TW200703585A - Die packaging process and metal plate structure used in packaging process - Google Patents

Die packaging process and metal plate structure used in packaging process

Info

Publication number
TW200703585A
TW200703585A TW094123695A TW94123695A TW200703585A TW 200703585 A TW200703585 A TW 200703585A TW 094123695 A TW094123695 A TW 094123695A TW 94123695 A TW94123695 A TW 94123695A TW 200703585 A TW200703585 A TW 200703585A
Authority
TW
Taiwan
Prior art keywords
die
packaging process
metal plate
packaging
pins
Prior art date
Application number
TW094123695A
Other languages
Chinese (zh)
Other versions
TWI260748B (en
Inventor
Wen-Fu Jiang
Original Assignee
Wen-Fu Jiang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wen-Fu Jiang filed Critical Wen-Fu Jiang
Priority to TW094123695A priority Critical patent/TWI260748B/en
Application granted granted Critical
Publication of TWI260748B publication Critical patent/TWI260748B/en
Publication of TW200703585A publication Critical patent/TW200703585A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a die packaging process and metal plate structure used in packaging process. The die packaging process includes steps of punching a metal plate to form a plurality of package sections thereon and simultaneously bending a plurality of pins inside the packaging sections to form various required shapes; assembling an injection-molded encapsulation piece on the packaging section after an electroplating process is completed; placing a die in the encapsulation piece; filling resin to fully enclose the die to prevent oxidation of the die due to air contact; and lastly performing edge-punching process to make a product with the die packaging process drop off the metal plate. As such, crack and gap generated between the encapsulation piece and those pins due to those crooked pins and abrasion on the plated layer of those pin surfaces can be prevented, thereby effectively enhancing control of the product yield.
TW094123695A 2005-07-13 2005-07-13 Die packaging process and metal plate structure used in packaging process TWI260748B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094123695A TWI260748B (en) 2005-07-13 2005-07-13 Die packaging process and metal plate structure used in packaging process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094123695A TWI260748B (en) 2005-07-13 2005-07-13 Die packaging process and metal plate structure used in packaging process

Publications (2)

Publication Number Publication Date
TWI260748B TWI260748B (en) 2006-08-21
TW200703585A true TW200703585A (en) 2007-01-16

Family

ID=37874840

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123695A TWI260748B (en) 2005-07-13 2005-07-13 Die packaging process and metal plate structure used in packaging process

Country Status (1)

Country Link
TW (1) TWI260748B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG149724A1 (en) 2007-07-24 2009-02-27 Micron Technology Inc Semicoductor dies with recesses, associated leadframes, and associated systems and methods

Also Published As

Publication number Publication date
TWI260748B (en) 2006-08-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees