TW200630433A - Resin composition for sealing material, a material for sealing, a method for sealing and a electroluminescence display - Google Patents

Resin composition for sealing material, a material for sealing, a method for sealing and a electroluminescence display

Info

Publication number
TW200630433A
TW200630433A TW095105149A TW95105149A TW200630433A TW 200630433 A TW200630433 A TW 200630433A TW 095105149 A TW095105149 A TW 095105149A TW 95105149 A TW95105149 A TW 95105149A TW 200630433 A TW200630433 A TW 200630433A
Authority
TW
Taiwan
Prior art keywords
sealing
resin composition
electroluminescence display
weight
parts
Prior art date
Application number
TW095105149A
Other languages
English (en)
Other versions
TWI318995B (en
Inventor
Yugo Yamamoto
Yuichi Itou
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of TW200630433A publication Critical patent/TW200630433A/zh
Application granted granted Critical
Publication of TWI318995B publication Critical patent/TWI318995B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/02—Inorganic compounds
    • C09K2200/0239—Oxides, hydroxides, carbonates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0647—Polyepoxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
TW095105149A 2005-02-17 2006-02-15 Resin composition for sealing material, a material for sealing, a method for sealing and a electroluminescence display TWI318995B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005040008 2005-02-17

Publications (2)

Publication Number Publication Date
TW200630433A true TW200630433A (en) 2006-09-01
TWI318995B TWI318995B (en) 2010-01-01

Family

ID=36916386

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105149A TWI318995B (en) 2005-02-17 2006-02-15 Resin composition for sealing material, a material for sealing, a method for sealing and a electroluminescence display

Country Status (6)

Country Link
EP (1) EP1873223A4 (zh)
JP (1) JP4563448B2 (zh)
KR (1) KR100918553B1 (zh)
CN (1) CN101120072A (zh)
TW (1) TWI318995B (zh)
WO (1) WO2006087979A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008027814A (ja) * 2006-07-24 2008-02-07 Tdk Corp Ｅｌパネル
JP2008059836A (ja) * 2006-08-30 2008-03-13 Mitsui Chemicals Inc エレクトロルミネッセンス表示装置およびエレクトロルミネッセンス表示装置用シール剤
KR101376319B1 (ko) * 2007-07-27 2014-03-20 주식회사 동진쎄미켐 디스플레이 소자의 실링방법
WO2011040211A1 (ja) * 2009-09-30 2011-04-07 Jsr株式会社 有機ｅｌ素子、有機ｅｌ表示装置、有機ｅｌ照明装置及びシール剤用硬化性組成物
WO2011104997A1 (ja) * 2010-02-23 2011-09-01 Jsr株式会社 有機ｅｌ素子、有機ｅｌ表示装置、有機ｅｌ照明装置及びシール剤用硬化性組成物
KR101309820B1 (ko) 2010-12-29 2013-09-23 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자
KR101334649B1 (ko) 2011-03-29 2013-12-02 주식회사 케이씨씨 비할로겐계 반도체 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치
JP6373828B2 (ja) * 2013-04-18 2018-08-15 三井化学株式会社 組成物、硬化物、表示デバイスおよびその製造方法
WO2015041210A1 (ja) * 2013-09-18 2015-03-26 株式会社ダイセル 感光性樹脂組成物及びその硬化物、並びに光学部品
JP2016188286A (ja) * 2015-03-30 2016-11-04 日東電工株式会社 光硬化性樹脂組成物およびそれを用いた光学材料
JP6747862B2 (ja) * 2015-05-25 2020-08-26 積水化学工業株式会社 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子
CN112310302A (zh) * 2019-07-30 2021-02-02 陕西坤同半导体科技有限公司 一种有机发光器件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61143444A (ja) * 1984-12-17 1986-07-01 Shin Kobe Electric Mach Co Ltd エポキシ樹脂積層板
JP4170570B2 (ja) * 2000-08-09 2008-10-22 電気化学工業株式会社 高熱伝導性フィラー及びその用途
CA2481475C (en) * 2002-04-19 2009-07-14 Saint-Gobain Ceramics & Plastics, Inc. Novel boehmite particles and polymer materials incorporating same
JP2004059643A (ja) * 2002-07-25 2004-02-26 Mitsubishi Gas Chem Co Inc プリプレグ及び積層板
JP2004286818A (ja) 2003-03-19 2004-10-14 Mitsubishi Gas Chem Co Inc 耐熱性に優れた難燃レジスト組成物
US20050075024A1 (en) * 2003-10-01 2005-04-07 Ranken Paul F. Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
JP4469167B2 (ja) * 2003-12-03 2010-05-26 ポリプラスチックス株式会社 難燃性樹脂組成物

Also Published As

Publication number Publication date
TWI318995B (en) 2010-01-01
JPWO2006087979A1 (ja) 2008-07-03
EP1873223A4 (en) 2013-05-22
EP1873223A1 (en) 2008-01-02
KR100918553B1 (ko) 2009-09-21
JP4563448B2 (ja) 2010-10-13
WO2006087979A1 (ja) 2006-08-24
KR20070105353A (ko) 2007-10-30
CN101120072A (zh) 2008-02-06

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