TW200707623A - Load port and load port control method - Google Patents

Load port and load port control method

Info

Publication number
TW200707623A
TW200707623A TW095107280A TW95107280A TW200707623A TW 200707623 A TW200707623 A TW 200707623A TW 095107280 A TW095107280 A TW 095107280A TW 95107280 A TW95107280 A TW 95107280A TW 200707623 A TW200707623 A TW 200707623A
Authority
TW
Taiwan
Prior art keywords
load port
stage
control method
storing container
substrate storing
Prior art date
Application number
TW095107280A
Other languages
English (en)
Other versions
TWI321343B (zh
Inventor
Shin Osaki
Mitsuaki Hagio
Takayuki Imanaka
Original Assignee
Yaskawa Denki Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Denki Seisakusho Kk filed Critical Yaskawa Denki Seisakusho Kk
Publication of TW200707623A publication Critical patent/TW200707623A/zh
Application granted granted Critical
Publication of TWI321343B publication Critical patent/TWI321343B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
TW095107280A 2005-03-08 2006-03-03 Load port and load port control method TW200707623A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005063224 2005-03-08

Publications (2)

Publication Number Publication Date
TW200707623A true TW200707623A (en) 2007-02-16
TWI321343B TWI321343B (zh) 2010-03-01

Family

ID=36953170

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107280A TW200707623A (en) 2005-03-08 2006-03-03 Load port and load port control method

Country Status (6)

Country Link
US (1) US20090053019A1 (zh)
JP (1) JP4816637B2 (zh)
KR (1) KR101099247B1 (zh)
CN (1) CN100511630C (zh)
TW (1) TW200707623A (zh)
WO (1) WO2006095569A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101039584B1 (ko) * 2009-09-02 2011-06-09 주식회사 싸이맥스 스테이지 이동 장치
JP6038476B2 (ja) * 2012-04-07 2016-12-07 平田機工株式会社 基板収納用の容器の搬入出装置及び搬入出方法
JP6052209B2 (ja) * 2014-03-11 2016-12-27 株式会社ダイフク 容器搬送設備
KR101608831B1 (ko) 2014-06-13 2016-04-05 우범제 배출가속기 및 이를 구비한 로드 포트
KR101606082B1 (ko) 2014-07-17 2016-03-24 권병철 로드 포트용 노즐 조립체 및 그것을 구비한 로드 포트
WO2016035675A1 (ja) 2014-09-05 2016-03-10 ローツェ株式会社 ロードポート及びロードポートの雰囲気置換方法
JP6882656B2 (ja) * 2016-07-08 2021-06-02 シンフォニアテクノロジー株式会社 ロードポート及びロードポートを備える基板搬送システム
TWI605209B (zh) * 2016-08-08 2017-11-11 銀泰科技股份有限公司 應用於線性模組之訊息回饋系統及其訊息回饋方法
JP6856692B2 (ja) * 2019-03-28 2021-04-07 平田機工株式会社 ロードポート
US11094570B2 (en) * 2019-03-29 2021-08-17 Hirata Corporation Load port having movable member that abuts a pin
CN115196359A (zh) * 2022-07-27 2022-10-18 郭均 一种物流货箱锁定装置及锁定方法
KR102484437B1 (ko) * 2022-10-11 2023-01-05 주식회사 테크엑스 엘피엠용 노즐장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2852856B2 (ja) * 1993-09-29 1999-02-03 大日本スクリーン製造株式会社 基板処理装置
KR970054461U (ko) * 1996-03-26 1997-10-13 Lcd 글래스 운반용 수동 대차
JPH11176908A (ja) * 1997-12-15 1999-07-02 Tokyo Electron Ltd 容器の搬入出装置
US6427096B1 (en) * 1999-02-12 2002-07-30 Honeywell International Inc. Processing tool interface apparatus for use in manufacturing environment
US6135698A (en) * 1999-04-30 2000-10-24 Asyst Technologies, Inc. Universal tool interface and/or workpiece transfer apparatus for SMIF and open pod applications
TW460035U (en) * 2000-09-08 2001-10-11 Ind Tech Res Inst Automatic front-opening load-in device for wafer box
JP2002093877A (ja) 2000-09-12 2002-03-29 Hitachi Kokusai Electric Inc 半導体製造装置
US6530736B2 (en) * 2001-07-13 2003-03-11 Asyst Technologies, Inc. SMIF load port interface including smart port door
JP4168724B2 (ja) * 2002-10-15 2008-10-22 神鋼電機株式会社 ロードポート
US7621714B2 (en) * 2003-10-23 2009-11-24 Tdk Corporation Pod clamping unit in pod opener, pod corresponding to pod clamping unit, and clamping mechanism and clamping method using pod clamping unit
US7410340B2 (en) * 2005-02-24 2008-08-12 Asyst Technologies, Inc. Direct tool loading
US7771151B2 (en) * 2005-05-16 2010-08-10 Muratec Automation Co., Ltd. Interface between conveyor and semiconductor process tool load port

Also Published As

Publication number Publication date
JP4816637B2 (ja) 2011-11-16
KR101099247B1 (ko) 2011-12-27
KR20070114348A (ko) 2007-12-03
WO2006095569A1 (ja) 2006-09-14
CN100511630C (zh) 2009-07-08
TWI321343B (zh) 2010-03-01
JPWO2006095569A1 (ja) 2008-08-14
CN101116181A (zh) 2008-01-30
US20090053019A1 (en) 2009-02-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees