TW200629460A - Electrostatic chuck for vacuum bonding equipment and vacuum bonding equipment using the same - Google Patents

Electrostatic chuck for vacuum bonding equipment and vacuum bonding equipment using the same

Info

Publication number
TW200629460A
TW200629460A TW094137737A TW94137737A TW200629460A TW 200629460 A TW200629460 A TW 200629460A TW 094137737 A TW094137737 A TW 094137737A TW 94137737 A TW94137737 A TW 94137737A TW 200629460 A TW200629460 A TW 200629460A
Authority
TW
Taiwan
Prior art keywords
layer
dielectric
bonding equipment
vacuum bonding
contact plane
Prior art date
Application number
TW094137737A
Other languages
English (en)
Inventor
Yoshikazu Ohtani
Takeshi Shima
Ritsu Kawase
Original Assignee
Shinetsu Eng Co Ltd
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Eng Co Ltd, Tomoegawa Paper Co Ltd filed Critical Shinetsu Eng Co Ltd
Publication of TW200629460A publication Critical patent/TW200629460A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Laminated Bodies (AREA)
TW094137737A 2004-10-29 2005-10-28 Electrostatic chuck for vacuum bonding equipment and vacuum bonding equipment using the same TW200629460A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004316173A JP2008026338A (ja) 2004-10-29 2004-10-29 真空貼り合わせ装置用静電チャック及びそれを用いた真空貼り合わせ装置

Publications (1)

Publication Number Publication Date
TW200629460A true TW200629460A (en) 2006-08-16

Family

ID=36406953

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094137737A TW200629460A (en) 2004-10-29 2005-10-28 Electrostatic chuck for vacuum bonding equipment and vacuum bonding equipment using the same

Country Status (3)

Country Link
JP (1) JP2008026338A (zh)
TW (1) TW200629460A (zh)
WO (1) WO2006054407A1 (zh)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0439000B1 (en) * 1990-01-25 1994-09-14 Applied Materials, Inc. Electrostatic clamp and method
JPH0831917A (ja) * 1994-07-19 1996-02-02 Hitachi Chem Co Ltd 静電チャック及びその製造法
JPH08316296A (ja) * 1995-05-23 1996-11-29 Nikon Corp 静電チャック
JPH1131736A (ja) * 1997-07-11 1999-02-02 Anelva Corp 半導体製造装置用静電吸着ステージ
JPH1161404A (ja) * 1997-08-21 1999-03-05 Hitachi Ltd 静電吸着装置及びその製造方法並びにそれを用いた加工装置
JPH1187479A (ja) * 1997-09-10 1999-03-30 Shin Etsu Chem Co Ltd 静電チャック
JP2001223261A (ja) * 2000-02-07 2001-08-17 Hitachi Ltd 静電チャック及び静電吸着装置
JP2003324144A (ja) * 2002-04-30 2003-11-14 Shin-Etsu Engineering Co Ltd 静電チャック及びそれを用いたフラットパネル用基板の貼り合わせ装置

Also Published As

Publication number Publication date
JP2008026338A (ja) 2008-02-07
WO2006054407A1 (ja) 2006-05-26

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