TW200702695A - Sensor including lead frame and method of forming sensor including lead frame - Google Patents

Sensor including lead frame and method of forming sensor including lead frame

Info

Publication number
TW200702695A
TW200702695A TW095106124A TW95106124A TW200702695A TW 200702695 A TW200702695 A TW 200702695A TW 095106124 A TW095106124 A TW 095106124A TW 95106124 A TW95106124 A TW 95106124A TW 200702695 A TW200702695 A TW 200702695A
Authority
TW
Taiwan
Prior art keywords
lead frame
sensor including
including lead
stage
forming
Prior art date
Application number
TW095106124A
Other languages
English (en)
Other versions
TWI321659B (en
Inventor
Kenichi Shirasaka
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005050879A external-priority patent/JP4127270B2/ja
Priority claimed from JP2005093636A external-priority patent/JP4320641B2/ja
Application filed by Yamaha Corp filed Critical Yamaha Corp
Publication of TW200702695A publication Critical patent/TW200702695A/zh
Application granted granted Critical
Publication of TWI321659B publication Critical patent/TWI321659B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133325—Assembling processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133328—Segmented frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW095106124A 2005-02-25 2006-02-23 Method of forming sensor including lead frame TWI321659B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005050879A JP4127270B2 (ja) 2005-02-25 2005-02-25 物理量センサの製造方法
JP2005093636A JP4320641B2 (ja) 2005-03-29 2005-03-29 物理量センサの製造方法及び物理量センサ

Publications (2)

Publication Number Publication Date
TW200702695A true TW200702695A (en) 2007-01-16
TWI321659B TWI321659B (en) 2010-03-11

Family

ID=36932421

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106124A TWI321659B (en) 2005-02-25 2006-02-23 Method of forming sensor including lead frame

Country Status (3)

Country Link
US (1) US7524696B2 (zh)
KR (1) KR100740358B1 (zh)
TW (1) TWI321659B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI784400B (zh) * 2020-01-30 2022-11-21 日商大口電材股份有限公司 引線框架

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008117875A (ja) * 2006-11-02 2008-05-22 Renesas Technology Corp 半導体装置および半導体装置の製造方法
US9231118B2 (en) * 2013-03-12 2016-01-05 Infineon Technologies Ag Chip package with isolated pin, isolated pad or isolated chip carrier and method of making the same
DE102018114426A1 (de) * 2018-06-15 2019-12-19 Infineon Technologies Ag Stromsensorpackage mit kontinuierlicher Isolation
CN109722693B (zh) * 2019-01-17 2024-04-09 深圳赛意法微电子有限公司 一种钢带传输装置

Family Cites Families (24)

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Publication number Priority date Publication date Assignee Title
JPH0290633A (ja) * 1988-09-28 1990-03-30 Nec Corp 半導体装置用樹脂封止金型
JPH04297875A (ja) 1990-10-19 1992-10-21 Lucas Ind Plc 構成部品取付配置
JP2807944B2 (ja) 1992-04-08 1998-10-08 三菱電機株式会社 混成集積回路装置及びその製造方法
JP3230109B2 (ja) 1993-03-11 2001-11-19 オムロン株式会社 加速度センサユニット
JP3303063B2 (ja) 1993-12-13 2002-07-15 オムロン株式会社 加速度センサ及び加速度センサ装置
JPH07225241A (ja) 1994-02-14 1995-08-22 Omron Corp 半導体加速度センサユニット
JP3109556B2 (ja) 1994-03-30 2000-11-20 山形県 パッケージ構造３軸加速度センサ、およびその製造方法
JP3259645B2 (ja) 1995-11-30 2002-02-25 松下電工株式会社 加速度センサ及びその製造方法
JP3381515B2 (ja) 1996-04-26 2003-03-04 松下電工株式会社 加速度センサ
DE19722016A1 (de) * 1997-05-27 1998-12-03 Bosch Gmbh Robert Anordnung zur berührungslosen Drehwinkelerfassung
JPH11281666A (ja) 1998-03-30 1999-10-15 Japan Aviation Electronics Ind Ltd シリコン加速度センサ
JP2001185567A (ja) * 1999-12-22 2001-07-06 Hitachi Ltd 半導体装置およびその製造方法
JP3732987B2 (ja) 1999-12-28 2006-01-11 株式会社ルネサステクノロジ 半導体装置
JP4433353B2 (ja) 2000-06-14 2010-03-17 Ｎｅｃトーキン株式会社 磁気センサ
JP2002015204A (ja) 2000-06-28 2002-01-18 Nec Corp 広告出力方法及び広告出力装置
JP4157308B2 (ja) * 2001-06-27 2008-10-01 シャープ株式会社 めっき膜の形成方法及び該方法によりめっき膜が形成された電子部品
JP4085859B2 (ja) 2002-03-27 2008-05-14 ヤマハ株式会社 磁気センサおよびその製造方法
KR100452820B1 (ko) * 2002-07-12 2004-10-15 삼성전기주식회사 회로소자의 전극형성 방법, 그를 이용한 칩 패키지 및 다층기판
JP3823956B2 (ja) * 2002-07-29 2006-09-20 ヤマハ株式会社 磁気センサの製造方法およびリードフレーム
JP3823954B2 (ja) * 2002-07-29 2006-09-20 ヤマハ株式会社 磁気センサの製造方法およびリードフレーム
EP1892537B1 (en) * 2002-07-29 2011-05-25 Yamaha Corporation Three-axis magnetic sensor
JP3823953B2 (ja) * 2002-07-29 2006-09-20 ヤマハ株式会社 磁気センサの製造方法およびリードフレーム
JP2004077374A (ja) 2002-08-21 2004-03-11 Tokai Rika Co Ltd 磁気センサの配置構造
JP2005057067A (ja) * 2003-08-05 2005-03-03 Renesas Technology Corp 半導体装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI784400B (zh) * 2020-01-30 2022-11-21 日商大口電材股份有限公司 引線框架

Also Published As

Publication number Publication date
TWI321659B (en) 2010-03-11
KR20060094885A (ko) 2006-08-30
US7524696B2 (en) 2009-04-28
KR100740358B1 (ko) 2007-07-16
US20060194362A1 (en) 2006-08-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees