TW200731452A - Method for determining position of semiconductor wafer, and apparatus using the same - Google Patents

Method for determining position of semiconductor wafer, and apparatus using the same

Info

Publication number
TW200731452A
TW200731452A TW095144407A TW95144407A TW200731452A TW 200731452 A TW200731452 A TW 200731452A TW 095144407 A TW095144407 A TW 095144407A TW 95144407 A TW95144407 A TW 95144407A TW 200731452 A TW200731452 A TW 200731452A
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
peripheral edge
same
determining position
coordinates
Prior art date
Application number
TW095144407A
Other languages
English (en)
Inventor
Satoshi Ikeda
Masayuki Yamamoto
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200731452A publication Critical patent/TW200731452A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/028—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring lateral position of a boundary of the object
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S451/00—Abrading
    • Y10S451/914—Supporting, positioning, or feeding work
TW095144407A 2005-12-02 2006-11-30 Method for determining position of semiconductor wafer, and apparatus using the same TW200731452A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005349076A JP4522360B2 (ja) 2005-12-02 2005-12-02 半導体ウエハの位置決定方法およびこれを用いた装置

Publications (1)

Publication Number Publication Date
TW200731452A true TW200731452A (en) 2007-08-16

Family

ID=38125940

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095144407A TW200731452A (en) 2005-12-02 2006-11-30 Method for determining position of semiconductor wafer, and apparatus using the same

Country Status (5)

Country Link
US (1) US7519448B2 (zh)
JP (1) JP4522360B2 (zh)
KR (1) KR20070058354A (zh)
CN (1) CN1975997A (zh)
TW (1) TW200731452A (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102768976A (zh) * 2011-05-05 2012-11-07 上海微电子装备有限公司 一种基板预对准装置及方法
CN103811387A (zh) * 2012-11-08 2014-05-21 沈阳新松机器人自动化股份有限公司 晶圆预对准方法及装置
CN106098607A (zh) * 2015-04-30 2016-11-09 日东电工株式会社 背面保护薄膜、薄膜、半导体装置的制造方法和保护芯片的制造方法
TWI639189B (zh) 2017-09-07 2018-10-21 大陸商上海新昇半導體科技有限公司 晶圓尋邊裝置
TWI731102B (zh) * 2016-06-17 2021-06-21 法商統一半導體公司 用於定位積體電路晶圓的裝置及用於檢驗積體電路晶圓且包含此定位裝置的設備
TWI775314B (zh) * 2020-08-20 2022-08-21 台灣積體電路製造股份有限公司 光學系統、位置檢測方法及晶圓凹口定位檢測

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101501831B (zh) * 2006-08-10 2012-04-04 芝浦机械电子装置股份有限公司 圆盘状基板的检查装置和检查方法
US20080291448A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for finding a substrate notch center
DE102007060835A1 (de) 2007-12-18 2009-06-25 Epcos Ag Strahlungssensor zum Erfassen der Position und Intensität einer Strahlungsquelle
US7963736B2 (en) * 2008-04-03 2011-06-21 Asm Japan K.K. Wafer processing apparatus with wafer alignment device
JP5425451B2 (ja) * 2008-12-01 2014-02-26 株式会社ディスコ レーザ加工装置
JP5541770B2 (ja) * 2009-09-18 2014-07-09 不二越機械工業株式会社 ウェーハ研磨装置およびウェーハの製造方法
JP5477133B2 (ja) * 2010-04-09 2014-04-23 日新イオン機器株式会社 ウェーハハンドリング方法およびイオン注入装置
CN102263009A (zh) * 2011-01-19 2011-11-30 沈阳芯源微电子设备有限公司 晶圆视觉对中单元
JP5633537B2 (ja) * 2012-05-07 2014-12-03 信越半導体株式会社 半導体ウエーハの評価方法および半導体ウエーハの評価装置
CN104756243B (zh) * 2012-10-29 2018-02-13 日商乐华股份有限公司 半导体衬底的位置检测装置和位置检测方法
CN103808255B (zh) * 2012-11-06 2019-05-10 株式会社富士 裸片位置判定系统
US20140242883A1 (en) * 2013-02-27 2014-08-28 Applied Materials, Inc. Determination of wafer angular position for in-sequence metrology
CN106030772B (zh) * 2014-02-12 2020-04-14 科磊股份有限公司 晶片缺口检测
CN105632971B (zh) * 2014-11-26 2019-06-25 上海微电子装备（集团）股份有限公司 一种硅片处理装置及方法
CN105762101B (zh) * 2014-12-19 2019-02-19 北京北方华创微电子装备有限公司 晶片定位装置及方法
US9796086B2 (en) * 2015-05-01 2017-10-24 Kawasaki Jukogyo Kabushiki Kaisha Method of teaching robot and robot
US10186438B2 (en) 2015-11-05 2019-01-22 Infineon Technologies Ag Method and apparatus for use in wafer processing
JP6611652B2 (ja) * 2016-03-30 2019-11-27 東京エレクトロン株式会社 基板処理装置の管理方法、及び基板処理システム
JP6689539B2 (ja) * 2016-08-12 2020-04-28 株式会社ディスコ 判定装置
JP6276449B1 (ja) * 2017-03-30 2018-02-07 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
CN111029291A (zh) * 2019-11-26 2020-04-17 北京中电科电子装备有限公司 一种晶圆定位装置及具有其的减薄机
JP2022072520A (ja) * 2020-10-30 2022-05-17 株式会社ディスコ ノッチ検出方法
CN116277037B (zh) * 2023-05-19 2023-07-25 泓浒(苏州)半导体科技有限公司 一种晶圆搬运机械臂控制系统及方法
CN116872218B (zh) * 2023-09-05 2023-11-24 泓浒(苏州)半导体科技有限公司 一种半导体晶圆传送过程偏心纠正方法及纠正系统
CN117038495B (zh) * 2023-10-10 2024-01-30 浙江果纳半导体技术有限公司 晶圆检测机构、检测方法及晶圆传输装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765793A (en) * 1986-02-03 1988-08-23 Proconics International, Inc. Apparatus for aligning circular objects
JPH0697215A (ja) * 1992-09-11 1994-04-08 Hitachi Ltd 小物品群付貼着シートおよびそれが使用される小物品のピックアップ方法
JP3590916B2 (ja) * 1995-12-28 2004-11-17 株式会社ニコン 位置決め方法
JP3820278B2 (ja) * 1995-04-07 2006-09-13 日東電工株式会社 円板状体の中心決定装置
JPH11345867A (ja) * 1998-06-02 1999-12-14 Dainippon Screen Mfg Co Ltd ウェハの回転方向決定方法およびその装置、並びに、ウェハの測定位置決定方法およびその装置
JP2003258062A (ja) * 2002-03-04 2003-09-12 Nitto Denko Corp 円板状体の位置合わせ装置およびその方法
US7453160B2 (en) * 2004-04-23 2008-11-18 Axcelis Technologies, Inc. Simplified wafer alignment
JP4566798B2 (ja) * 2005-03-30 2010-10-20 東京エレクトロン株式会社 基板位置決め装置，基板位置決め方法，プログラム

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102768976A (zh) * 2011-05-05 2012-11-07 上海微电子装备有限公司 一种基板预对准装置及方法
CN102768976B (zh) * 2011-05-05 2015-11-25 上海微电子装备有限公司 一种基板预对准装置及方法
CN103811387A (zh) * 2012-11-08 2014-05-21 沈阳新松机器人自动化股份有限公司 晶圆预对准方法及装置
CN106098607A (zh) * 2015-04-30 2016-11-09 日东电工株式会社 背面保护薄膜、薄膜、半导体装置的制造方法和保护芯片的制造方法
TWI731102B (zh) * 2016-06-17 2021-06-21 法商統一半導體公司 用於定位積體電路晶圓的裝置及用於檢驗積體電路晶圓且包含此定位裝置的設備
TWI639189B (zh) 2017-09-07 2018-10-21 大陸商上海新昇半導體科技有限公司 晶圓尋邊裝置
TWI775314B (zh) * 2020-08-20 2022-08-21 台灣積體電路製造股份有限公司 光學系統、位置檢測方法及晶圓凹口定位檢測
US11521882B2 (en) 2020-08-20 2022-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer notch positioning detection
US11942348B2 (en) 2020-08-20 2024-03-26 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer notch positioning detection

Also Published As

Publication number Publication date
US20070139642A1 (en) 2007-06-21
JP4522360B2 (ja) 2010-08-11
CN1975997A (zh) 2007-06-06
KR20070058354A (ko) 2007-06-08
JP2007157897A (ja) 2007-06-21
US7519448B2 (en) 2009-04-14

Similar Documents

Publication Publication Date Title
TW200731452A (en) Method for determining position of semiconductor wafer, and apparatus using the same
EP1260871A3 (en) Position detecting method and apparatus, exposure apparatus and device manufacturing method
CN1888813A (zh) 图像获取设备
EP1231520A3 (en) Image forming apparatus
EP1265107A3 (en) Position detection method and apparatus
WO2007091124A3 (en) Method and apparatus for detecting orientation of a contact lens in a blister
SG156635A1 (en) Exposure apparatus and device manufacturing method
WO2003073081A3 (en) Apparatus and method for detecting fecal and ingesta contamination on hands using an illumination imaging device
GB2442152A (en) Optimizing use and performance of optical systems implemented with telecentric on-axis dark field illumination
EP1560017A4 (en) DEVICE FOR INSPECTING GLASS BOTTLES
WO2003060461A3 (en) System and method for fluorescence detection
TWI266860B (en) Optical inspection apparatus and optical inspection method
EP1519375A3 (en) System and method for library inventory
EP1270433A3 (en) Method of inspecting a cap wrap-fitted to a neck of a bottle and apparatus therefor
FR2859277B1 (fr) Procede et dispositif de detection optique de position par reflexion d'un objet sur une surface quelconque
US10345248B2 (en) Optical system and method for inspecting a transparent plate
EP1353213A3 (en) Light source unit and scanning optical apparatus using the same
EP1167942A3 (en) Spectacle lens image sensing processing apparatus and spectacle lens positioning method
MY145547A (en) Method and apparatus for detecting presence of an ophthalmic lens in a package
TW200510704A (en) Position detecting device, position detecting method, test device and manufacturing device of camera module
US20110174591A1 (en) Automatic Diameter Ascertainment of Coins
FR2905455B1 (fr) Procede de detection de l'orientation et de la position d'un objet dans l'espace.
ATE517315T1 (de) System und verfahren zur inspektion
TW201621481A (zh) 位置判斷裝置、位置判斷方法、微影設備及用於製造物件的方法
EP1471565A3 (en) Mapping device for semiconductor wafers