TW200632339A - Inspection device, inspection method, and sensor for inspection device - Google Patents

Inspection device, inspection method, and sensor for inspection device

Info

Publication number
TW200632339A
TW200632339A TW095102037A TW95102037A TW200632339A TW 200632339 A TW200632339 A TW 200632339A TW 095102037 A TW095102037 A TW 095102037A TW 95102037 A TW95102037 A TW 95102037A TW 200632339 A TW200632339 A TW 200632339A
Authority
TW
Taiwan
Prior art keywords
inspection
sensor plate
conductive pattern
inspection device
sensor
Prior art date
Application number
TW095102037A
Other languages
English (en)
Chinese (zh)
Other versions
TWI373622B (ko
Inventor
Hiroshi Hamori
Shuji Yamaoka
Shogo Ishioka
Original Assignee
Oht Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oht Inc filed Critical Oht Inc
Publication of TW200632339A publication Critical patent/TW200632339A/zh
Application granted granted Critical
Publication of TWI373622B publication Critical patent/TWI373622B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
TW095102037A 2005-01-19 2006-01-19 Inspection device, inspection method, and sensor for inspection device TW200632339A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005012008A JP3989488B2 (ja) 2005-01-19 2005-01-19 検査装置及び検査方法並びに検査装置用センサ

Publications (2)

Publication Number Publication Date
TW200632339A true TW200632339A (en) 2006-09-16
TWI373622B TWI373622B (ko) 2012-10-01

Family

ID=36692423

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102037A TW200632339A (en) 2005-01-19 2006-01-19 Inspection device, inspection method, and sensor for inspection device

Country Status (5)

Country Link
JP (1) JP3989488B2 (ko)
KR (1) KR101196587B1 (ko)
CN (1) CN101107537B (ko)
TW (1) TW200632339A (ko)
WO (1) WO2006078057A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI636264B (zh) * 2016-06-01 2018-09-21 Ｏｈｔ股份有限公司 非接觸型基板檢查裝置及其檢查方法
TWI763565B (zh) * 2021-01-27 2022-05-01 大陸商勝達克半導體科技（上海）有限公司 自動測試機的線路自檢方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100971220B1 (ko) * 2009-08-17 2010-07-20 주식회사 에프티랩 Lc공진주파수 변이를 이용한 정전용량방식 터치스크린패널의 검사방법
KR101214955B1 (ko) * 2009-12-11 2012-12-24 마이크로 인스펙션 주식회사 회로기판의 검사장치
JP5605153B2 (ja) 2010-10-15 2014-10-15 ソニー株式会社 給電装置、給電方法および給電システム
JP5580247B2 (ja) * 2011-04-27 2014-08-27 株式会社ユニオンアロー・テクノロジー パターン検査装置
WO2012169458A1 (ja) * 2011-06-09 2012-12-13 シャープ株式会社 パターン検査方法およびパターン検査装置
JP2013210247A (ja) * 2012-03-30 2013-10-10 Nidec-Read Corp 絶縁検査装置及び絶縁検査方法
JP6375661B2 (ja) * 2014-03-26 2018-08-22 日本電産リード株式会社 抵抗測定装置、基板検査装置、検査方法、及び検査用治具のメンテナンス方法
US20230136914A1 (en) * 2021-10-29 2023-05-04 Keysight Technologies, Inc. Sensor device for detecting electrical defects based on resonance frequency

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002090407A (ja) * 2000-09-11 2002-03-27 Oht Inc 検査装置及び検査方法
JP4623887B2 (ja) * 2001-08-27 2011-02-02 オー・エイチ・ティー株式会社 検査装置用センサ及び検査装置
JP4246987B2 (ja) * 2002-11-27 2009-04-02 日本電産リード株式会社 基板検査装置および基板検査方法
JP3978178B2 (ja) 2002-11-30 2007-09-19 オー・エイチ・ティー株式会社 回路パターン検査装置及び回路パターン検査方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI636264B (zh) * 2016-06-01 2018-09-21 Ｏｈｔ股份有限公司 非接觸型基板檢查裝置及其檢查方法
TWI763565B (zh) * 2021-01-27 2022-05-01 大陸商勝達克半導體科技（上海）有限公司 自動測試機的線路自檢方法

Also Published As

Publication number Publication date
TWI373622B (ko) 2012-10-01
KR101196587B1 (ko) 2012-11-02
CN101107537B (zh) 2010-06-23
KR20070104420A (ko) 2007-10-25
WO2006078057A1 (ja) 2006-07-27
JP2006200994A (ja) 2006-08-03
JP3989488B2 (ja) 2007-10-10
CN101107537A (zh) 2008-01-16

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