TW200631477A - Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus - Google Patents

Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus

Info

Publication number
TW200631477A
TW200631477A TW095102468A TW95102468A TW200631477A TW 200631477 A TW200631477 A TW 200631477A TW 095102468 A TW095102468 A TW 095102468A TW 95102468 A TW95102468 A TW 95102468A TW 200631477 A TW200631477 A TW 200631477A
Authority
TW
Taiwan
Prior art keywords
film pattern
electro
electronic apparatus
forming film
manufacturing
Prior art date
Application number
TW095102468A
Other languages
English (en)
Inventor
Katsuyuki Moriya
Toshimitsu Hirai
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200631477A publication Critical patent/TW200631477A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW095102468A 2005-02-04 2006-01-23 Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus TW200631477A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005028586 2005-02-04
JP2005220148A JP2006245526A (ja) 2005-02-04 2005-07-29 膜パターンの形成方法、デバイス及びその製造方法、電気光学装置、並びに電子機器

Publications (1)

Publication Number Publication Date
TW200631477A true TW200631477A (en) 2006-09-01

Family

ID=36780509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102468A TW200631477A (en) 2005-02-04 2006-01-23 Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus

Country Status (4)

Country Link
US (1) US20060178013A1 (zh)
JP (1) JP2006245526A (zh)
KR (1) KR20060089660A (zh)
TW (1) TW200631477A (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4788552B2 (ja) * 2006-09-29 2011-10-05 セイコーエプソン株式会社 発光装置、電子機器、発光装置の製造方法
JP2008104965A (ja) * 2006-10-26 2008-05-08 Seiko Epson Corp 液滴吐出ヘッドの制御方法、描画方法及び液滴吐出装置
KR101415560B1 (ko) 2007-03-30 2014-07-07 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
GB0722750D0 (en) * 2007-11-20 2008-01-02 Cambridge Display Technology O Organic thin film transistors active matrix organic optical devices and emthods of making the same
JP6396382B2 (ja) * 2011-02-16 2018-09-26 株式会社リコー ホール形成方法、並びに多層配線の製造方法、半導体装置の製造方法、表示素子の製造方法、画像表示装置の製造方法、及びシステムの製造方法
JP2012186455A (ja) * 2011-02-16 2012-09-27 Ricoh Co Ltd ホール形成方法、並びに該方法を用いてビアホールを形成した多層配線、半導体装置、表示素子、画像表示装置、及びシステム
JP2015050022A (ja) * 2013-08-30 2015-03-16 株式会社ジャパンディスプレイ 有機ｅｌ表示装置
WO2015125028A2 (en) * 2014-02-12 2015-08-27 Pulse Finland Oy Methods and apparatus for conductive element deposition and formation
WO2018229965A1 (ja) * 2017-06-16 2018-12-20 博和 増田 携帯端末のコーティング方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100577903B1 (ko) * 1998-03-17 2006-05-10 세이코 엡슨 가부시키가이샤 박막패터닝용 기판 및 그 표면처리
JP3628997B2 (ja) * 2000-11-27 2005-03-16 セイコーエプソン株式会社 有機エレクトロルミネッセンス装置の製造方法
JP4123172B2 (ja) * 2003-04-01 2008-07-23 セイコーエプソン株式会社 薄膜パターンの形成方法及びデバイスの製造方法、電気光学装置及び電子機器
JP3823981B2 (ja) * 2003-05-12 2006-09-20 セイコーエプソン株式会社 パターンと配線パターン形成方法、デバイスとその製造方法、電気光学装置、電子機器及びアクティブマトリクス基板の製造方法
JP2005012179A (ja) * 2003-05-16 2005-01-13 Seiko Epson Corp 薄膜パターン形成方法、デバイスとその製造方法及び電気光学装置並びに電子機器、アクティブマトリクス基板の製造方法
JP3788467B2 (ja) * 2003-05-28 2006-06-21 セイコーエプソン株式会社 パターン形成方法、デバイス及びデバイスの製造方法、電気光学装置、電子機器並びにアクティブマトリクス基板の製造方法
JP2005013985A (ja) * 2003-05-30 2005-01-20 Seiko Epson Corp 膜パターン形成方法、デバイス及びその製造方法、電気光学装置、並びに電子機器、アクティブマトリクス基板の製造方法、アクティブマトリクス基板
JP4400138B2 (ja) * 2003-08-08 2010-01-20 セイコーエプソン株式会社 配線パターンの形成方法
WO2005055309A1 (en) * 2003-12-02 2005-06-16 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor, display device and liquid crystal display device and method for manufacturing the same
US8053171B2 (en) * 2004-01-16 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Substrate having film pattern and manufacturing method of the same, manufacturing method of semiconductor device, liquid crystal television, and EL television
JP4175298B2 (ja) * 2004-07-07 2008-11-05 セイコーエプソン株式会社 カラーフィルタとその製造方法及び電気光学装置並びに電子機器
JP4059231B2 (ja) * 2004-07-07 2008-03-12 セイコーエプソン株式会社 カラーフィルタとその製造方法及び電気光学装置並びに電子機器
JP3922280B2 (ja) * 2004-09-30 2007-05-30 セイコーエプソン株式会社 配線パターンの形成方法及びデバイスの製造方法
US7910271B2 (en) * 2004-10-13 2011-03-22 Sharp Kabushiki Kaisha Functional substrate
JP4708998B2 (ja) * 2005-12-22 2011-06-22 キヤノン株式会社 パターニング方法、電気光学装置の製造方法、カラーフィルターの製造方法、発光体の製造方法、並びに薄膜トランジスタの製造方法
JP4175397B2 (ja) * 2006-06-28 2008-11-05 セイコーエプソン株式会社 有機エレクトロルミネセンス装置の製造方法

Also Published As

Publication number Publication date
KR20060089660A (ko) 2006-08-09
US20060178013A1 (en) 2006-08-10
JP2006245526A (ja) 2006-09-14

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