TW200711027A - Substrate processing system and substrate processing method - Google Patents

Substrate processing system and substrate processing method

Info

Publication number
TW200711027A
TW200711027A TW095120073A TW95120073A TW200711027A TW 200711027 A TW200711027 A TW 200711027A TW 095120073 A TW095120073 A TW 095120073A TW 95120073 A TW95120073 A TW 95120073A TW 200711027 A TW200711027 A TW 200711027A
Authority
TW
Taiwan
Prior art keywords
transportation
substrate
substrate processing
processing system
module
Prior art date
Application number
TW095120073A
Other languages
English (en)
Other versions
TWI305943B (en
Inventor
Yasushi Hayashida
Shinichi Hayashi
Yoshitaka Hara
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200711027A publication Critical patent/TW200711027A/zh
Application granted granted Critical
Publication of TWI305943B publication Critical patent/TWI305943B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Multi-Process Working Machines And Systems (AREA)
TW095120073A 2005-06-07 2006-06-06 Substrate processing system and substrate processing method TWI305943B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005166939A JP4716362B2 (ja) 2005-06-07 2005-06-07 基板処理システム及び基板処理方法

Publications (2)

Publication Number Publication Date
TW200711027A true TW200711027A (en) 2007-03-16
TWI305943B TWI305943B (en) 2009-02-01

Family

ID=37494719

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120073A TWI305943B (en) 2005-06-07 2006-06-06 Substrate processing system and substrate processing method

Country Status (5)

Country Link
US (2) US7645713B2 (zh)
JP (1) JP4716362B2 (zh)
KR (1) KR101092065B1 (zh)
CN (1) CN1877451B (zh)
TW (1) TWI305943B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4999415B2 (ja) * 2006-09-29 2012-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理装置の用力供給装置及び基板処理装置の用力供給方法
TW200919117A (en) * 2007-08-28 2009-05-01 Tokyo Electron Ltd Coating-developing apparatus, coating-developing method and storage medium
JP5458633B2 (ja) * 2008-06-20 2014-04-02 株式会社Ｉｈｉ 処理設備及び搬送制御方法
JP4954162B2 (ja) * 2008-08-29 2012-06-13 東京エレクトロン株式会社 処理システム
JP5469015B2 (ja) * 2009-09-30 2014-04-09 東京エレクトロン株式会社 基板処理装置および基板搬送方法
JP5713081B2 (ja) * 2010-07-09 2015-05-07 東京エレクトロン株式会社 塗布、現像装置
JP2012080077A (ja) * 2010-09-06 2012-04-19 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP5566265B2 (ja) * 2010-11-09 2014-08-06 東京エレクトロン株式会社 基板処理装置、プログラム、コンピュータ記憶媒体及び基板の搬送方法
US9196551B2 (en) * 2011-08-26 2015-11-24 Taiwan Semiconductor Manufacturing Company, Ltd. Automatically adjusting baking process for low-k dielectric material
JP5459279B2 (ja) * 2011-09-02 2014-04-02 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6105982B2 (ja) * 2012-09-21 2017-03-29 株式会社Ｓｃｒｅｅｎホールディングス スケジュール作成装置、基板処理装置、スケジュール作成プログラム、スケジュール作成方法、および基板処理方法
JP6003859B2 (ja) * 2013-09-18 2016-10-05 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
US10354902B2 (en) * 2015-12-08 2019-07-16 Murata Machinery, Ltd. Conveyance system
JP7302358B2 (ja) * 2019-01-28 2023-07-04 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10112487A (ja) * 1996-10-07 1998-04-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2001093791A (ja) * 1999-09-20 2001-04-06 Hitachi Ltd 真空処理装置の運転方法及びウエハの処理方法
JP2002110496A (ja) * 2000-09-27 2002-04-12 Hitachi Kokusai Electric Inc 半導体製造装置
JP3862596B2 (ja) * 2002-05-01 2006-12-27 東京エレクトロン株式会社 基板処理方法
JP4342147B2 (ja) * 2002-05-01 2009-10-14 大日本スクリーン製造株式会社 基板処理装置
JP4087328B2 (ja) 2002-11-28 2008-05-21 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法
JP4302575B2 (ja) * 2003-05-30 2009-07-29 東京エレクトロン株式会社 基板搬送装置および真空処理装置
JP4202220B2 (ja) * 2003-09-22 2008-12-24 大日本スクリーン製造株式会社 検査装置、基板処理装置および基板処理方法

Also Published As

Publication number Publication date
US7645713B2 (en) 2010-01-12
CN1877451A (zh) 2006-12-13
KR20060127795A (ko) 2006-12-13
US7880859B2 (en) 2011-02-01
CN1877451B (zh) 2011-05-25
TWI305943B (en) 2009-02-01
JP2006344658A (ja) 2006-12-21
KR101092065B1 (ko) 2011-12-12
US20100063623A1 (en) 2010-03-11
US20060276046A1 (en) 2006-12-07
JP4716362B2 (ja) 2011-07-06

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