CN201638854U - Light emitting diode lead frame - Google Patents
Light emitting diode lead frame Download PDFInfo
- Publication number
- CN201638854U CN201638854U CN2010203025258U CN201020302525U CN201638854U CN 201638854 U CN201638854 U CN 201638854U CN 2010203025258 U CN2010203025258 U CN 2010203025258U CN 201020302525 U CN201020302525 U CN 201020302525U CN 201638854 U CN201638854 U CN 201638854U
- Authority
- CN
- China
- Prior art keywords
- rubber base
- conducting wire
- wire frame
- led conducting
- tablet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model relates to a light emitting diode lead frame, which comprises a frame-shaped metal plate, a plastic base assembled on the metal plate and a plurality of contact pins embedded in the plastic base. The plastic base comprises a hollow functional region and a spacing region disposed in the functional region. Two inner opposite sides of the metal plate are provided with bumps in different numbers, and the plastic base can be detached from the metal plate easily by only pressing one side of the metal plate with fewer bumps via a jig, thereby being capable of reducing required amount of jigs and lowering cost. Besides, the plastic base can not be scratched by the bumps due to overstress of the metal plate caused by over large downward-pressure of jigs during separation process of the plastic base and the metal plate.
Description
[technical field]
The utility model relates to a kind of LED conducting wire frame, relates in particular to a kind of surface adhesion type light-emitting diode lead frame.
[technical background]
The LED conducting wire frame relevant with the utility model, such as No. the 346255th, the novel patent announcement of TaiWan, China announcement.This LED conducting wire frame is included in punching press forms on the conduction tablet two metal pins, group and is located at tablet around the metal pin, is formed on rubber base, luminescence chip and lead on the tablet with the plastics injection molding method.Rubber base has the hollow functional areas, and the metal pin is embedded in the rubber base, and its part is exposed to the bottom, functional areas, and a part is extended the relative both sides of rubber base, and is bent to the contact of rubber base bottom surface as successive process along the rubber base outside.Luminescence chip is installed in the functional areas of rubber base, and is connected with the metal pin by lead.Two inboards that group is located at the tablet around the metal pin are arranged with some protuberances, are entrenched in the rubber base when the ejection formation rubber base, are used to provide the retain strength of LED conducting wire frame.When need use, can descend the swage set piece both sides simultaneously by tool, the protuberance of tablet is separated so that LED conducting wire frame is taken off on tablet with LED conducting wire frame.
But, can be when take off LED conducting wire frame the swage set piece both sides on tablet under by tool because the tablet structural strength is bigger, swage set piece is difficult for making tablet to deform under the tool, causes LED conducting wire frame to be difficult for the situation that comes off on tablet; And when increasing the tool downforce, though LED conducting wire frame is taken off in the tablet distortion, tablet can take place because of stressed excessive, cause the protuberance scratch LED conducting wire frame of tablet.
For overcoming above-mentioned defective, necessaryly provide a kind of improved LED conducting wire frame.
[utility model content]
The purpose of this utility model is to provide a kind of can conveniently separate rubber base and metal tablet, and the LED conducting wire frame of scratch rubber base can prevent that rubber base from separating with the metal tablet time.
LED conducting wire frame of the present utility model is achieved through the following technical solutions: a kind of LED conducting wire frame, it comprises that shaped as frame metal tablet, group are located at the rubber base on the metal tablet and are embedded in number of metal pin in the rubber base.Rubber base comprises the functional areas of hollow form and is located at spacer region in the functional areas.Two inboards of metal tablet are provided with the different salient point of number, are used to provide the retain strength of rubber base.
Compared with prior art, metal tablet two inboards of LED conducting wire frame of the present utility model are provided with the different salient point of number, only need less metal tablet one side of salient point number to be set by one-sided the pressing down of tool, rubber base is taken off on the metal tablet, and can reduce required tool number, and then can reduce cost; In addition, salient point scratch rubber base in the time of can avoiding greatly causing rubber base to separate with the metal tablet because of tool downforce ambassador metal tablet is stressed.
[description of drawings]
Fig. 1 is the stereogram of the utility model LED conducting wire frame.
Fig. 2 is the rubber base of the utility model LED conducting wire frame and the stereogram of metal pin.
Fig. 3 is the stereogram of the metal tablet of the utility model LED conducting wire frame.
Fig. 4 is the cutaway view along A-A direction among Fig. 2.
[embodiment]
Please join Fig. 1 to shown in Figure 4, the utility model is a kind of surface adhesion type light-emitting diode lead frame, and it comprises that group is located at the insulation rubber base 1 on the metal tablet 5 and is retained on number of metal pin 2 on the rubber base 1.
Please consult Fig. 1, Fig. 2 and shown in Figure 4 by emphasis, rubber base 1 is located on the metal tablet 5 by plastics injection molding method group, and it roughly is cuboid bathtub columnar structure.The middle part of rubber base 1 is provided with the functional areas 10 of hollow to lower recess.10 middle parts, functional areas protrude out and are provided with rectangular spacer region 11, and functional areas 10 are divided into the two parts that vary in size, and are arranged on the polarity that is used to separate metal pin 2 between the metal pin 2.Rubber base 1 along the outside of the two side of its longitudinally rubber base 1 be formed with recess 12 after metal tablet 5 separates.The upper surface flush of the upper surface of spacer region 11 and metal pin 2.
Please consult Fig. 2 to shown in Figure 4 by emphasis, metal pin 2 is made by the metal plate punching press, is embedded in the rubber base 1 when plastics ejection formation rubber base 1, and is positioned at spacer region 11 both sides of rubber base 1.Part metals pin 2 is found in 10 bottoms, functional areas, and the metal pin 2 that is positioned on the major part functional areas 10 forms installation luminescence chip 3 installation portions 21, and the metal pin 2 that is positioned on the smaller portions functional areas 10 forms the connecting portion 22 that is connected with lead 4.Part metals pin 2 is extended out to outside the sidewall of both lateral sides of rubber base 1 by installation portion 21 and connecting portion 22 respectively, and cuts and extend one section suitable length, makes its sidewall exterior bottom that can be bent to rubber base 1 respectively form kink 23.Kink 23 is lower than the bottom surface of rubber base 1, is used for the contact as successive process.Metal pin 2 is provided with perforate 24 with the junction of rubber base 1 both lateral sides sidewall, is used to strengthen the adhesion between metal pin 2 and the rubber base 1.
Please emphasis consult shown in Figure 3ly, metal tablet 5 be made its roughly rectangular casing structure simultaneously with metal pin 2 by the metal plate punching press.Two inboards of metal tablet 5 position therebetween protrude out and are provided with protuberance 51.Be equipped with some salient points 52 on the protuberance 51 of two inboards, can when plastics ejection formation rubber base 1, be entrenched in the rubber base 1, be used to provide the retain strength of rubber base 1.Wherein salient point 52 numbers that are provided with on the protuberance 51 of a side are greater than the number of the salient point 52 that is provided with on the opposite side protuberance 51, can make the less side of salient point 52 numbers is set and the interfering edge between the rubber base 1 less, when needs separate rubber base 1 on metal tablet 5, only need to press down the side that the less metal tablet 5 of salient point 52 numbers is set by tool, rubber base 1 can be separated with metal tablet 5, the downforce of required tool is less, and can avoid because of the metal tablet 5 stressed salient point 52 scratch rubber bases 1 that cause greatly.
The above only is a kind of execution mode of the present utility model, it or not whole or unique execution mode, the variation of any equivalence that those of ordinary skills take technical solutions of the utility model by reading the utility model specification is claim of the present utility model and contains.
Claims (10)
1. LED conducting wire frame, it comprises rubber base, is embedded in number of metal pin and shaped as frame metal tablet in the rubber base, rubber base is located on the metal tablet, it comprises the functional areas of hollow form and is located at spacer region in the functional areas, it is characterized in that: two inboards of described metal tablet are provided with the different salient point of number, are used to provide the retain strength of rubber base.
2. LED conducting wire frame as claimed in claim 1 is characterized in that: two inboards of described metal tablet all protrude out and are provided with protuberance, and described salient point is to protrude out setting by protuberance.
3. LED conducting wire frame as claimed in claim 2 is characterized in that: described rubber base when rubber base separates with the metal tablet and the salient point corresponding position of metal tablet be formed with recess.
4. LED conducting wire frame as claimed in claim 3 is characterized in that: the spacer region of described rubber base is divided into described functional areas the two parts that vary in size.
5. LED conducting wire frame as claimed in claim 4 is characterized in that: described metal pin partly is exposed on the functional areas of spacer region both sides of rubber base, and part extends to outside the rubber base.
6. LED conducting wire frame as claimed in claim 5 is characterized in that: the part that described metal pin is positioned on the big functional areas of rubber base forms installation portion, and the part that is positioned in the rubber base minor feature district forms connecting portion.
7. LED conducting wire frame as claimed in claim 5 is characterized in that: described metal pin extends to the outer part of rubber base and is bent to rubber base bottom formation kink, and the bottom surface of described kink is lower than the bottom surface of described rubber base.
8. LED conducting wire frame as claimed in claim 6 is characterized in that: described LED conducting wire frame also comprises luminescence chip, and described luminescence chip is installed on the big functional areas of rubber base.
9. LED conducting wire frame as claimed in claim 6 is characterized in that: the upper surface flush of the spacer region of the installation portion of described metal pin and the upper surface of connecting portion and described rubber base.
10. LED conducting wire frame as claimed in claim 7 is characterized in that: the sidewall junction of described metal pin and described rubber base is provided with perforate, is used to strengthen the adhesion of metal pin and rubber base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010203025258U CN201638854U (en) | 2010-02-08 | 2010-02-08 | Light emitting diode lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010203025258U CN201638854U (en) | 2010-02-08 | 2010-02-08 | Light emitting diode lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201638854U true CN201638854U (en) | 2010-11-17 |
Family
ID=43083358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010203025258U Expired - Fee Related CN201638854U (en) | 2010-02-08 | 2010-02-08 | Light emitting diode lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201638854U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544338A (en) * | 2010-12-10 | 2012-07-04 | 富士康(昆山)电脑接插件有限公司 | Lead frame of light-emitting diode |
| CN104433028A (en) * | 2011-11-21 | 2015-03-25 | 长广科技有限公司 | Integrated luminous part of umbrella and its lead frame |
-
2010
- 2010-02-08 CN CN2010203025258U patent/CN201638854U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544338A (en) * | 2010-12-10 | 2012-07-04 | 富士康(昆山)电脑接插件有限公司 | Lead frame of light-emitting diode |
| CN104433028A (en) * | 2011-11-21 | 2015-03-25 | 长广科技有限公司 | Integrated luminous part of umbrella and its lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101117 Termination date: 20110208 |