TWI368231B - Conductive paste, and method for producing printed wiring board by using the same - Google Patents

Conductive paste, and method for producing printed wiring board by using the same

Info

Publication number
TWI368231B
TWI368231B TW094133870A TW94133870A TWI368231B TW I368231 B TWI368231 B TW I368231B TW 094133870 A TW094133870 A TW 094133870A TW 94133870 A TW94133870 A TW 94133870A TW I368231 B TWI368231 B TW I368231B
Authority
TW
Taiwan
Prior art keywords
same
wiring board
printed wiring
conductive paste
producing printed
Prior art date
Application number
TW094133870A
Other languages
English (en)
Other versions
TW200631035A (en
Inventor
Yoshio Oka
Hitoshi Takii
Noriki Hayashi
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200631035A publication Critical patent/TW200631035A/zh
Application granted granted Critical
Publication of TWI368231B publication Critical patent/TWI368231B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW094133870A 2004-09-30 2005-09-29 Conductive paste, and method for producing printed wiring board by using the same TWI368231B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004286499A JP4595471B2 (ja) 2004-09-30 2004-09-30 導電性ペースト、及びそれを用いた多層プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
TW200631035A TW200631035A (en) 2006-09-01
TWI368231B true TWI368231B (en) 2012-07-11

Family

ID=36118838

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133870A TWI368231B (en) 2004-09-30 2005-09-29 Conductive paste, and method for producing printed wiring board by using the same

Country Status (7)

Country Link
US (1) US8597459B2 (zh)
EP (2) EP2333787B1 (zh)
JP (1) JP4595471B2 (zh)
KR (1) KR101172557B1 (zh)
CN (2) CN101031981A (zh)
TW (1) TWI368231B (zh)
WO (1) WO2006035692A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200707468A (en) * 2005-04-06 2007-02-16 Toagosei Co Ltd Conductive paste, circuit board, circuit article and method for manufacturing such circuit article
JP5270852B2 (ja) * 2007-03-20 2013-08-21 株式会社東芝 組電池および電池パック
CN102007647B (zh) 2008-03-19 2015-03-18 皇家飞利浦电子股份有限公司 用于建立与传导带的电连接的连接器
BRPI0921248B1 (pt) * 2008-11-26 2019-08-20 3M Innovative Properties Company. Filme de superfície para estruturas compósitas
US8488271B2 (en) * 2009-07-06 2013-07-16 Samsung Electro-Mechanics Japan Advanced Technology Co., Ltd. Adhesion structure and method using electrically conductive adhesive, disk drive device using the adhesion structure and method, and method for manufacturing the disk drive device
JP2011210945A (ja) * 2010-03-30 2011-10-20 Brother Industries Ltd 多層プリント配線板の製造方法
JP5581828B2 (ja) * 2010-06-09 2014-09-03 富士通株式会社 積層回路基板および基板製造方法
KR20130114170A (ko) * 2010-11-02 2013-10-16 히타치가세이가부시끼가이샤 도전성 입자 및 그 제조 방법
JP6953018B2 (ja) * 2016-03-29 2021-10-27 積水ポリマテック株式会社 フレキシブル回路基板及びフレキシブル回路基板の製造方法
US10943526B2 (en) * 2018-07-31 2021-03-09 Innolux Corporation Display device, backlight module and electronic device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
JP3324660B2 (ja) * 1992-11-11 2002-09-17 日立化成工業株式会社 多層配線板およびそれに用いる接着フィルム
US5401913A (en) * 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
US5652042A (en) * 1993-10-29 1997-07-29 Matsushita Electric Industrial Co., Ltd. Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste
JP3657720B2 (ja) * 1996-12-11 2005-06-08 ジャパンエポキシレジン株式会社 高分子エポキシ樹脂の製造方法
US6139777A (en) * 1998-05-08 2000-10-31 Matsushita Electric Industrial Co., Ltd. Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same
US6620344B2 (en) 1999-05-28 2003-09-16 Dowa Mining Co., Ltd. Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste
JP4103270B2 (ja) 1999-11-01 2008-06-18 Ｊｓｒ株式会社 導電性ペースト組成物、その使用方法、および回路基板
JP2001319523A (ja) * 2000-05-10 2001-11-16 Jsr Corp 導電性ペースト組成物
JP2002157918A (ja) * 2000-11-17 2002-05-31 Jsr Corp 導電性複合粒子およびそれを用いた応用製品
JP4385529B2 (ja) * 2001-02-05 2009-12-16 株式会社デンソー Ｉｃチップの実装方法
JP2002252437A (ja) * 2001-02-26 2002-09-06 Casio Comput Co Ltd フレキシブル配線基板の接合構造
JP2003092024A (ja) 2001-09-18 2003-03-28 Matsushita Electric Ind Co Ltd ビアホール充填用導電性ペーストとそれを用いた回路基板とその製造方法
JP3910527B2 (ja) * 2002-03-13 2007-04-25 シャープ株式会社 液晶表示装置およびその製造方法
JP4019254B2 (ja) * 2002-04-24 2007-12-12 信越化学工業株式会社 導電性樹脂組成物
JP2003324268A (ja) * 2002-04-30 2003-11-14 Sumitomo Metal Electronics Devices Inc 導体ペースト及び印刷方法並びにセラミック多層回路基板の製造方法
JP2004055402A (ja) 2002-07-22 2004-02-19 Jsr Corp 導電性ペースト組成物、電極形成用転写フィルムおよびプラズマディスプレイ用電極
JP2004165066A (ja) * 2002-11-14 2004-06-10 Ricoh Co Ltd 導電性ペースト、その製造方法、およびそれを用いた接合・分離方法
JP2004214227A (ja) * 2002-12-26 2004-07-29 Sumitomo Bakelite Co Ltd 層間接続部及び多層配線板
JP2004214277A (ja) 2002-12-27 2004-07-29 Kashin Kagi Kk フィルムコンデンサ
JP2004228322A (ja) * 2003-01-22 2004-08-12 Sumitomo Bakelite Co Ltd 多層フレキシブル配線板の製造方法
JP2004241238A (ja) * 2003-02-05 2004-08-26 Taiyo Ink Mfg Ltd アルカリ可溶性導電性ペースト組成物
KR101057608B1 (ko) * 2003-02-05 2011-08-18 고조 후지모토 단자간 접속 방법 및 반도체 장치의 실장 방법
JP2004286499A (ja) 2003-03-20 2004-10-14 Nec Kansai Ltd バーンイン装置

Also Published As

Publication number Publication date
EP1816653B1 (en) 2012-06-06
KR101172557B1 (ko) 2012-08-09
CN101031981A (zh) 2007-09-05
EP2333787B1 (en) 2013-04-03
TW200631035A (en) 2006-09-01
EP1816653A4 (en) 2008-11-05
EP1816653A1 (en) 2007-08-08
CN101976590A (zh) 2011-02-16
KR20070057845A (ko) 2007-06-07
JP2006100170A (ja) 2006-04-13
US8597459B2 (en) 2013-12-03
WO2006035692A1 (ja) 2006-04-06
JP4595471B2 (ja) 2010-12-08
EP2333787A1 (en) 2011-06-15
US20080099121A1 (en) 2008-05-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees