TW200620710A - Light-emitting device with improved heatsinking - Google Patents

Light-emitting device with improved heatsinking

Info

Publication number
TW200620710A
TW200620710A TW094136608A TW94136608A TW200620710A TW 200620710 A TW200620710 A TW 200620710A TW 094136608 A TW094136608 A TW 094136608A TW 94136608 A TW94136608 A TW 94136608A TW 200620710 A TW200620710 A TW 200620710A
Authority
TW
Taiwan
Prior art keywords
light
emitting device
led
heatsinking
improved
Prior art date
Application number
TW094136608A
Other languages
English (en)
Inventor
Ronald Dekker
Eduard Johannes Meijer
Eugene Timmering
Samber Marc Andre De
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200620710A publication Critical patent/TW200620710A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
TW094136608A 2004-10-22 2005-10-19 Light-emitting device with improved heatsinking TW200620710A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04105248 2004-10-22

Publications (1)

Publication Number Publication Date
TW200620710A true TW200620710A (en) 2006-06-16

Family

ID=35457285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094136608A TW200620710A (en) 2004-10-22 2005-10-19 Light-emitting device with improved heatsinking

Country Status (7)

Country Link
US (1) US7891836B2 (zh)
EP (1) EP1805809B1 (zh)
JP (1) JP5097550B2 (zh)
KR (1) KR101243691B1 (zh)
CN (1) CN100550442C (zh)
TW (1) TW200620710A (zh)
WO (1) WO2006043234A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395306B (zh) * 2008-02-05 2013-05-01 矽品精密工業股份有限公司 半導體封裝件之散熱模組化結構及其製法
US9287440B2 (en) 2010-04-05 2016-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing a semiconductor device including through silicon plugs

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* Cited by examiner, † Cited by third party
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JP5205806B2 (ja) * 2007-05-09 2013-06-05 三菱化学株式会社 Ｌｅｄチップ固定用基板およびその製造方法
US7791096B2 (en) 2007-06-08 2010-09-07 Koninklijke Philips Electronics N.V. Mount for a semiconductor light emitting device
DE102008012316B4 (de) * 2007-09-28 2023-02-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterlichtquelle mit einer Primärstrahlungsquelle und einem Lumineszenzkonversionselement
CN101463985B (zh) * 2007-12-21 2010-12-08 富士迈半导体精密工业（上海）有限公司 发光二极管灯具
US8530990B2 (en) * 2009-07-20 2013-09-10 Sunpower Corporation Optoelectronic device with heat spreader unit
JP5414627B2 (ja) * 2010-06-07 2014-02-12 株式会社東芝 半導体発光装置及びその製造方法
JP6005440B2 (ja) * 2011-08-22 2016-10-12 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びこれを含むライトユニット
US9066443B2 (en) 2011-09-13 2015-06-23 General Electric Company Overlay circuit structure for interconnecting light emitting semiconductors
CN102403418A (zh) * 2011-11-09 2012-04-04 东莞勤上光电股份有限公司 一种大功率led的散热结构的制作方法
CN103715330B (zh) * 2012-09-28 2018-04-20 通用电气公司 用于互连发光半导体的覆盖式电路结构
WO2014128574A1 (en) 2013-02-19 2014-08-28 Koninklijke Philips N.V. A light emitting die component formed by multilayer structures
US9648750B2 (en) * 2014-09-30 2017-05-09 Rsm Electron Power, Inc. Light emitting diode (LED) assembly and flexible circuit board with improved thermal conductivity
KR102188960B1 (ko) * 2017-01-13 2020-12-10 한국전자통신연구원 광학 장치, 분포 브라그 반사형 레이저 다이오드의 제조방법, 및 광학 장치의 제조 방법

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US3946428A (en) * 1973-09-19 1976-03-23 Nippon Electric Company, Limited Encapsulation package for a semiconductor element
JPS5471572A (en) * 1977-11-18 1979-06-08 Fujitsu Ltd Semiconductor device
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JPS60171780A (ja) 1984-02-17 1985-09-05 Hitachi Ltd 発光電子装置
JPS6161458A (ja) 1984-09-01 1986-03-29 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395306B (zh) * 2008-02-05 2013-05-01 矽品精密工業股份有限公司 半導體封裝件之散熱模組化結構及其製法
US9287440B2 (en) 2010-04-05 2016-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing a semiconductor device including through silicon plugs
US10049931B2 (en) 2010-04-05 2018-08-14 Taiwan Semicondutor Manufacturing Company, Ltd. Method of manufacturing a semiconductor device including through silicon plugs
US10497619B2 (en) 2010-04-05 2019-12-03 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing a semiconductor device including through silicon plugs

Also Published As

Publication number Publication date
US20080068842A1 (en) 2008-03-20
WO2006043234A1 (en) 2006-04-27
JP2008518434A (ja) 2008-05-29
EP1805809B1 (en) 2019-10-09
KR20070070228A (ko) 2007-07-03
US7891836B2 (en) 2011-02-22
JP5097550B2 (ja) 2012-12-12
CN101044636A (zh) 2007-09-26
KR101243691B1 (ko) 2013-03-14
CN100550442C (zh) 2009-10-14
EP1805809A1 (en) 2007-07-11

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