TW200634571A - Pattern data creation method, pattern data creation program, computer-readable medium and fabrication process of a semiconductor device - Google Patents

Pattern data creation method, pattern data creation program, computer-readable medium and fabrication process of a semiconductor device

Info

Publication number
TW200634571A
TW200634571A TW094123895A TW94123895A TW200634571A TW 200634571 A TW200634571 A TW 200634571A TW 094123895 A TW094123895 A TW 094123895A TW 94123895 A TW94123895 A TW 94123895A TW 200634571 A TW200634571 A TW 200634571A
Authority
TW
Taiwan
Prior art keywords
pattern data
data creation
pattern
creation method
computer
Prior art date
Application number
TW094123895A
Other languages
English (en)
Inventor
Syuzi Katase
Kazuhiko Takahashi
Masahiko Minemura
Shuji Osada
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of TW200634571A publication Critical patent/TW200634571A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G03F7/70441—Optical proximity correction [OPC]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
TW094123895A 2005-03-28 2005-07-14 Pattern data creation method, pattern data creation program, computer-readable medium and fabrication process of a semiconductor device TW200634571A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005093002A JP2006276279A (ja) 2005-03-28 2005-03-28 パターンデータ作成方法、パターンデータ作成プログラム、コンピュータ可読記録媒体、コンピュータおよび半導体装置の製造方法

Publications (1)

Publication Number Publication Date
TW200634571A true TW200634571A (en) 2006-10-01

Family

ID=37030408

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123895A TW200634571A (en) 2005-03-28 2005-07-14 Pattern data creation method, pattern data creation program, computer-readable medium and fabrication process of a semiconductor device

Country Status (5)

Country Link
US (1) US20060214119A1 (zh)
JP (1) JP2006276279A (zh)
KR (1) KR100690543B1 (zh)
CN (1) CN1841387A (zh)
TW (1) TW200634571A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4714930B2 (ja) * 2006-08-25 2011-07-06 独立行政法人産業技術総合研究所 マスクパターン設計方法およびそれを用いた半導体装置の製造方法
JP4714854B2 (ja) * 2006-09-05 2011-06-29 独立行政法人産業技術総合研究所 マスクパターン設計方法、マスクパターン設計装置および半導体装置の製造方法
KR100887048B1 (ko) * 2007-10-31 2009-03-04 주식회사 하이닉스반도체 Ｏｐｃ 자동화 장치 및 이를 이용한 반도체 소자의 제조방법
JP5216347B2 (ja) 2008-02-04 2013-06-19 株式会社ニューフレアテクノロジー 描画装置及び描画データの変換方法
JP6128744B2 (ja) * 2012-04-04 2017-05-17 キヤノン株式会社 描画装置、描画方法、および、物品の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4377849A (en) * 1980-12-29 1983-03-22 International Business Machines Corporation Macro assembler process for automated circuit design
US6507944B1 (en) * 1999-07-30 2003-01-14 Fujitsu Limited Data processing method and apparatus, reticle mask, exposing method and apparatus, and recording medium
JP3734650B2 (ja) * 1999-08-24 2006-01-11 富士通株式会社 マスクデータファイル作成方法及び装置並びに記録媒体
JP2001068398A (ja) * 1999-08-27 2001-03-16 Hitachi Ltd 半導体集積回路装置の製造方法およびマスクの製造方法
JP2003527671A (ja) * 1999-10-15 2003-09-16 ケイデンス・デザイン・システムズ・インコーポレーテッド 電子式設計自動化用途のデータベース
JP3762209B2 (ja) * 2000-09-29 2006-04-05 株式会社東芝 設計パターン補正方法及び設計パターン検証方法
US7069533B2 (en) * 2003-03-14 2006-06-27 Chatered Semiconductor Manufacturing, Ltd System, apparatus and method for automated tapeout support
JP4303206B2 (ja) * 2003-04-30 2009-07-29 富士通マイクロエレクトロニクス株式会社 光近接効果補正処理検証方法
TW594437B (en) * 2003-10-16 2004-06-21 Univ Nat Taiwan Science Tech Dynamic mask module
US7207017B1 (en) * 2004-06-10 2007-04-17 Advanced Micro Devices, Inc. Method and system for metrology recipe generation and review and analysis of design, simulation and metrology results

Also Published As

Publication number Publication date
US20060214119A1 (en) 2006-09-28
JP2006276279A (ja) 2006-10-12
CN1841387A (zh) 2006-10-04
KR20060103804A (ko) 2006-10-04
KR100690543B1 (ko) 2007-03-09

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