TW200630215A - Copper clad laminates sheet - Google Patents

Copper clad laminates sheet

Info

Publication number
TW200630215A
TW200630215A TW094138362A TW94138362A TW200630215A TW 200630215 A TW200630215 A TW 200630215A TW 094138362 A TW094138362 A TW 094138362A TW 94138362 A TW94138362 A TW 94138362A TW 200630215 A TW200630215 A TW 200630215A
Authority
TW
Taiwan
Prior art keywords
nickel
zinc
clad laminates
copper clad
copper foil
Prior art date
Application number
TW094138362A
Other languages
Chinese (zh)
Other versions
TWI366513B (en
Inventor
Koichi Hattori
Ryuzo Shinta
Yasufumi Matsumura
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200630215A publication Critical patent/TW200630215A/en
Application granted granted Critical
Publication of TWI366513B publication Critical patent/TWI366513B/en

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

This invention provides a copper clad laminates sheet which exhibits excellent resistance to heat, flame retardant property and dimensional stability, allows a high density mounting, and has excellent adhesion and stable adhesive strength. The copper clad laminates sheet is composed of a copper foil on which an insulation layer formed by a polyimide resin, wherein the surface of the copper foil in contact with the insulation layer is subjected to a metal deposition treatment to deposit at least nickel and zinc, and a treatment with a coupling agent, and wherein the surface of the copper foil treated with the metal deposition treatment contains 5-15μg/cm<SP>2</SP> of nickel and 1-5 μg/cm<SP>2</SP> of zinc, and a ratio of nickel/(nickel+zinc), which indicates a ratio of content of nickel and zinc, is 0.70 or more.
TW094138362A 2004-11-16 2005-11-02 Copper clad laminates sheet TWI366513B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004332306A JP4652020B2 (en) 2004-11-16 2004-11-16 Copper-clad laminate

Publications (2)

Publication Number Publication Date
TW200630215A true TW200630215A (en) 2006-09-01
TWI366513B TWI366513B (en) 2012-06-21

Family

ID=36622757

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094138362A TWI366513B (en) 2004-11-16 2005-11-02 Copper clad laminates sheet

Country Status (3)

Country Link
JP (1) JP4652020B2 (en)
KR (1) KR101078234B1 (en)
TW (1) TWI366513B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4958045B2 (en) * 2006-10-27 2012-06-20 三井金属鉱業株式会社 Surface-treated copper foil for producing flexible copper-clad laminate and flexible copper-clad laminate obtained using the surface-treated copper foil
JP5215631B2 (en) * 2007-10-24 2013-06-19 三井金属鉱業株式会社 Surface treated copper foil
TW200934330A (en) * 2007-11-26 2009-08-01 Furukawa Electric Co Ltd Surface treated copper foil and method for surface treating the same, and stack circuit board
WO2009107845A1 (en) * 2008-02-28 2009-09-03 日本ゼオン株式会社 Metal/cured resin laminate
JP4907580B2 (en) * 2008-03-25 2012-03-28 新日鐵化学株式会社 Flexible copper clad laminate
US8142905B2 (en) 2008-06-17 2012-03-27 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit board and copper clad laminate for printed circuit board
JP5524475B2 (en) * 2008-11-28 2014-06-18 株式会社有沢製作所 Two-layer double-sided flexible metal laminate and its manufacturing method
JP5191367B2 (en) * 2008-12-08 2013-05-08 三井化学株式会社 Polyimide metal foil laminate and manufacturing method thereof
JP2010202891A (en) * 2009-02-27 2010-09-16 Nippon Steel Chem Co Ltd Surface-treated copper foil and method of manufacturing the same
JP5171690B2 (en) * 2009-02-27 2013-03-27 新日鉄住金化学株式会社 Copper-clad laminate and manufacturing method thereof
JP4927963B2 (en) * 2010-01-22 2012-05-09 古河電気工業株式会社 Surface-treated copper foil, method for producing the same, and copper-clad laminate
JP2012087388A (en) * 2010-10-21 2012-05-10 Furukawa Electric Co Ltd:The Surface-treated copper foil and copper-clad laminate sheet
JP6427454B2 (en) 2015-03-31 2018-11-21 日鉄ケミカル＆マテリアル株式会社 Copper-clad laminate and printed wiring board
JP6473028B2 (en) * 2015-03-31 2019-02-20 日鉄ケミカル＆マテリアル株式会社 Copper-clad laminate, printed wiring board and method of using the same
JP6580128B2 (en) * 2015-03-31 2019-09-25 株式会社カネカ Manufacturing method of rigid flexible wiring board
JP6908590B2 (en) 2016-03-17 2021-07-28 日鉄ケミカル＆マテリアル株式会社 Polyamic acid, thermoplastic polyimide, resin film, metal-clad laminate and circuit board
JP6708753B2 (en) 2017-10-12 2020-06-10 株式会社クレハ Aromatic polymer continuous production method and aromatic polymer continuous production apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3306404B2 (en) 2000-01-28 2002-07-24 三井金属鉱業株式会社 Method for producing surface-treated copper foil and copper-clad laminate using surface-treated copper foil obtained by the method
JP2003096776A (en) * 2001-09-25 2003-04-03 Asahi Kasei Corp Execution control method of steel pipe pile
JP2003102277A (en) * 2001-09-28 2003-04-08 Omote Tekkosho:Kk Flower bed for horticulture
JP2004047681A (en) * 2002-07-11 2004-02-12 Nippon Denkai Kk Copper foil for printed circuit board
JP4686106B2 (en) * 2002-10-23 2011-05-18 三井化学株式会社 Polyimide metal foil laminate
JP2004263296A (en) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk Copper foil for fine pattern printed circuit and manufacturing method therefor
JP2004244656A (en) * 2003-02-12 2004-09-02 Furukawa Techno Research Kk Copper foil which can deal with high-frequency application and method for manufacturing the same

Also Published As

Publication number Publication date
JP2006142514A (en) 2006-06-08
TWI366513B (en) 2012-06-21
KR101078234B1 (en) 2011-11-01
JP4652020B2 (en) 2011-03-16
KR20060055359A (en) 2006-05-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees