TW200724716A - Cobalt-based alloy electroless plating solution and electroless plating method using the same - Google Patents

Cobalt-based alloy electroless plating solution and electroless plating method using the same

Info

Publication number
TW200724716A
TW200724716A TW095149762A TW95149762A TW200724716A TW 200724716 A TW200724716 A TW 200724716A TW 095149762 A TW095149762 A TW 095149762A TW 95149762 A TW95149762 A TW 95149762A TW 200724716 A TW200724716 A TW 200724716A
Authority
TW
Taiwan
Prior art keywords
electroless plating
cobalt
based alloy
plating solution
same
Prior art date
Application number
TW095149762A
Other languages
English (en)
Other versions
TWI332999B (en
Inventor
Sang-Chul Lee
Min-Kyoun Kim
Min-Jin Ko
Original Assignee
Lg Chemical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Chemical Ltd filed Critical Lg Chemical Ltd
Publication of TW200724716A publication Critical patent/TW200724716A/zh
Application granted granted Critical
Publication of TWI332999B publication Critical patent/TWI332999B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
TW95149762A 2005-12-29 2006-12-29 Cobalt-based alloy electroless plating solution and electroless plating method using the same TWI332999B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050133505A KR100859259B1 (ko) 2005-12-29 2005-12-29 캡층 형성을 위한 코발트 계열 합금 무전해 도금 용액 및이를 이용하는 무전해 도금 방법

Publications (2)

Publication Number Publication Date
TW200724716A true TW200724716A (en) 2007-07-01
TWI332999B TWI332999B (en) 2010-11-11

Family

ID=38218246

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95149762A TWI332999B (en) 2005-12-29 2006-12-29 Cobalt-based alloy electroless plating solution and electroless plating method using the same

Country Status (6)

Country Link
US (1) US7758681B2 (zh)
JP (1) JP4861436B2 (zh)
KR (1) KR100859259B1 (zh)
CN (1) CN101336309B (zh)
TW (1) TWI332999B (zh)
WO (1) WO2007075063A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI733754B (zh) * 2016-02-26 2021-07-21 美商應用材料股份有限公司 用於鈷鍍覆之增強鍍覆浴及添加劑化學條件

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101105088B1 (ko) * 2009-11-09 2012-01-16 서울대학교산학협력단 구리 ｃｍｐ 후 캡핑 조성물
KR20110092836A (ko) * 2010-02-10 2011-08-18 삼성전자주식회사 반도체 소자 및 그 제조 방법
CN102154632A (zh) * 2011-03-22 2011-08-17 王建朝 室温非水体系化学镀钴的方法
EP2639335B1 (en) 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys
CN111621773B (zh) * 2020-05-27 2022-08-16 广东东硕科技有限公司 二硫代氨基甲酸类化合物在化学镀钯中的应用以及化学镀钯组合物

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DE1243493B (de) * 1961-02-04 1967-06-29 Bayer Ag Waessriges Bad zur chemischen Abscheidung von borhaltigen Metallueberzuegen
FR2531103B1 (fr) * 1982-07-30 1985-11-22 Onera (Off Nat Aerospatiale) Bain pour le depot chimique de nickel et/ou de cobalt utilisant un reducteur a base de bore ou de phosphore
FR2590595B1 (fr) * 1985-11-22 1988-02-26 Onera (Off Nat Aerospatiale) Bain a l'hydrazine pour le depot chimique de nickel et/ou de cobalt, et procede de fabrication d'un tel bain.
JPS6379977A (ja) * 1986-09-22 1988-04-09 Nec Corp 無電解めつき浴
KR960005765A (ko) * 1994-07-14 1996-02-23 모리시다 요이치 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법
US20020081842A1 (en) * 2000-04-14 2002-06-27 Sambucetti Carlos J. Electroless metal liner formation methods
US6645364B2 (en) * 2000-10-20 2003-11-11 Shipley Company, L.L.C. Electroplating bath control
US6863795B2 (en) * 2001-03-23 2005-03-08 Interuniversitair Microelektronica Centrum (Imec) Multi-step method for metal deposition
JP2003049280A (ja) * 2001-06-01 2003-02-21 Ebara Corp 無電解めっき液及び半導体装置
US6717189B2 (en) * 2001-06-01 2004-04-06 Ebara Corporation Electroless plating liquid and semiconductor device
US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6911068B2 (en) * 2001-10-02 2005-06-28 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
EP1306465B1 (en) * 2001-10-24 2011-03-16 Rohm and Haas Electronic Materials LLC Stabilizers for electroless plating solutions and methods of use thereof
US6790265B2 (en) * 2002-10-07 2004-09-14 Atotech Deutschland Gmbh Aqueous alkaline zincate solutions and methods
JP2004200273A (ja) * 2002-12-17 2004-07-15 Sony Corp 半導体装置の製造方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI733754B (zh) * 2016-02-26 2021-07-21 美商應用材料股份有限公司 用於鈷鍍覆之增強鍍覆浴及添加劑化學條件
US11118278B2 (en) 2016-02-26 2021-09-14 Applied Materials, Inc. Enhanced plating bath and additive chemistries for cobalt plating

Also Published As

Publication number Publication date
CN101336309A (zh) 2008-12-31
KR20070070688A (ko) 2007-07-04
WO2007075063A1 (en) 2007-07-05
JP4861436B2 (ja) 2012-01-25
JP2009522445A (ja) 2009-06-11
KR100859259B1 (ko) 2008-09-18
TWI332999B (en) 2010-11-11
US7758681B2 (en) 2010-07-20
CN101336309B (zh) 2011-06-08
US20070160857A1 (en) 2007-07-12

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