically wound around a magnetic core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • H01F41/046Printed circuit coils structurally combined with ferromagnetic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227Inductive arrangements or effects of, or between, wiring layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
TW095136598A 2005-10-05 2006-10-02 Multi-layer inductive element for integrated circuit TW200735138A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US72424605P 2005-10-05 2005-10-05

Publications (1)

Publication Number Publication Date
TW200735138A true TW200735138A (en) 2007-09-16

Family

ID=37726901

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136598A TW200735138A (en) 2005-10-05 2006-10-02 Multi-layer inductive element for integrated circuit

Country Status (6)

Country Link
US (1) US20080252407A1 (zh)
EP (1) EP1934993A1 (zh)
JP (1) JP2009512183A (zh)
CN (1) CN101322201A (zh)
TW (1) TW200735138A (zh)
WO (1) WO2007039878A1 (zh)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090085704A1 (en) 2007-10-01 2009-04-02 Infineon Technologies Austria Ag Chip inductor
WO2009118694A1 (en) * 2008-03-25 2009-10-01 Nxp B.V. Integrated 3d high density and high quality inductive element
US20090309687A1 (en) * 2008-06-11 2009-12-17 Aleksandar Aleksov Method of manufacturing an inductor for a microelectronic device, method of manufacturing a substrate containing such an inductor, and substrate manufactured thereby,
TWM357703U (en) * 2008-12-25 2009-05-21 Domintech Co Ltd Chip package having inductor element
US8344478B2 (en) * 2009-10-23 2013-01-01 Maxim Integrated Products, Inc. Inductors having inductor axis parallel to substrate surface
US8093982B2 (en) 2010-03-25 2012-01-10 Qualcomm Incorporated Three dimensional inductor and transformer design methodology of glass technology
US8354325B1 (en) 2011-06-29 2013-01-15 Freescale Semiconductor, Inc. Method for forming a toroidal inductor in a semiconductor substrate
US8347490B1 (en) * 2011-06-30 2013-01-08 Chipbond Technology Corporation Method for fabricating a carrier with a three dimensional inductor
US8432017B2 (en) * 2011-09-28 2013-04-30 Chipbond Technology Corporation Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof
US9673268B2 (en) 2011-12-29 2017-06-06 Intel Corporation Integrated inductor for integrated circuit devices
US8803648B2 (en) 2012-05-03 2014-08-12 Qualcomm Mems Technologies, Inc. Three-dimensional multilayer solenoid transformer
DE102012216101B4 (de) * 2012-09-12 2016-03-24 Festo Ag & Co. Kg Verfahren zum Herstellen einer in einem Substrat integrierten Spule, Verfahren zur Herstellung einer mehrschichtigen Leiterplatte und elektronisches Gerät
US20140104284A1 (en) * 2012-10-16 2014-04-17 Qualcomm Mems Technologies, Inc. Through substrate via inductors
DE102012220022B4 (de) 2012-11-02 2014-09-25 Festo Ag & Co. Kg Verfahren zur Herstellung einer Spule und elektronisches Gerät
KR101328640B1 (ko) * 2013-01-24 2013-11-14 김형찬 도전성 잉크를 이용한 적층식 코일의 제조방법
US9767957B2 (en) * 2013-08-12 2017-09-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing a tunable three dimensional inductor
WO2015062155A1 (zh) * 2013-11-04 2015-05-07 北京嘉岳同乐极电子有限公司 微型电感及其制作方法
CN104616859B (zh) * 2013-11-04 2019-10-25 北京嘉岳同乐极电子有限公司 微型电感及其制作方法
CN104681232A (zh) * 2013-12-03 2015-06-03 北京嘉岳同乐极电子有限公司 微型电感及其制作方法
JP6526382B2 (ja) * 2014-01-27 2019-06-05 太陽誘電株式会社 コイル部品
US9685880B2 (en) * 2015-09-28 2017-06-20 Apple Inc. Power converters
FR3045921B1 (fr) * 2015-12-17 2019-07-12 Commissariat A L'energie Atomique Et Aux Energies Alternatives Circuit a inductance integrant une fonction de gestion thermique passive
US12002615B2 (en) 2018-11-02 2024-06-04 Delta Electronics (Shanghai) Co., Ltd. Magnetic element, manufacturing method of magnetic element, and power module
CN115359999A (zh) 2018-11-02 2022-11-18 台达电子企业管理(上海)有限公司 变压器模块及功率模块
CN112530680B (zh) * 2019-09-19 2022-04-19 台达电子企业管理(上海)有限公司 磁性元件、磁性元件的制作方法及功率模块
US11133750B2 (en) 2018-11-02 2021-09-28 Delta Electronics (Shanghai) Co., Ltd. Power module
CN111145996A (zh) 2018-11-02 2020-05-12 台达电子企业管理(上海)有限公司 磁性元件的制造方法及磁性元件
KR20230001770A (ko) * 2021-06-29 2023-01-05 엘지이노텍 주식회사 초슬림 자기 결합 장치
CN114121466A (zh) * 2021-10-11 2022-03-01 合泰盟方电子(深圳)股份有限公司 一种磁性薄膜电感器生产制造方法
EP4304053A1 (en) 2022-07-08 2024-01-10 STMicroelectronics S.r.l. Method of manufacturing a stator for an electric motor, stator, and electric motor
WO2024040517A1 (zh) * 2022-08-25 2024-02-29 京东方科技集团股份有限公司 滤波器及其制备方法、电子设备
WO2024076789A2 (en) * 2022-10-07 2024-04-11 Northeastern University Wafer-bonded inductors for power systems

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305814A (en) * 1967-02-21 Hybrid solid state device
US3013229A (en) * 1958-11-17 1961-12-12 Bell Telephone Labor Inc Gyromagnetic microwave filter devices
US5070317A (en) * 1989-01-17 1991-12-03 Bhagat Jayant K Miniature inductor for integrated circuits and devices
JPH0377360A (ja) * 1989-08-18 1991-04-02 Mitsubishi Electric Corp 半導体装置
US5336921A (en) * 1992-01-27 1994-08-09 Motorola, Inc. Vertical trench inductor
US5576680A (en) * 1994-03-01 1996-11-19 Amer-Soi Structure and fabrication process of inductors on semiconductor chip
US5524490A (en) * 1994-05-25 1996-06-11 Delco Electronics Corporation Inductive proximity sensor
EP0725407A1 (en) * 1995-02-03 1996-08-07 International Business Machines Corporation Three-dimensional integrated circuit inductor
US5801100A (en) * 1997-03-07 1998-09-01 Industrial Technology Research Institute Electroless copper plating method for forming integrated circuit structures
US6166422A (en) * 1998-05-13 2000-12-26 Lsi Logic Corporation Inductor with cobalt/nickel core for integrated circuit structure with high inductance and high Q-factor
US7107666B2 (en) * 1998-07-23 2006-09-19 Bh Electronics Method of manufacturing an ultra-miniature magnetic device
DE19860691A1 (de) * 1998-12-29 2000-03-09 Vacuumschmelze Gmbh Magnetpaste
US6531945B1 (en) * 2000-03-10 2003-03-11 Micron Technology, Inc. Integrated circuit inductor with a magnetic core
JP3726017B2 (ja) * 2000-10-31 2005-12-14 Tdk株式会社 磁性材料およびインダクタ
WO2002095775A1 (en) * 2001-05-21 2002-11-28 Milli Sensor Systems & Actuators, Inc. Planar miniature inductors and transformers and miniature transformers for millimachined instruments
US7167070B2 (en) * 2003-09-01 2007-01-23 Murata Manufacturing Co., Ltd. Laminated coil component and method of producing the same
US6990729B2 (en) * 2003-09-05 2006-01-31 Harris Corporation Method for forming an inductor
US7229908B1 (en) * 2004-06-04 2007-06-12 National Semiconductor Corporation System and method for manufacturing an out of plane integrated circuit inductor

Also Published As

Publication number Publication date
CN101322201A (zh) 2008-12-10
US20080252407A1 (en) 2008-10-16
JP2009512183A (ja) 2009-03-19
EP1934993A1 (en) 2008-06-25
WO2007039878A1 (en) 2007-04-12

Similar Documents

Publication Publication Date Title
TW200735138A (en) Multi-layer inductive element for integrated circuit
TW200725824A (en) A package structure with a plurality of chips stacked each other
CN101673733B (zh) 集成电路芯片及集成电路芯片的封环结构
EP2040289A3 (en) Packaging substrate structure and method for manufacturing the same
SG170113A1 (en) Integrated circuit package with open substrate
MY146044A (en) Prepreg, method for manufacturing prepreg, substrate, and semiconductor device
US20110291785A1 (en) Power inductor structure
MY134767A (en) Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same
GB2472953A (en) Circuit module and method of manufacturing the same
GB2483180B (en) Integrated circuit package having security feature and method of manufacturing same
TW200709740A (en) Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same
WO2009023349A3 (en) Integrated nanotube and cmos devices for system-on-chip (soc) applications and method for forming the same
WO2003090279A8 (de) Halbleiterbauelement mit integrierter gitterförmiger kapazitätsstruktur
US6921959B2 (en) Semiconductor device
TW200509260A (en) Semiconductor integrated circuit
KR101227750B1 (ko) 반도체 ic 내장 모듈
TW200623334A (en) Protection of active layers of memory cells during processing of other elements
TW200737455A (en) Method for fabricating a metal protecting layer on electrically connecting pad of circuit board
TW200610463A (en) Circuit board and method of manufacturing the same
TW200715525A (en) Semiconductor integrated circuit device and method for manufacturing same
TW200721431A (en) Reinforced interconnection structures, methods for forming the same, fuse structures and integrated circuit chips
US20160095249A1 (en) Printed circuit board and electronic component package having the same
WO2006023034A3 (en) Probe pad arrangement for an integrated circuit and method of forming
JP2004064052A (ja) ノイズ遮蔽型積層基板とその製造方法
KR101713640B1 (ko) 부품 내장 기판