TW200631035A - Conductive paste, and method for producing printed wiring board by using the same - Google Patents
Conductive paste, and method for producing printed wiring board by using the sameInfo
- Publication number
- TW200631035A TW200631035A TW094133870A TW94133870A TW200631035A TW 200631035 A TW200631035 A TW 200631035A TW 094133870 A TW094133870 A TW 094133870A TW 94133870 A TW94133870 A TW 94133870A TW 200631035 A TW200631035 A TW 200631035A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive paste
- wiring board
- printed wiring
- conductive
- present
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004286499A JP4595471B2 (ja) | 2004-09-30 | 2004-09-30 | 導電性ペースト、及びそれを用いた多層プリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200631035A true TW200631035A (en) | 2006-09-01 |
TWI368231B TWI368231B (en) | 2012-07-11 |
Family
ID=36118838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094133870A TWI368231B (en) | 2004-09-30 | 2005-09-29 | Conductive paste, and method for producing printed wiring board by using the same |
Country Status (7)
Country | Link |
---|---|
US (1) | US8597459B2 (zh) |
EP (2) | EP1816653B1 (zh) |
JP (1) | JP4595471B2 (zh) |
KR (1) | KR101172557B1 (zh) |
CN (2) | CN101976590A (zh) |
TW (1) | TWI368231B (zh) |
WO (1) | WO2006035692A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200707468A (en) * | 2005-04-06 | 2007-02-16 | Toagosei Co Ltd | Conductive paste, circuit board, circuit article and method for manufacturing such circuit article |
JP5270852B2 (ja) * | 2007-03-20 | 2013-08-21 | 株式会社東芝 | 組電池および電池パック |
WO2009115953A2 (en) | 2008-03-19 | 2009-09-24 | Philips Intellectual Property & Standards Gmbh | Connector for establishing an electrical connection with conductive tape |
BRPI0921248B1 (pt) * | 2008-11-26 | 2019-08-20 | 3M Innovative Properties Company. | Filme de superfície para estruturas compósitas |
US8488271B2 (en) * | 2009-07-06 | 2013-07-16 | Samsung Electro-Mechanics Japan Advanced Technology Co., Ltd. | Adhesion structure and method using electrically conductive adhesive, disk drive device using the adhesion structure and method, and method for manufacturing the disk drive device |
JP2011210945A (ja) * | 2010-03-30 | 2011-10-20 | Brother Industries Ltd | 多層プリント配線板の製造方法 |
JP5581828B2 (ja) * | 2010-06-09 | 2014-09-03 | 富士通株式会社 | 積層回路基板および基板製造方法 |
WO2012060385A1 (ja) * | 2010-11-02 | 2012-05-10 | 日立化成工業株式会社 | 導電性粒子及びその製造方法 |
WO2017169421A1 (ja) * | 2016-03-29 | 2017-10-05 | ポリマテック・ジャパン株式会社 | フレキシブル回路基板及びフレキシブル回路基板の製造方法 |
US10943526B2 (en) * | 2018-07-31 | 2021-03-09 | Innolux Corporation | Display device, backlight module and electronic device |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2833111B2 (ja) * | 1989-03-09 | 1998-12-09 | 日立化成工業株式会社 | 回路の接続方法及びそれに用いる接着剤フィルム |
JP3324660B2 (ja) | 1992-11-11 | 2002-09-17 | 日立化成工業株式会社 | 多層配線板およびそれに用いる接着フィルム |
US5401913A (en) * | 1993-06-08 | 1995-03-28 | Minnesota Mining And Manufacturing Company | Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
EP0651602B1 (en) * | 1993-10-29 | 1999-04-07 | Matsushita Electric Industrial Co., Ltd. | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same |
JP3657720B2 (ja) * | 1996-12-11 | 2005-06-08 | ジャパンエポキシレジン株式会社 | 高分子エポキシ樹脂の製造方法 |
US6139777A (en) | 1998-05-08 | 2000-10-31 | Matsushita Electric Industrial Co., Ltd. | Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same |
US6620344B2 (en) | 1999-05-28 | 2003-09-16 | Dowa Mining Co., Ltd. | Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste |
JP4103270B2 (ja) | 1999-11-01 | 2008-06-18 | Jsr株式会社 | 導電性ペースト組成物、その使用方法、および回路基板 |
JP2001319523A (ja) * | 2000-05-10 | 2001-11-16 | Jsr Corp | 導電性ペースト組成物 |
JP2002157918A (ja) * | 2000-11-17 | 2002-05-31 | Jsr Corp | 導電性複合粒子およびそれを用いた応用製品 |
JP4385529B2 (ja) * | 2001-02-05 | 2009-12-16 | 株式会社デンソー | Icチップの実装方法 |
JP2002252437A (ja) * | 2001-02-26 | 2002-09-06 | Casio Comput Co Ltd | フレキシブル配線基板の接合構造 |
JP2003092024A (ja) | 2001-09-18 | 2003-03-28 | Matsushita Electric Ind Co Ltd | ビアホール充填用導電性ペーストとそれを用いた回路基板とその製造方法 |
JP3910527B2 (ja) | 2002-03-13 | 2007-04-25 | シャープ株式会社 | 液晶表示装置およびその製造方法 |
JP4019254B2 (ja) * | 2002-04-24 | 2007-12-12 | 信越化学工業株式会社 | 導電性樹脂組成物 |
JP2003324268A (ja) * | 2002-04-30 | 2003-11-14 | Sumitomo Metal Electronics Devices Inc | 導体ペースト及び印刷方法並びにセラミック多層回路基板の製造方法 |
JP2004055402A (ja) | 2002-07-22 | 2004-02-19 | Jsr Corp | 導電性ペースト組成物、電極形成用転写フィルムおよびプラズマディスプレイ用電極 |
JP2004165066A (ja) * | 2002-11-14 | 2004-06-10 | Ricoh Co Ltd | 導電性ペースト、その製造方法、およびそれを用いた接合・分離方法 |
JP2004214227A (ja) * | 2002-12-26 | 2004-07-29 | Sumitomo Bakelite Co Ltd | 層間接続部及び多層配線板 |
JP2004214277A (ja) | 2002-12-27 | 2004-07-29 | Kashin Kagi Kk | フィルムコンデンサ |
JP2004228322A (ja) | 2003-01-22 | 2004-08-12 | Sumitomo Bakelite Co Ltd | 多層フレキシブル配線板の製造方法 |
JP2004241238A (ja) * | 2003-02-05 | 2004-08-26 | Taiyo Ink Mfg Ltd | アルカリ可溶性導電性ペースト組成物 |
CN100409423C (zh) * | 2003-02-05 | 2008-08-06 | 千住金属工业株式会社 | 端子间的连接方法及半导体装置的安装方法 |
JP2004286499A (ja) | 2003-03-20 | 2004-10-14 | Nec Kansai Ltd | バーンイン装置 |
-
2004
- 2004-09-30 JP JP2004286499A patent/JP4595471B2/ja not_active Expired - Fee Related
-
2005
- 2005-09-26 KR KR1020077006311A patent/KR101172557B1/ko not_active IP Right Cessation
- 2005-09-26 CN CN2010105435270A patent/CN101976590A/zh active Pending
- 2005-09-26 EP EP05785720A patent/EP1816653B1/en not_active Expired - Fee Related
- 2005-09-26 EP EP11150365A patent/EP2333787B1/en not_active Expired - Fee Related
- 2005-09-26 CN CNA2005800332006A patent/CN101031981A/zh active Pending
- 2005-09-26 US US11/664,393 patent/US8597459B2/en active Active
- 2005-09-26 WO PCT/JP2005/017591 patent/WO2006035692A1/ja active Application Filing
- 2005-09-29 TW TW094133870A patent/TWI368231B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2006100170A (ja) | 2006-04-13 |
EP1816653A1 (en) | 2007-08-08 |
EP1816653A4 (en) | 2008-11-05 |
CN101976590A (zh) | 2011-02-16 |
KR101172557B1 (ko) | 2012-08-09 |
CN101031981A (zh) | 2007-09-05 |
KR20070057845A (ko) | 2007-06-07 |
TWI368231B (en) | 2012-07-11 |
US20080099121A1 (en) | 2008-05-01 |
US8597459B2 (en) | 2013-12-03 |
WO2006035692A1 (ja) | 2006-04-06 |
EP2333787A1 (en) | 2011-06-15 |
JP4595471B2 (ja) | 2010-12-08 |
EP2333787B1 (en) | 2013-04-03 |
EP1816653B1 (en) | 2012-06-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |