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Application filed by Qi-Cheng YefiledCriticalQi-Cheng Ye
Priority to TW094110134ApriorityCriticalpatent/TW200633919A/zh
Publication of TW200633919ApublicationCriticalpatent/TW200633919A/zh
Application grantedgrantedCritical
Publication of TWI293059BpublicationCriticalpatent/TWI293059B/zh
Electrostatic chuck, assembly type chucking apparatus having the chuck, apparatus for attaching glass substrates, and assembly type apparatus for attaching glass substrates
Device for contact by adhesion to a glass or semiconductor plate (wafer) surface of the like, and system for gripping such a plate comprising such a device