TW200717691A - Aligner - Google Patents

Aligner

Info

Publication number
TW200717691A
TW200717691A TW095120245A TW95120245A TW200717691A TW 200717691 A TW200717691 A TW 200717691A TW 095120245 A TW095120245 A TW 095120245A TW 95120245 A TW95120245 A TW 95120245A TW 200717691 A TW200717691 A TW 200717691A
Authority
TW
Taiwan
Prior art keywords
wafer
holding
link mechanism
aligner
link
Prior art date
Application number
TW095120245A
Other languages
English (en)
Other versions
TWI309071B (zh
Inventor
Keisuke Yoshino
Mitsuaki Hagio
Shin Osaki
Yoshihiro Kusama
Original Assignee
Yaskawa Denki Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Denki Seisakusho Kk filed Critical Yaskawa Denki Seisakusho Kk
Publication of TW200717691A publication Critical patent/TW200717691A/zh
Application granted granted Critical
Publication of TWI309071B publication Critical patent/TWI309071B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/12—Chucks or sockets with fluid-pressure actuator
    • Y10T279/1274—Radially reciprocating jaws
    • Y10T279/1291—Fluid pressure moves jaws via mechanical connection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/19—Radially reciprocating jaws
    • Y10T279/1953—Toggle actuated

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095120245A 2005-06-13 2006-06-07 Aligner TW200717691A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005171772 2005-06-13

Publications (2)

Publication Number Publication Date
TW200717691A true TW200717691A (en) 2007-05-01
TWI309071B TWI309071B (zh) 2009-04-21

Family

ID=37532126

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120245A TW200717691A (en) 2005-06-13 2006-06-07 Aligner

Country Status (6)

