TW200714538A - Movable transfer chamber and substrate-treating apparatus including the same - Google Patents

Movable transfer chamber and substrate-treating apparatus including the same

Info

Publication number
TW200714538A
TW200714538A TW095130310A TW95130310A TW200714538A TW 200714538 A TW200714538 A TW 200714538A TW 095130310 A TW095130310 A TW 095130310A TW 95130310 A TW95130310 A TW 95130310A TW 200714538 A TW200714538 A TW 200714538A
Authority
TW
Taiwan
Prior art keywords
substrate
transfer chamber
treating apparatus
apparatus including
movable transfer
Prior art date
Application number
TW095130310A
Other languages
English (en)
Other versions
TWI423915B (zh
Inventor
Klaus Hugler
Original Assignee
Jusung Eng Co Ltd
Asys Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jusung Eng Co Ltd, Asys Gmbh filed Critical Jusung Eng Co Ltd
Publication of TW200714538A publication Critical patent/TW200714538A/zh
Application granted granted Critical
Publication of TWI423915B publication Critical patent/TWI423915B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
TW095130310A 2005-08-18 2006-08-17 可移動傳送室及包含此可移動傳送室之基板處理裝置 TWI423915B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005039453A DE102005039453B4 (de) 2005-08-18 2005-08-18 Bearbeitungsanlage modularen Aufbaus für flächige Substrate
KR1020060052510A KR101292805B1 (ko) 2005-08-18 2006-06-12 이동식 이송챔버를 포함하는 기판처리장치

Publications (2)

Publication Number Publication Date
TW200714538A true TW200714538A (en) 2007-04-16
TWI423915B TWI423915B (zh) 2014-01-21

Family

ID=36997637

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130310A TWI423915B (zh) 2005-08-18 2006-08-17 可移動傳送室及包含此可移動傳送室之基板處理裝置

Country Status (6)

Country Link
US (1) US7845892B2 (zh)
EP (1) EP1755151B1 (zh)
KR (1) KR101292805B1 (zh)
CN (1) CN101090085B (zh)
DE (2) DE102005039453B4 (zh)
TW (1) TWI423915B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070051314A1 (en) * 2005-09-08 2007-03-08 Jusung Engineering Co., Ltd. Movable transfer chamber and substrate-treating apparatus including the same
DE102007052027B3 (de) * 2007-10-31 2009-04-16 Grenzebach Maschinenbau Gmbh Verfahren und Vorrichtung zur kontaminationsfreien Behandlung stoßempfindlicher Glasplatten in Reinsträumen
JP4406666B2 (ja) * 2008-02-20 2010-02-03 シャープ株式会社 真空処理装置および真空処理工場
DE102008045370B4 (de) 2008-09-02 2010-07-08 Grenzebach Maschinenbau Gmbh Verfahren und Vorrichtung zum Transport großflächiger, dünner Glasplatten
DE202008011686U1 (de) 2008-09-02 2008-11-27 Grenzebach Maschinenbau Gmbh Vorrichtung zum Transport großflächiger dünner Glasplatten
DE102008049341B4 (de) 2008-09-29 2017-02-02 Asys Automatic Systems Gmbh & Co. Kg Transportsystem für Bearbeitungsanlagen von Substraten
DE102008049342B4 (de) 2008-09-29 2017-02-02 Asys Automatic Systems Gmbh & Co. Kg Transfereinrichtung für Substrate
DE102008050221B3 (de) * 2008-10-02 2010-05-06 Grenzebach Maschinenbau Gmbh Verfahren und Vorrichtung zum Beladen eines Behälters mit Produkten aus großflächigen dünnen Glasscheiben
DE202008014680U1 (de) 2008-11-05 2009-04-23 TECO Gesellschaft für automatische Testsysteme mbH Transportvorrichtung
JP4766500B2 (ja) * 2009-08-26 2011-09-07 シャープ株式会社 真空処理装置、および真空処理工場
DE102010008233A1 (de) * 2010-02-11 2011-08-11 Schmid Technology GmbH, 68723 Vorrichtung und Verfahren zum Transport von Substraten
DE102010013297A1 (de) 2010-03-29 2011-09-29 Asys Automatic Systems Gmbh & Co. Kg Transfereinrichtung für Bearbeitungsanlagen von Substraten
DE102010022625A1 (de) 2010-06-04 2011-12-08 Festo Ag & Co. Kg Handhabungssystem zur Handhabung von Gegenständen
DE102013104030A1 (de) * 2013-04-22 2014-10-23 Aixtron Se Transportmodul für eine Halbleiterfertigungseinrichtung
DE102013009484B4 (de) * 2013-06-06 2021-05-20 Asys Automatic Systems Gmbh & Co. Kg Bearbeitungsanlage polaren Aufbaus für planare Substrate, Handhabungsvorrichtung, Kupplungsanordnung und Roboter für eine Bearbeitungsanlage
CN105448767B (zh) * 2014-06-03 2018-02-13 上海理想万里晖薄膜设备有限公司 实现基板正交传送的真空搬运装置及其搬运方法
FR3055620B1 (fr) * 2016-09-07 2021-04-02 Centre Nat Rech Scient Procede de transport et de stockage d'une plaque semiconductrice en enceinte hermetique
KR200493286Y1 (ko) * 2019-08-12 2021-03-05 (주)에이피텍 높이 조절 베이스 인라인 시스템
US11456197B2 (en) * 2019-12-17 2022-09-27 Applied Materials, Inc. Systems and methods for providing maintenance access to electronic device manufacturing tools
US11829158B2 (en) * 2021-08-25 2023-11-28 Rockwell Automation Technologies, Inc. System and method for synchronizing motion of multiple vehicles in an independent cart system
CN218069808U (zh) * 2022-09-14 2022-12-16 台湾积体电路制造股份有限公司 运输装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3584847A (en) * 1968-05-31 1971-06-15 Western Electric Co Advancing workpieces through a sputtering chamber
DE2028862A1 (de) * 1970-06-11 1971-12-16 Steigerwald K Druckschleusensystem fur eine Kammer, in der ein vom Umgebungsdruck abweichender Druck herrscht
JP2559617B2 (ja) * 1988-03-24 1996-12-04 キヤノン株式会社 基板処理装置
JPH0756879B2 (ja) * 1988-03-31 1995-06-14 日鉄セミコンダクター株式会社 半導体の無塵化製造装置
JPH081923B2 (ja) * 1991-06-24 1996-01-10 ティーディーケイ株式会社 クリーン搬送方法及び装置
JPH0697258A (ja) * 1992-09-17 1994-04-08 Hitachi Ltd 連続真空処理装置
JP3275390B2 (ja) * 1992-10-06 2002-04-15 神鋼電機株式会社 可搬式密閉コンテナ流通式の自動搬送システム
JPH06206149A (ja) * 1992-12-02 1994-07-26 Hitachi Ltd 生産ライン
US5417537A (en) * 1993-05-07 1995-05-23 Miller; Kenneth C. Wafer transport device
JPH0750334A (ja) * 1993-08-03 1995-02-21 Dainippon Screen Mfg Co Ltd 基板処理装置
US5607276A (en) * 1995-07-06 1997-03-04 Brooks Automation, Inc. Batchloader for substrate carrier on load lock
US6545775B1 (en) * 1995-07-21 2003-04-08 Canon Kabushiki Kaisha Control system and units removably attachable to the same
US6749390B2 (en) * 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
DE19642763B4 (de) * 1996-10-16 2009-06-10 Erwin Junker Maschinenfabrik Gmbh Vorrichtung zum Be- und Entladen von Werkzeugmaschinen
US5980183A (en) 1997-04-14 1999-11-09 Asyst Technologies, Inc. Integrated intrabay buffer, delivery, and stocker system
CN1411420A (zh) * 1998-07-11 2003-04-16 塞米用具公司 用于装卸微电子工件的机器人
DE19900804C2 (de) * 1999-01-12 2000-10-19 Siemens Ag Fördersystem
JP2000286318A (ja) * 1999-01-27 2000-10-13 Shinko Electric Co Ltd 搬送システム
TW463207B (en) * 1999-03-17 2001-11-11 Fujitsu Ltd Double-sealed work conveying and transferring apparatus and container inspecting method
US6364593B1 (en) * 2000-06-06 2002-04-02 Brooks Automation Material transport system
KR100640105B1 (ko) * 2001-04-19 2006-10-30 무라타 기카이 가부시키가이샤 무인운반차, 무인운반차시스템 및 웨이퍼운반방법
TWI232509B (en) * 2001-07-25 2005-05-11 Tokyo Electron Ltd Processing apparatus and processing method
TW200505776A (en) 2003-01-31 2005-02-16 Aviza Tech Inc Transport system having shared load-lock front-end assembly
US6679672B1 (en) * 2003-03-10 2004-01-20 Syracuse University Transfer port for movement of materials between clean rooms
KR100555620B1 (ko) * 2003-10-28 2006-03-03 주식회사 디엠에스 기판 운반시스템 및 운반방법
JP2008511178A (ja) * 2004-08-23 2008-04-10 ブルックス オートメーション インコーポレイテッド エレベータベースのツールローディング及びバッファリングシステム
US7410340B2 (en) * 2005-02-24 2008-08-12 Asyst Technologies, Inc. Direct tool loading
US7771150B2 (en) * 2005-08-26 2010-08-10 Jusung Engineering Co., Ltd. Gate valve and substrate-treating apparatus including the same

