TW200709751A - Polyimide copper foil laminate and method of producing the same - Google Patents

Polyimide copper foil laminate and method of producing the same

Info

Publication number
TW200709751A
TW200709751A TW094129958A TW94129958A TW200709751A TW 200709751 A TW200709751 A TW 200709751A TW 094129958 A TW094129958 A TW 094129958A TW 94129958 A TW94129958 A TW 94129958A TW 200709751 A TW200709751 A TW 200709751A
Authority
TW
Taiwan
Prior art keywords
copper foil
polyimide
foil laminate
producing
heat
Prior art date
Application number
TW094129958A
Other languages
English (en)
Inventor
Pei-Rong Kuo
Kuo-Wei Li
Original Assignee
Thinflex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thinflex Corp filed Critical Thinflex Corp
Priority to TW094129958A priority Critical patent/TW200709751A/zh
Priority to US11/294,387 priority patent/US20070044910A1/en
Priority to KR1020060007090A priority patent/KR100707056B1/ko
Priority to JP2006032141A priority patent/JP2007062352A/ja
Publication of TW200709751A publication Critical patent/TW200709751A/zh

Links

Classifications

    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01M—CATCHING, TRAPPING OR SCARING OF ANIMALS; APPARATUS FOR THE DESTRUCTION OF NOXIOUS ANIMALS OR NOXIOUS PLANTS
    • A01M7/00—Special adaptations or arrangements of liquid-spraying apparatus for purposes covered by this subclass
    • A01M7/0089—Regulating or controlling systems
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
    • A01G9/00—Cultivation in receptacles, forcing-frames or greenhouses; Edging for beds, lawn or the like
    • A01G9/24—Devices or systems for heating, ventilating, regulating temperature, illuminating, or watering, in greenhouses, forcing-frames, or the like
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
    • A01G9/00—Cultivation in receptacles, forcing-frames or greenhouses; Edging for beds, lawn or the like
    • A01G9/24—Devices or systems for heating, ventilating, regulating temperature, illuminating, or watering, in greenhouses, forcing-frames, or the like
    • A01G9/247—Watering arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
    • B05B3/18—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with elements moving in a straight line, e.g. along a track; Mobile sprinklers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/05—5 or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2274/00—Thermoplastic elastomer material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
TW094129958A 2005-08-31 2005-08-31 Polyimide copper foil laminate and method of producing the same TW200709751A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW094129958A TW200709751A (en) 2005-08-31 2005-08-31 Polyimide copper foil laminate and method of producing the same
US11/294,387 US20070044910A1 (en) 2005-08-31 2005-12-06 Polyimide based flexible copper clad laminates and method of producing the same
KR1020060007090A KR100707056B1 (ko) 2005-08-31 2006-01-24 폴리이미드계 연성 동박 적층판 및 그 제조 방법
JP2006032141A JP2007062352A (ja) 2005-08-31 2006-02-09 ポリイミド銅箔積層板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094129958A TW200709751A (en) 2005-08-31 2005-08-31 Polyimide copper foil laminate and method of producing the same

Publications (1)

Publication Number Publication Date
TW200709751A true TW200709751A (en) 2007-03-01

Family

ID=37802400

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129958A TW200709751A (en) 2005-08-31 2005-08-31 Polyimide copper foil laminate and method of producing the same

Country Status (4)

Country Link
US (1) US20070044910A1 (zh)
JP (1) JP2007062352A (zh)
KR (1) KR100707056B1 (zh)
TW (1) TW200709751A (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103460821A (zh) * 2011-04-01 2013-12-18 株式会社村田制作所 元器件内置树脂基板及其制造方法
CN104073155A (zh) * 2013-03-25 2014-10-01 北京化工大学 一种240级共混聚酰亚胺漆包线漆的制备方法
CN104325774A (zh) * 2014-08-20 2015-02-04 杭州福斯特光伏材料股份有限公司 一种二层无胶型双面挠性覆铜板的制备方法
CN104842625A (zh) * 2015-05-21 2015-08-19 成都多吉昌新材料有限公司 一种双层介质无胶挠性覆铜板的制备方法
DE102016210870A1 (de) 2015-06-17 2016-12-22 Eternal Materials Co., Ltd. Polyimidvorstufenzusammensetzung und ihre Verwendung und daraus hergestelltes Polyimid
DE102016210871A1 (de) 2015-06-17 2016-12-22 Eternal Materials Co., Ltd. Polyimidharz und metallkaschiertes Laminat, welches dasselbe umfasst
DE102016210892A1 (de) 2015-06-17 2016-12-22 Eternal Materials Co., Ltd. Metallkaschiertes Laminat, Herstellungsverfahren davon, und Verfahren zum Herstellen einer flexiblen Leiterplatte unter Verwendung desselben