Country Link
US (1) US7789614B2 (zh)
JP (2) JP4600784B2 (zh)
KR (1) KR100915509B1 (zh)
CN (1) CN100539066C (zh)
TW (1) TW200717691A (zh)
WO (1) WO2006134760A1 (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008103544A (ja) * 2006-10-19 2008-05-01 Yaskawa Electric Corp アライナー装置
JP4634427B2 (ja) * 2007-09-27 2011-02-16 株式会社東芝 照明装置及びパターン検査装置
JP4697211B2 (ja) * 2007-10-18 2011-06-08 株式会社安川電機 基板アライメント機構を備えた搬送ロボット及びそれを備えた半導体製造装置または基板検査装置
JP5295259B2 (ja) * 2008-10-22 2013-09-18 川崎重工業株式会社 プリアライナー装置
US8317450B2 (en) * 2008-10-30 2012-11-27 Lam Research Corporation Tactile wafer lifter and methods for operating the same
JP6080119B2 (ja) * 2012-06-15 2017-02-15 アテル株式会社 アライナ装置
CN103576464B (zh) * 2012-07-20 2016-03-09 上海微电子装备有限公司 一种推顶机构及具有该推顶机构的光刻装置
KR102111183B1 (ko) * 2012-08-31 2020-05-14 세미컨덕터 테크놀로지스 앤드 인스트루먼츠 피티이 엘티디 다기능 웨이퍼 및 필름 프레임 조작 시스템
CN103811388A (zh) * 2012-11-08 2014-05-21 沈阳新松机器人自动化股份有限公司 两工位晶圆预对准装置
KR102136787B1 (ko) * 2013-03-14 2020-07-23 삼성디스플레이 주식회사 진공증착기
ES2693512T3 (es) * 2013-07-29 2018-12-12 Siemens Aktiengesellschaft Dispositivo de agarre de pala
CN104635753A (zh) * 2013-11-14 2015-05-20 沈阳新松机器人自动化股份有限公司 一种基于激光位移传感器的预对准装置及系统
CN103757590B (zh) * 2013-12-31 2016-04-20 深圳市华星光电技术有限公司 一种镀膜机坩埚设备
CN107393855B (zh) * 2016-05-17 2020-10-09 上海新昇半导体科技有限公司 一种晶圆定位装置及方法
US10133186B2 (en) 2016-10-20 2018-11-20 Mapper Lithography Ip B.V. Method and apparatus for aligning substrates on a substrate support unit
KR102217780B1 (ko) * 2018-06-12 2021-02-19 피에스케이홀딩스 (주) 정렬 장치
CN113853550A (zh) * 2019-02-28 2021-12-28 Asml荷兰有限公司 用于组装掩模版组件的设备
CN109972953B (zh) * 2019-03-27 2020-11-03 江苏卓燃工程咨询有限公司 一种用于塑钢门窗的滑轮
CN115849152B (zh) * 2023-02-22 2023-05-23 联海装配式建材有限公司 一种建材加工用吊装机构
CN117984261B (zh) * 2024-04-03 2024-07-26 山西建筑工程集团有限公司 一种管道安装用辅助装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US959515A (en) * 1909-05-17 1910-05-31 Paul J Grebel Chuck.
US2915814A (en) * 1956-12-31 1959-12-08 Phillips Control Corp Relay assembly fixture
US4788994A (en) * 1986-08-13 1988-12-06 Dainippon Screen Mfg. Co. Wafer holding mechanism
US5566466A (en) * 1994-07-01 1996-10-22 Ontrak Systems, Inc. Spindle assembly with improved wafer holder
DE19529537A1 (de) * 1995-08-11 1997-02-13 Leybold Ag Vorrichtung zum Greifen und Halten eines flachen Substrats
US5851041A (en) * 1996-06-26 1998-12-22 Ontrak Systems, Inc. Wafer holder with spindle assembly and wafer holder actuator
JPH11283957A (ja) 1998-03-31 1999-10-15 Kaijo Corp 半導体ウェハの枚葉式スピン乾燥装置
US5990650A (en) * 1998-11-25 1999-11-23 Lumonics Corporation Method and apparatus for orienting a disk via edge contact
JP3217323B2 (ja) * 1999-03-03 2001-10-09 保 目崎 半導体材料の遠心処理装置
JP2001295809A (ja) * 2000-04-11 2001-10-26 Smc Corp ガイド付きシリンダ
JP2002043393A (ja) 2000-07-25 2002-02-08 Assist Japan Kk ノッチ合わせ装置
US6435807B1 (en) * 2000-12-14 2002-08-20 Genmark Automation Integrated edge gripper
US6578853B1 (en) * 2000-12-22 2003-06-17 Lam Research Corporation Chuck assembly for use in a spin, rinse, and dry module and methods for making and implementing the same
JP3908054B2 (ja) * 2002-02-20 2007-04-25 株式会社ジェーイーエル アライナー装置
JP4365605B2 (ja) * 2002-07-26 2009-11-18 大日本スクリーン製造株式会社 基板保持装置および基板保持方法、ならびにそれらを用いた基板処理装置および基板処理方法
JP2004186633A (ja) * 2002-12-06 2004-07-02 Shimada Phys & Chem Ind Co Ltd 平板状被処理物の処理装置および処理方法
JP2006024805A (ja) * 2004-07-09 2006-01-26 Hitachi Industries Co Ltd 半導体薄板の位置合わせ装置

Also Published As

Publication number Publication date
KR20070121803A (ko) 2007-12-27
CN100539066C (zh) 2009-09-09
JPWO2006134760A1 (ja) 2009-01-08
JP4858635B2 (ja) 2012-01-18
KR100915509B1 (ko) 2009-09-03
US7789614B2 (en) 2010-09-07
US20090053029A1 (en) 2009-02-26
WO2006134760A1 (ja) 2006-12-21
CN101194354A (zh) 2008-06-04
JP2010258480A (ja) 2010-11-11
TWI309071B (zh) 2009-04-21
JP4600784B2 (ja) 2010-12-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees