TW200626698A - Halogen-free adhesive tape - Google Patents

Halogen-free adhesive tape

Info

Publication number
TW200626698A
TW200626698A TW094143552A TW94143552A TW200626698A TW 200626698 A TW200626698 A TW 200626698A TW 094143552 A TW094143552 A TW 094143552A TW 94143552 A TW94143552 A TW 94143552A TW 200626698 A TW200626698 A TW 200626698A
Authority
TW
Taiwan
Prior art keywords
halogen
adhesive tape
free adhesive
tape
free
Prior art date
Application number
TW094143552A
Other languages
English (en)
Chinese (zh)
Other versions
TWI326302B (enExample
Inventor
Masato Koike
Susumu Hara
Hiroshi Ichikawa
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Publication of TW200626698A publication Critical patent/TW200626698A/zh
Application granted granted Critical
Publication of TWI326302B publication Critical patent/TWI326302B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/302—Applications of adhesives in processes or use of adhesives in the form of films or foils for bundling cables
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2407/00—Presence of natural rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW094143552A 2004-12-10 2005-12-09 Halogen-free adhesive tape TW200626698A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004358747A JP4689256B2 (ja) 2004-12-10 2004-12-10 ハロゲンフリー粘着テープ

Publications (2)

Publication Number Publication Date
TW200626698A true TW200626698A (en) 2006-08-01
TWI326302B TWI326302B (enExample) 2010-06-21

Family

ID=36578017

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143552A TW200626698A (en) 2004-12-10 2005-12-09 Halogen-free adhesive tape

Country Status (6)

Country Link
US (1) US20100129653A1 (enExample)
JP (1) JP4689256B2 (enExample)
CN (1) CN101072839B (enExample)
DE (1) DE112005003116B4 (enExample)
TW (1) TW200626698A (enExample)
WO (1) WO2006062197A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080095477A1 (en) * 2006-10-23 2008-04-24 Junichi Hagino Packaging bag made of resin
JP5386780B2 (ja) * 2006-12-27 2014-01-15 Ｄｉｃ株式会社 エマルジョン型粘着剤および粘着シート
US7691225B2 (en) 2007-01-15 2010-04-06 Nitto Denko Corporation Thermal-release double-coated pressure-sensitive adhesive tape or sheet and method of processing adherend
DE102008062368A1 (de) * 2008-12-17 2010-06-24 Tesa Se Haftklebemassen auf Basis von Naturkautschuk und Polyacrylaten
CN103160226A (zh) * 2011-12-18 2013-06-19 日东电工（上海松江）有限公司 压敏粘合剂组合物、油墨组合物以及利用这些组合物制造的压敏胶带
CN103881624B (zh) * 2014-04-14 2016-01-20 东莞钱锋特殊胶粘制品有限公司 一种高性能聚丙烯酸酯压敏胶
JP7354835B2 (ja) * 2019-12-25 2023-10-03 東洋インキＳｃホールディングス株式会社 粘着剤および粘着シート
JP2024176840A (ja) * 2023-06-09 2024-12-19 矢崎総業株式会社 粘着テープ並びにそれを用いたワイヤーハーネス

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4596886A (en) * 1982-04-30 1986-06-24 Mitsubishi Monsanto Chemical Company Polyester containing impure 1,2-butanediol
JP3398262B2 (ja) * 1995-07-14 2003-04-21 リンテック株式会社 粘着シート
JP3272921B2 (ja) * 1995-09-27 2002-04-08 リンテック株式会社 粘着シート
JPH10316953A (ja) 1997-05-16 1998-12-02 Nitto Denko Corp 剥離可能な熱伝導性感圧接着剤とその接着シ―ト類
JP2000186176A (ja) * 1998-12-24 2000-07-04 Sunstar Eng Inc アルコキシシリル基含有硬化性組成物
JP2001164215A (ja) * 1999-12-03 2001-06-19 Yazaki Corp ノンハロゲンテープ用粘着組成物及びこれを被覆したノンハロゲン粘着テープ
DE10002180A1 (de) 2000-01-20 2001-07-26 Mitsubishi Polyester Film Gmbh Weisse, flammhemmend ausgerüstete, thermoformbare orientierte Folie aus einem kristallisierbaren Thermoplasten, Verfahren zu ihrer Herstellung und ihre Verwendung
JP3394947B2 (ja) * 2000-02-24 2003-04-07 日東電工株式会社 粘着テープおよび粘着テープ基材
JP4514078B2 (ja) * 2000-10-10 2010-07-28 株式会社リコー 感熱性粘着材料及びその貼着方法
JP4841047B2 (ja) * 2001-03-28 2011-12-21 リンテック株式会社 アプリケーションシートおよび塗装粘着シートの貼着方法
JP2002363513A (ja) * 2001-06-08 2002-12-18 Oji Paper Co Ltd 粘着シート、包装材、及び包装製品
JP3952446B2 (ja) 2001-12-12 2007-08-01 住友電装株式会社 ワイヤーハーネス保護材及びこれを用いたワイヤーハーネス
JP2003219533A (ja) 2002-01-18 2003-07-31 Sumitomo Wiring Syst Ltd ワイヤーハーネス保護材及びこれを用いたワイヤーハーネス
JP2003242848A (ja) * 2002-02-20 2003-08-29 Yazaki Corp テープ組成物およびそれを用いたテープ
DE10341163A1 (de) 2002-12-19 2004-07-01 Tesa Ag Leicht reißbares Wickelband mit Alkalimetallionen
JP2004358747A (ja) 2003-06-03 2004-12-24 Kotobuki & Co Ltd キャップレス保持具
JP4493288B2 (ja) * 2003-06-05 2010-06-30 日東電工株式会社 粘着テープ又はシート
DE10348482A1 (de) * 2003-10-14 2005-06-02 Tesa Ag Flammwidrige rußgefüllte Wickelfolie aus Polyolefin
DE10348479A1 (de) 2003-10-14 2005-06-02 Tesa Ag Wickelfolie aus Polypropylencopolymer und einem mit Polypropylen unverträglichen Polymer
DE10348483A1 (de) 2003-10-14 2005-06-02 Tesa Ag Alterungsbeständige weiche Wickelfolie aus Polyolefin

Also Published As

Publication number Publication date
TWI326302B (enExample) 2010-06-21
CN101072839B (zh) 2010-05-26
CN101072839A (zh) 2007-11-14
JP2006161008A (ja) 2006-06-22
US20100129653A1 (en) 2010-05-27
WO2006062197A1 (ja) 2006-06-15
JP4689256B2 (ja) 2011-05-25
DE112005003116T5 (de) 2008-01-24
DE112005003116B4 (de) 2022-03-17

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