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7807215B2 (en) * 2006-09-21 2010-10-05 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing copper-clad laminate for VOP application
US9141157B2 (en) * 2011-10-13 2015-09-22 Texas Instruments Incorporated Molded power supply system having a thermally insulated component
US9182963B2 (en) * 2012-06-18 2015-11-10 Syntel, Inc. Computerized migration tool and method
CN105015099B (zh) * 2014-04-30 2017-06-06 台虹科技股份有限公司 聚酰亚胺/金属复合积层板及其制备方法
US9694569B2 (en) 2014-06-24 2017-07-04 Taiflex Scientific Co., Ltd. Polyimide metal laminated plate and method of making the same
CN104859223B (zh) * 2015-05-21 2018-01-05 成都多吉昌新材料股份有限公司 一种双层介质无胶挠性覆铜板
CN106211596A (zh) * 2016-06-30 2016-12-07 杭州福斯特光伏材料股份有限公司 一种双面挠性覆铜板及其制备方法
KR101696347B1 (ko) * 2016-08-30 2017-01-13 (주)아이피아이테크 반도체 패키지 리플로우 공정용 폴리이미드 필름 및 그 제조 방법
CN109503836A (zh) * 2018-09-28 2019-03-22 广东圣帕新材料股份有限公司 聚酰胺酸树脂的制备方法及双面柔性覆铜板的制备方法
CN110191576B (zh) * 2019-05-28 2019-12-13 广东翔思新材料有限公司 一种覆铜板基板的制造工艺

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
US5374469A (en) * 1991-09-19 1994-12-20 Nitto Denko Corporation Flexible printed substrate
CN1753782B (zh) * 2003-06-25 2010-04-28 信越化学工业株式会社 挠性金属箔-聚酰亚胺层压体

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103460821A (zh) * 2011-04-01 2013-12-18 株式会社村田制作所 元器件内置树脂基板及其制造方法
CN103460821B (zh) * 2011-04-01 2016-08-10 株式会社村田制作所 元器件内置树脂基板及其制造方法
US10555421B2 (en) 2011-04-01 2020-02-04 Murata Manufacturing Co., Ltd. Component-embedded resin substrate and method for manufacturing same
CN104073155A (zh) * 2013-03-25 2014-10-01 北京化工大学 一种240级共混聚酰亚胺漆包线漆的制备方法
CN104073155B (zh) * 2013-03-25 2016-09-07 北京化工大学 一种240级共混聚酰亚胺漆包线漆的制备方法
CN104325774A (zh) * 2014-08-20 2015-02-04 杭州福斯特光伏材料股份有限公司 一种二层无胶型双面挠性覆铜板的制备方法
CN104325774B (zh) * 2014-08-20 2016-06-22 杭州福斯特光伏材料股份有限公司 一种二层无胶型双面挠性覆铜板的制备方法
CN104842625A (zh) * 2015-05-21 2015-08-19 成都多吉昌新材料有限公司 一种双层介质无胶挠性覆铜板的制备方法
DE102016210870A1 (de) 2015-06-17 2016-12-22 Eternal Materials Co., Ltd. Polyimidvorstufenzusammensetzung und ihre Verwendung und daraus hergestelltes Polyimid
DE102016210871A1 (de) 2015-06-17 2016-12-22 Eternal Materials Co., Ltd. Polyimidharz und metallkaschiertes Laminat, welches dasselbe umfasst
DE102016210892A1 (de) 2015-06-17 2016-12-22 Eternal Materials Co., Ltd. Metallkaschiertes Laminat, Herstellungsverfahren davon, und Verfahren zum Herstellen einer flexiblen Leiterplatte unter Verwendung desselben

Also Published As

Publication number Publication date
US20070044910A1 (en) 2007-03-01
JP2007062352A (ja) 2007-03-15
KR20070025913A (ko) 2007-03-08
KR100707056B1 (ko) 2007-04-13

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