TW200743681A - Ni-Co-P electroplating composition, electroplating solution and electroplating method using the same - Google Patents

Ni-Co-P electroplating composition, electroplating solution and electroplating method using the same

Info

Publication number
TW200743681A
TW200743681A TW095117848A TW95117848A TW200743681A TW 200743681 A TW200743681 A TW 200743681A TW 095117848 A TW095117848 A TW 095117848A TW 95117848 A TW95117848 A TW 95117848A TW 200743681 A TW200743681 A TW 200743681A
Authority
TW
Taiwan
Prior art keywords
electroplating
same
composition
solution
complexing agent
Prior art date
Application number
TW095117848A
Other languages
Chinese (zh)
Inventor
Ching Ho
Original Assignee
Ching Ho
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ching Ho filed Critical Ching Ho
Priority to TW095117848A priority Critical patent/TW200743681A/en
Priority to JP2007132802A priority patent/JP2007308801A/en
Priority to US11/750,958 priority patent/US20070272559A1/en
Publication of TW200743681A publication Critical patent/TW200743681A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention provides a Ni-Co-P electroplating composition used for electrically depositing a Ni-Co-P alloy. The Ni-Co-P alloy includes 68.5-94.5 wt% Ni, 5-15.5wt% Co and 0.5-16wt% P. The electroplating composition includes a nickel salt, a cobalt salt, a first compound capable of dissociating phosphite ions, and a complexing agent. The complexing agent is selected from a group consisting of triethylene tetramine, diethylene triamine, ethylene diamine, hydrazobenzene and a combination thereof.
TW095117848A 2006-05-19 2006-05-19 Ni-Co-P electroplating composition, electroplating solution and electroplating method using the same TW200743681A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW095117848A TW200743681A (en) 2006-05-19 2006-05-19 Ni-Co-P electroplating composition, electroplating solution and electroplating method using the same
JP2007132802A JP2007308801A (en) 2006-05-19 2007-05-18 Nickel/cobalt/phosphorus electroplating composition and its application
US11/750,958 US20070272559A1 (en) 2006-05-19 2007-05-18 Nickel cobalt phosphorus electroplating composition and its use in surface treatment of a workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095117848A TW200743681A (en) 2006-05-19 2006-05-19 Ni-Co-P electroplating composition, electroplating solution and electroplating method using the same

Publications (1)

Publication Number Publication Date
TW200743681A true TW200743681A (en) 2007-12-01

Family

ID=38748525

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117848A TW200743681A (en) 2006-05-19 2006-05-19 Ni-Co-P electroplating composition, electroplating solution and electroplating method using the same

Country Status (3)

Country Link
US (1) US20070272559A1 (en)
JP (1) JP2007308801A (en)
TW (1) TW200743681A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101078924B1 (en) 2009-01-29 2011-11-01 창원대학교 산학협력단 Method to manufature Co-based alloy thin film using electrolytic deposition
JP5469038B2 (en) 2010-11-12 2014-04-09 株式会社オティックス Manufacturing method of fuel system parts and fuel system parts
US20130065069A1 (en) * 2011-09-09 2013-03-14 Yun Li Liu Electrodeposition of Hard Magnetic Coatings
JP7014554B2 (en) * 2017-09-25 2022-02-01 株式会社リケン Sliding member
US11807929B2 (en) * 2019-03-14 2023-11-07 Unison Industries, Llc Thermally stabilized nickel-cobalt materials and methods of thermally stabilizing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5112920A (en) * 1990-03-12 1992-05-12 The Dow Chemical Company Amine containing monomers
US6099624A (en) * 1997-07-09 2000-08-08 Elf Atochem North America, Inc. Nickel-phosphorus alloy coatings
US6406611B1 (en) * 1999-12-08 2002-06-18 University Of Alabama In Huntsville Nickel cobalt phosphorous low stress electroplating
US20050170201A1 (en) * 2004-02-04 2005-08-04 The Boeing Company Cobalt-phosphorous-boron coating and process for plating

Also Published As

Publication number Publication date
JP2007308801A (en) 2007-11-29
US20070272559A1 (en) 2007-11-29

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