TW200731577A - Semiconductor light emitting device and method of manufacturing the same - Google Patents

Semiconductor light emitting device and method of manufacturing the same

Info

Publication number
TW200731577A
TW200731577A TW095143976A TW95143976A TW200731577A TW 200731577 A TW200731577 A TW 200731577A TW 095143976 A TW095143976 A TW 095143976A TW 95143976 A TW95143976 A TW 95143976A TW 200731577 A TW200731577 A TW 200731577A
Authority
TW
Taiwan
Prior art keywords
layer
light reflection
emitting device
semiconductor
light emitting
Prior art date
Application number
TW095143976A
Other languages
English (en)
Inventor
Yoshiaki Watanabe
Tomonori Hino
Toshimasa Kobayashi
Hironobu Narui
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200731577A publication Critical patent/TW200731577A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/405—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
TW095143976A 2005-12-01 2006-11-28 Semiconductor light emitting device and method of manufacturing the same TW200731577A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005348294A JP2007157853A (ja) 2005-12-01 2005-12-01 半導体発光素子およびその製造方法

Publications (1)

Publication Number Publication Date
TW200731577A true TW200731577A (en) 2007-08-16

Family

ID=37808016

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143976A TW200731577A (en) 2005-12-01 2006-11-28 Semiconductor light emitting device and method of manufacturing the same

Country Status (6)

Country Link
US (1) US20070145396A1 (zh)
EP (1) EP1793429A1 (zh)
JP (1) JP2007157853A (zh)
KR (1) KR20070057672A (zh)
CN (1) CN1976076A (zh)
TW (1) TW200731577A (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007040295A1 (en) * 2005-10-04 2007-04-12 Seoul Opto Device Co., Ltd. (al, ga, in)n-based compound semiconductor and method of fabricating the same
JP5261923B2 (ja) * 2006-10-17 2013-08-14 サンケン電気株式会社 化合物半導体素子
KR100872717B1 (ko) * 2007-06-22 2008-12-05 엘지이노텍 주식회사 발광 소자 및 그 제조방법
KR101449005B1 (ko) 2007-11-26 2014-10-08 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
DE102007057756B4 (de) * 2007-11-30 2022-03-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Halbleiterkörpers
KR101506264B1 (ko) 2008-06-13 2015-03-30 삼성전자주식회사 발광 소자, 발광 장치 및 상기 발광 소자의 제조 방법
CN101488553B (zh) * 2009-02-09 2012-05-30 晶能光电（江西）有限公司 硅胶保护的发光二极管芯片及其制造方法
US8076682B2 (en) 2009-07-21 2011-12-13 Koninklijke Philips Electronics N.V. Contact for a semiconductor light emitting device
JP5310371B2 (ja) * 2009-08-10 2013-10-09 ソニー株式会社 半導体発光素子及びその製造方法
KR101646664B1 (ko) * 2010-05-18 2016-08-08 엘지이노텍 주식회사 발광 소자, 발광 소자의 제조방법 및 발광 소자 패키지
WO2011152262A1 (ja) 2010-05-31 2011-12-08 日亜化学工業株式会社 発光装置及びその製造方法
US20120061710A1 (en) 2010-09-10 2012-03-15 Toscano Lenora M Method for Treating Metal Surfaces
US20120061698A1 (en) 2010-09-10 2012-03-15 Toscano Lenora M Method for Treating Metal Surfaces
JP5630384B2 (ja) * 2010-09-28 2014-11-26 豊田合成株式会社 Ｉｉｉ族窒化物半導体発光素子の製造方法
TWI535032B (zh) * 2011-01-12 2016-05-21 半導體能源研究所股份有限公司 半導體裝置的製造方法
JP5782823B2 (ja) 2011-04-27 2015-09-24 日亜化学工業株式会社 窒化物半導体発光素子およびその製造方法
JP2015222828A (ja) * 2011-04-27 2015-12-10 日亜化学工業株式会社 窒化物半導体発光素子
KR102100922B1 (ko) * 2012-10-30 2020-04-16 서울반도체 주식회사 면 조명용 렌즈 및 발광 모듈
JP2014110300A (ja) * 2012-11-30 2014-06-12 Nichia Chem Ind Ltd 半導体発光素子の製造方法
KR102471670B1 (ko) * 2016-02-11 2022-11-29 서울바이오시스 주식회사 고출력 발광 다이오드 및 그것을 갖는 발광 모듈
DE102017123154A1 (de) * 2017-10-05 2019-04-11 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2919788B2 (ja) * 1995-08-31 1999-07-19 株式会社東芝 半導体装置、半導体装置の製造方法、及び窒化ガリウム系半導体の成長方法
JP3462717B2 (ja) * 1997-06-27 2003-11-05 シャープ株式会社 化合物半導体の電極構造及びその形成方法
JP4118371B2 (ja) * 1997-12-15 2008-07-16 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 電極に銀を有する窒化物半導体発光装置およびその製造方法ならびに半導体光電子装置
JP2001085742A (ja) * 1999-09-17 2001-03-30 Toshiba Corp 半導体発光素子及び半導体発光素子の製造方法
JP2003168823A (ja) * 2001-09-18 2003-06-13 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体発光素子
JP2004277780A (ja) * 2003-03-13 2004-10-07 Furuya Kinzoku:Kk 銀系合金の積層構造並びにそれを用いた電極、配線、反射膜及び反射電極
KR100826424B1 (ko) * 2003-04-21 2008-04-29 삼성전기주식회사 반도체 발광 다이오드 및 그 제조방법
KR100624411B1 (ko) * 2003-08-25 2006-09-18 삼성전자주식회사 질화물계 발광소자 및 그 제조방법
KR100585919B1 (ko) * 2004-01-15 2006-06-01 학교법인 포항공과대학교 질화갈륨계 ⅲ­ⅴ족 화합물 반도체 소자 및 그 제조방법
KR100838215B1 (ko) * 2004-06-24 2008-06-13 쇼와 덴코 가부시키가이샤 반사성 정극 및 그것을 사용한 질화 갈륨계 화합물 반도체발광 소자

Also Published As

Publication number Publication date
KR20070057672A (ko) 2007-06-07
CN1976076A (zh) 2007-06-06
JP2007157853A (ja) 2007-06-21
EP1793429A1 (en) 2007-06-06
US20070145396A1 (en) 2007-06-28

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