TW200702943A - Method and apparatus for removing organic film on substrate surface - Google Patents

Method and apparatus for removing organic film on substrate surface

Info

Publication number
TW200702943A
TW200702943A TW095108914A TW95108914A TW200702943A TW 200702943 A TW200702943 A TW 200702943A TW 095108914 A TW095108914 A TW 095108914A TW 95108914 A TW95108914 A TW 95108914A TW 200702943 A TW200702943 A TW 200702943A
Authority
TW
Taiwan
Prior art keywords
peeling liquid
film
substrate
organic film
mixed
Prior art date
Application number
TW095108914A
Other languages
English (en)
Inventor
Hiroshi Niizuma
Tomohisa Iinuma
Original Assignee
Toagosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co Ltd filed Critical Toagosei Co Ltd
Publication of TW200702943A publication Critical patent/TW200702943A/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D61/00Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
    • B01D61/14Ultrafiltration; Microfiltration
    • B01D61/145Ultrafiltration
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31127Etching organic layers
    • H01L21/31133Etching organic layers by chemical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Water Supply & Treatment (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW095108914A 2005-06-22 2006-03-16 Method and apparatus for removing organic film on substrate surface TW200702943A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005181345 2005-06-22

Publications (1)

Publication Number Publication Date
TW200702943A true TW200702943A (en) 2007-01-16

Family

ID=37570231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095108914A TW200702943A (en) 2005-06-22 2006-03-16 Method and apparatus for removing organic film on substrate surface

Country Status (5)

Country Link
JP (1) JPWO2006137194A1 (zh)
KR (1) KR20080018215A (zh)
CN (1) CN101199038A (zh)
TW (1) TW200702943A (zh)
WO (1) WO2006137194A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101689480A (zh) * 2007-07-03 2010-03-31 东亚合成株式会社 采用纳米过滤的抗蚀剂剥离液连续使用系统
JP5019393B2 (ja) * 2008-04-14 2012-09-05 東亞合成株式会社 導電性高分子膜上のレジスト被膜の除去方法および除去装置
JP5728517B2 (ja) * 2013-04-02 2015-06-03 富士フイルム株式会社 化学増幅型レジスト膜のパターニング用有機系処理液の製造方法、パターン形成方法、及び、電子デバイスの製造方法
CN111045301A (zh) * 2019-11-19 2020-04-21 Tcl华星光电技术有限公司 剥离液机台及其工作方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63178888A (ja) * 1987-01-17 1988-07-22 Sumitomo Heavy Ind Ltd フオトレジスト含有廃液の処理方法
JPH0934121A (ja) * 1995-07-20 1997-02-07 Hitachi Ltd リサイクル型レジストプロセス
JP3914842B2 (ja) * 2001-10-23 2007-05-16 有限会社ユーエムエス 有機被膜の除去方法および除去装置
JP2003167358A (ja) * 2001-11-29 2003-06-13 Nagase & Co Ltd レジスト剥離廃液の再生装置及び再生方法
JP4439883B2 (ja) * 2003-11-17 2010-03-24 野村マイクロ・サイエンス株式会社 有機被膜除去装置、有機被膜除去・洗浄装置、有機被膜除去方法及び有機被膜除去・洗浄方法

Also Published As

Publication number Publication date
CN101199038A (zh) 2008-06-11
KR20080018215A (ko) 2008-02-27
JPWO2006137194A1 (ja) 2009-01-08
WO2006137194A1 (ja) 2006-12-28

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