Also Published As

Publication number Publication date
CN101090085B (zh) 2011-09-14
DE102005039453A1 (de) 2007-03-01
EP1755151B1 (de) 2007-10-03
US7845892B2 (en) 2010-12-07
EP1755151A1 (de) 2007-02-21
DE502006000120D1 (de) 2007-11-15
TWI423915B (zh) 2014-01-21
DE102005039453B4 (de) 2007-06-28
CN101090085A (zh) 2007-12-19
KR20070021901A (ko) 2007-02-23
US20070059129A1 (en) 2007-03-15
KR101292805B1 (ko) 2013-08-02

Similar Documents

Publication Publication Date Title
TW200714538A (en) Movable transfer chamber and substrate-treating apparatus including the same
TW200634170A (en) Pressure control system in a photovoltaic substrate deposition apparatus
WO2006053218A8 (en) Pressure control system in a photovoltaic substrate deposition
WO2007024997A3 (en) Methods of increasing production of secondary metabolites
TWI256686B (en) Substrate reversing device, substrate transporting device, substrate processing device, substrate reversing method, substrate transporting method and substrate processing method
TW200745368A (en) Gate valve and substrate-treating apparatus including the same
IL182869A0 (en) Non-hygroscopic and powdery amorphous pimecrolimus
TW200715448A (en) Vacuum processing apparatus, semiconductor device manufacturing method and semiconductor device manufacturing system
WO2009050849A1 (ja) 基板処理装置
TW200721357A (en) Movable transfer chamber and substrate-treating apparatus including the same
AU2003239969A8 (en) Cancer-linked gene as target for chemotherapy
EP1576111A4 (en) CANCER-ASSOCIATED GENE AS A TARGET FOR CHEMOTHERAPY
AU2003229294A1 (en) Cancer-linked gene as target for chemotherapy
WO2008114351A1 (ja) 基地局、無線制御装置および無線装置
WO2009037754A1 (ja) 基板搬送システム
CA2431531A1 (en) Arrangement for conveying a plate-like product from one position to another
TW200740678A (en) Substrate transfer apparatus
TW200702466A (en) Apparatus for vacuum deposition
TW200710238A (en) Furnace wall mechanism and film deposition apparatus
EP1736427A3 (en) Transfer wheel
PL1855969T3 (pl) Urządzenie i sposób (de)paletyzacji produktów
WO2004004646A3 (en) O-derivatized nocathiacin derivatives
MY149242A (en) Circuit carrier
AU2003238897A8 (en) Cancer-linked gene as target for chemotherapy
EP1572712A4 (en) CANCER-RELATED GENES AS TARGETS OF CHEMOTHERAPY

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees