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Application filed by Everlight Electronics Co LtdfiledCriticalEverlight Electronics Co Ltd
Priority to TW095104637ApriorityCriticalpatent/TW200731557A/en
Publication of TW200731557ApublicationCriticalpatent/TW200731557A/en
A light emitting diode (LED) package structure has an insulation substrate, which is located between a thermal conduction layer and a LED device. This insulation substrate can increase the light intensity of the LED device. Furthermore, a circuit can be produced on the insulation substrate according to various LED package design.
Luminescent device based on a luminescent diode (LED), which includes a base with a stop, a LED module mounted in the base connection section, and at least one control circuit coupled within the base and to an electrical connection with the led module