TW200713464A - Selective deposition of germanium spacers on nitride - Google Patents

Selective deposition of germanium spacers on nitride

Info

Publication number
TW200713464A
TW200713464A TW095100790A TW95100790A TW200713464A TW 200713464 A TW200713464 A TW 200713464A TW 095100790 A TW095100790 A TW 095100790A TW 95100790 A TW95100790 A TW 95100790A TW 200713464 A TW200713464 A TW 200713464A
Authority
TW
Taiwan
Prior art keywords
nitride
germanium
selective deposition
oxide
spacers
Prior art date
Application number
TW095100790A
Other languages
English (en)
Chinese (zh)
Inventor
Ashima B Chakravarti
Anthony I Chou
Toshiharu Furukawa
Steven J Holmes
Wesley C Natzle
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of TW200713464A publication Critical patent/TW200713464A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
    • H10D30/0227—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/015—Manufacture or treatment removing at least parts of gate spacers, e.g. disposable spacers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/021—Manufacture or treatment using multiple gate spacer layers, e.g. bilayered sidewall spacers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/27—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials
    • H10P14/271—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3451—Structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0212—Manufacture or treatment of FETs having insulated gates [IGFET] using self-aligned silicidation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/283—Reinforcing structures, e.g. bump collars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Drying Of Semiconductors (AREA)
TW095100790A 2005-09-12 2006-01-09 Selective deposition of germanium spacers on nitride TW200713464A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/905,587 US7705385B2 (en) 2005-09-12 2005-09-12 Selective deposition of germanium spacers on nitride

Publications (1)

Publication Number Publication Date
TW200713464A true TW200713464A (en) 2007-04-01

Family

ID=37855727

Family Applications (2)

Application Number Title Priority Date Filing Date
TW095100790A TW200713464A (en) 2005-09-12 2006-01-09 Selective deposition of germanium spacers on nitride
TW102132073A TWI496221B (zh) 2005-09-12 2006-01-09 半導體結構與鍺結構

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW102132073A TWI496221B (zh) 2005-09-12 2006-01-09 半導體結構與鍺結構

Country Status (4)

Country Link
US (3) US7705385B2 (https=)
JP (2) JP5270067B2 (https=)
CN (1) CN100570884C (https=)
TW (2) TW200713464A (https=)

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US7687804B2 (en) * 2008-01-08 2010-03-30 International Business Machines Corporation Method for fabricating a semiconductor structures and structures thereof
US8580646B2 (en) * 2010-11-18 2013-11-12 International Business Machines Corporation Method of fabricating field effect transistors with low k sidewall spacers
KR20160053001A (ko) * 2014-10-30 2016-05-13 삼성디스플레이 주식회사 투명 표시 기판, 투명 표시 장치 및 투명 표시 장치의 제조 방법
US10037923B1 (en) * 2017-04-19 2018-07-31 Taiwan Semiconductor Manufacturing Company, Ltd. Forming transistor by selectively growing gate spacer
CN109309006B (zh) * 2017-07-27 2021-10-15 中芯国际集成电路制造(上海)有限公司 半导体器件及其形成方法
JP7221187B2 (ja) * 2019-09-30 2023-02-13 東京エレクトロン株式会社 成膜方法、及び成膜装置

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JPS63239934A (ja) * 1987-03-27 1988-10-05 Canon Inc 半導体基材の製造方法
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US5721443A (en) * 1995-07-13 1998-02-24 Micron Technology, Inc. NMOS field effect transistors and methods of forming NMOS field effect transistors
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KR100406537B1 (ko) * 2001-12-03 2003-11-20 주식회사 하이닉스반도체 반도체장치의 제조 방법
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Also Published As

Publication number Publication date
US20080242041A1 (en) 2008-10-02
JP2012069964A (ja) 2012-04-05
US7705385B2 (en) 2010-04-27
JP5270067B2 (ja) 2013-08-21
TWI496221B (zh) 2015-08-11
US8900961B2 (en) 2014-12-02
CN100570884C (zh) 2009-12-16
CN1933175A (zh) 2007-03-21
US20070059894A1 (en) 2007-03-15
US20110034000A1 (en) 2011-02-10
JP2007081361A (ja) 2007-03-29
JP5388312B2 (ja) 2014-01-15
US7888241B2 (en) 2011-02-15
TW201403719A (zh) 2014-01-16

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