TW200725790A - Carry method of base plate, carry equipment of base plate and exposure equipment - Google Patents

Carry method of base plate, carry equipment of base plate and exposure equipment

Info

Publication number
TW200725790A
TW200725790A TW095147421A TW95147421A TW200725790A TW 200725790 A TW200725790 A TW 200725790A TW 095147421 A TW095147421 A TW 095147421A TW 95147421 A TW95147421 A TW 95147421A TW 200725790 A TW200725790 A TW 200725790A
Authority
TW
Taiwan
Prior art keywords
base plate
carry
equipment
exposure
atmosphere
Prior art date
Application number
TW095147421A
Other languages
English (en)
Inventor
Motoko Suzuki
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200725790A publication Critical patent/TW200725790A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW095147421A 2005-12-20 2006-12-18 Carry method of base plate, carry equipment of base plate and exposure equipment TW200725790A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005366813 2005-12-20

Publications (1)

Publication Number Publication Date
TW200725790A true TW200725790A (en) 2007-07-01

Family

ID=38188595

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147421A TW200725790A (en) 2005-12-20 2006-12-18 Carry method of base plate, carry equipment of base plate and exposure equipment

Country Status (3)

Country Link
US (1) US20070166134A1 (zh)
TW (1) TW200725790A (zh)
WO (1) WO2007072817A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI459492B (zh) * 2007-07-25 2014-11-01 Tokyo Electron Ltd The probe card and the handling method of the probe card using the trolley

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2157480B1 (en) 2003-04-09 2015-05-27 Nikon Corporation Exposure method and apparatus, and device manufacturing method
TWI519819B (zh) 2003-11-20 2016-02-01 尼康股份有限公司 光束變換元件、光學照明裝置、曝光裝置、以及曝光方法
TWI505329B (zh) 2004-02-06 2015-10-21 尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法以及元件製造方法
EP2660854B1 (en) 2005-05-12 2017-06-21 Nikon Corporation Projection optical system, exposure apparatus and exposure method
TWI478272B (zh) * 2007-08-15 2015-03-21 尼康股份有限公司 A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
WO2009060539A1 (ja) * 2007-11-09 2009-05-14 Canon Anelva Corporation インライン型ウェハ搬送装置
JP2011192750A (ja) * 2010-03-12 2011-09-29 Nikon Corp 基板ホルダ、基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置
US8704104B2 (en) 2010-07-19 2014-04-22 Asml Netherlands B.V. Electrical connector, electrical connection system and lithographic apparatus
JP2012253055A (ja) * 2011-05-31 2012-12-20 Nuflare Technology Inc 荷電粒子ビーム描画装置及び描画方法
NL2009332A (en) * 2011-09-23 2013-03-26 Asml Netherlands Bv Lithographic apparatus and substrate handling method.
US9246415B2 (en) * 2012-08-21 2016-01-26 Eryn Smith Electrostatic carrier tray
US9314930B2 (en) 2012-12-14 2016-04-19 LuxVue Technology Corporation Micro pick up array with integrated pivot mount
US9391042B2 (en) * 2012-12-14 2016-07-12 Apple Inc. Micro device transfer system with pivot mount
JP2013232663A (ja) * 2013-06-20 2013-11-14 Nikon Corp 基板ホルダ装置及び基板張り合わせ装置
JP2015095580A (ja) * 2013-11-13 2015-05-18 東京エレクトロン株式会社 基板処理装置及び基板離脱方法
CN107112247B (zh) * 2014-12-26 2019-09-20 富士电机株式会社 加热冷却设备
WO2018054471A1 (en) * 2016-09-22 2018-03-29 Applied Materials, Inc. Carrier for supporting a substrate, apparatus for processing a substrate and method therefore
JP7045861B2 (ja) * 2018-01-17 2022-04-01 株式会社ディスコ 支持基台

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999507A (en) * 1990-05-10 1991-03-12 At&T Bell Laboratories Apparatus comprising an electrostatic wafer cassette
JP3596127B2 (ja) * 1995-12-04 2004-12-02 ソニー株式会社 静電チャック、薄板保持装置、半導体製造装置、搬送方法及び半導体の製造方法
JP4414072B2 (ja) * 2000-07-27 2010-02-10 キヤノンアネルバ株式会社 真空処理装置用トレー及び真空処理装置
JP2003045947A (ja) * 2001-07-27 2003-02-14 Canon Inc 基板処理装置及び露光装置
JP2005166797A (ja) * 2003-12-01 2005-06-23 Canon Inc 基板処理装置、露光装置、デバイスの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI459492B (zh) * 2007-07-25 2014-11-01 Tokyo Electron Ltd The probe card and the handling method of the probe card using the trolley

Also Published As

Publication number Publication date
WO2007072817A1 (ja) 2007-06-28
US20070166134A1 (en) 2007-07-19

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