TW200625680A - Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor, and methods of manufacturing same - Google Patents
Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor, and methods of manufacturing sameInfo
- Publication number
- TW200625680A TW200625680A TW094122648A TW94122648A TW200625680A TW 200625680 A TW200625680 A TW 200625680A TW 094122648 A TW094122648 A TW 094122648A TW 94122648 A TW94122648 A TW 94122648A TW 200625680 A TW200625680 A TW 200625680A
- Authority
- TW
- Taiwan
- Prior art keywords
- light emitting
- phosphor
- semiconductor light
- emitting devices
- transparent silicone
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title abstract 3
- 229920001296 polysiloxane Polymers 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/947,704 US7372198B2 (en) | 2004-09-23 | 2004-09-23 | Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200625680A true TW200625680A (en) | 2006-07-16 |
TWI377694B TWI377694B (en) | 2012-11-21 |
Family
ID=35058142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094122648A TWI377694B (en) | 2004-09-23 | 2005-07-05 | Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor, and methods of manufacturing same |
Country Status (7)
Country | Link |
---|---|
US (2) | US7372198B2 (zh) |
EP (1) | EP1794810B1 (zh) |
JP (1) | JP2008514027A (zh) |
KR (1) | KR20070053782A (zh) |
CN (1) | CN100539213C (zh) |
TW (1) | TWI377694B (zh) |
WO (1) | WO2006036251A1 (zh) |
Families Citing this family (78)
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-
2004
- 2004-09-23 US US10/947,704 patent/US7372198B2/en active Active
-
2005
- 2005-07-05 KR KR1020077006625A patent/KR20070053782A/ko not_active Application Discontinuation
- 2005-07-05 JP JP2007533460A patent/JP2008514027A/ja active Pending
- 2005-07-05 WO PCT/US2005/023874 patent/WO2006036251A1/en active Application Filing
- 2005-07-05 EP EP05771259.8A patent/EP1794810B1/en active Active
- 2005-07-05 TW TW094122648A patent/TWI377694B/zh active
- 2005-07-05 CN CNB2005800320352A patent/CN100539213C/zh active Active
-
2007
- 2007-11-26 US US11/944,804 patent/US7591702B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TWI377694B (en) | 2012-11-21 |
KR20070053782A (ko) | 2007-05-25 |
EP1794810A1 (en) | 2007-06-13 |
US20060061259A1 (en) | 2006-03-23 |
JP2008514027A (ja) | 2008-05-01 |
EP1794810B1 (en) | 2019-03-13 |
CN100539213C (zh) | 2009-09-09 |
US7591702B2 (en) | 2009-09-22 |
US20080076316A1 (en) | 2008-03-27 |
US7372198B2 (en) | 2008-05-13 |
CN101027785A (zh) | 2007-08-29 |
WO2006036251A1 (en) | 2006-04-06 |
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