TW200733825A - Copper foil for super fine pitch printed circuit board - Google Patents
Copper foil for super fine pitch printed circuit boardInfo
- Publication number
- TW200733825A TW200733825A TW095136133A TW95136133A TW200733825A TW 200733825 A TW200733825 A TW 200733825A TW 095136133 A TW095136133 A TW 095136133A TW 95136133 A TW95136133 A TW 95136133A TW 200733825 A TW200733825 A TW 200733825A
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- circuit board
- printed circuit
- copper
- super fine
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060016814A KR100756751B1 (ko) | 2006-02-21 | 2006-02-21 | 미세회로용 동박 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200733825A true TW200733825A (en) | 2007-09-01 |
Family
ID=38546484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095136133A TW200733825A (en) | 2006-02-21 | 2006-09-29 | Copper foil for super fine pitch printed circuit board |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2007224411A (zh) |
KR (1) | KR100756751B1 (zh) |
CN (1) | CN101026928A (zh) |
TW (1) | TW200733825A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI626151B (zh) * | 2016-02-18 | 2018-06-11 | 三井金屬鑛業股份有限公司 | Copper foil for manufacturing printed wiring board, copper foil with carrier, copper-clad laminate, and method for producing printed wiring board using the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100857946B1 (ko) * | 2007-01-31 | 2008-09-09 | 엘에스엠트론 주식회사 | 미세회로용 이층동박 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06120631A (ja) * | 1992-10-07 | 1994-04-28 | Mitsubishi Materials Corp | 回路基板の積層構造および回路パターンの形成方法 |
KR19980081867A (ko) * | 1997-04-30 | 1998-11-25 | 버프어니스트디 | 미세회로선 형성방법 |
KR100495184B1 (ko) * | 2002-12-02 | 2005-06-14 | 엘지마이크론 주식회사 | 테이프기판 및 그의 주석도금방법 |
-
2006
- 2006-02-21 KR KR1020060016814A patent/KR100756751B1/ko not_active IP Right Cessation
- 2006-08-03 JP JP2006212584A patent/JP2007224411A/ja active Pending
- 2006-09-29 TW TW095136133A patent/TW200733825A/zh unknown
- 2006-10-25 CN CNA2006101507502A patent/CN101026928A/zh active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI626151B (zh) * | 2016-02-18 | 2018-06-11 | 三井金屬鑛業股份有限公司 | Copper foil for manufacturing printed wiring board, copper foil with carrier, copper-clad laminate, and method for producing printed wiring board using the same |
Also Published As
Publication number | Publication date |
---|---|
KR20070084702A (ko) | 2007-08-27 |
CN101026928A (zh) | 2007-08-29 |
JP2007224411A (ja) | 2007-09-06 |
KR100756751B1 (ko) | 2007-09-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY159854A (en) | Resin coated copper foil and method for manufacturing resin coated copper foil | |
MY150055A (en) | Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate | |
TW200833755A (en) | Resin composition, insulating sheet with substrate, prepreg, multilayer printed wiring board, and semiconductor device | |
TW200617065A (en) | Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate | |
EP1802183A3 (en) | Ultrathin copper foil with carrier and printed circuit board using same | |
TW200603705A (en) | Wiring board and method for producing the same | |
TW200617205A (en) | Solution, component for plating, insulating sheet, laminate, and printed circuit board | |
TW200802775A (en) | An embedded electronic device and method for manufacturing an embedded electronic device | |
MX2009011777A (es) | Tarjeta de circuito de base de metal. | |
MY149431A (en) | Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device | |
GB2453083A (en) | Printed circuit boards | |
TW200731898A (en) | Circuit board structure and method for fabricating the same | |
EP2222144A3 (en) | Noise suppressing structure and printed wiring board | |
ATE548430T1 (de) | Aushärtbare harzfolie für flexible schaltkreisplatine und herstellungsverfahren dafür | |
TW200714142A (en) | Method of continuous producing flexible printed circuit board | |
WO2008153185A1 (ja) | プリント配線板製造用の埋設銅めっき方法及びその埋設銅めっき方法を用いて得られるプリント配線板 | |
MY159991A (en) | Manufacturing method of printed wiring board and printed wiring board | |
TW200629998A (en) | Printed circuit board and forming method thereof | |
CN101460011B (zh) | 电路板制作方法 | |
TW201438918A (zh) | 具有銅薄層構成之基材的生產方法,印刷電路板之製造方法以及經由上述方法製造之印刷電路板 | |
TW200715919A (en) | Dual-layered flexible circuit board | |
JP2013526774A (ja) | 両面フレキシブルプリント回路基板及びその製造方法 | |
MY153974A (en) | Method of forming electrinic circuit | |
TW200733825A (en) | Copper foil for super fine pitch printed circuit board | |
TW200507715A (en) | Manufacturing method of printed circuit board |