TW200731852A - Film forming apparatus and process for producing light emitting element - Google Patents

Film forming apparatus and process for producing light emitting element

Info

Publication number
TW200731852A
TW200731852A TW095147702A TW95147702A TW200731852A TW 200731852 A TW200731852 A TW 200731852A TW 095147702 A TW095147702 A TW 095147702A TW 95147702 A TW95147702 A TW 95147702A TW 200731852 A TW200731852 A TW 200731852A
Authority
TW
Taiwan
Prior art keywords
organic layer
forming apparatus
emitting element
film forming
producing light
Prior art date
Application number
TW095147702A
Other languages
English (en)
Chinese (zh)
Inventor
Kazuki Moyama
Toshihisa Nozawa
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200731852A publication Critical patent/TW200731852A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3464—Sputtering using more than one target
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW095147702A 2005-12-27 2006-12-19 Film forming apparatus and process for producing light emitting element TW200731852A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005374976A JP2007179797A (ja) 2005-12-27 2005-12-27 成膜装置および発光素子の製造方法

Publications (1)

Publication Number Publication Date
TW200731852A true TW200731852A (en) 2007-08-16

Family

ID=38217789

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147702A TW200731852A (en) 2005-12-27 2006-12-19 Film forming apparatus and process for producing light emitting element

Country Status (3)

Country Link
JP (1) JP2007179797A (fr)
TW (1) TW200731852A (fr)
WO (1) WO2007074563A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007220358A (ja) * 2006-02-14 2007-08-30 Tokyo Electron Ltd 基板処理装置および発光素子の製造方法
JP5051870B2 (ja) * 2006-06-14 2012-10-17 東京エレクトロン株式会社 発光素子の製造装置および発光素子の製造方法
JP5051869B2 (ja) 2006-06-14 2012-10-17 東京エレクトロン株式会社 発光素子および発光素子の製造方法
WO2010114118A1 (fr) * 2009-04-03 2010-10-07 東京エレクトロン株式会社 Tête de dépôt et appareil de formation de film

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03162571A (ja) * 1989-11-17 1991-07-12 Osaka Shinku Kiki Seisakusho:Kk 対向ターゲット式スパッタ法に於ける反応性スパッタによる薄膜形成方法
JPH10255987A (ja) * 1997-03-11 1998-09-25 Tdk Corp 有機ｅｌ素子の製造方法
JP2001140066A (ja) * 1999-11-17 2001-05-22 Anelva Corp 薄膜形成方法及び形成装置
JP3955744B2 (ja) * 2001-05-14 2007-08-08 淳二 城戸 有機薄膜素子の製造方法
JP2003264098A (ja) * 2002-03-08 2003-09-19 Sumitomo Heavy Ind Ltd シートプラズマ処理装置
JP4037685B2 (ja) * 2002-05-20 2008-01-23 ソニーケミカル＆インフォメーションデバイス株式会社 スパッタリング方法
JP2004035931A (ja) * 2002-07-02 2004-02-05 Anelva Corp 輸送型スパッタ装置及び輸送型スパッタ法
JP4317150B2 (ja) * 2004-03-19 2009-08-19 三星モバイルディスプレイ株式會社 スパッタリング方法及びスパッタリング装置
JP4098283B2 (ja) * 2004-07-30 2008-06-11 株式会社アルバック スパッタリング装置

Also Published As

Publication number Publication date
JP2007179797A (ja) 2007-07-12
WO2007074563A1 (fr) 2007-07-05

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