TW200620652A - Semiconductor device and method of manufacturing such a device - Google Patents

Semiconductor device and method of manufacturing such a device

Info

Publication number
TW200620652A
TW200620652A TW094123615A TW94123615A TW200620652A TW 200620652 A TW200620652 A TW 200620652A TW 094123615 A TW094123615 A TW 094123615A TW 94123615 A TW94123615 A TW 94123615A TW 200620652 A TW200620652 A TW 200620652A
Authority
TW
Taiwan
Prior art keywords
region
conductivity type
base
collector
base region
Prior art date
Application number
TW094123615A
Other languages
English (en)
Inventor
Andreas Hubertus Montree
Jan Willem Slotboom
Prabhat Agarwal
Philippe Meunier-Beillard
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200620652A publication Critical patent/TW200620652A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73—Bipolar junction transistors
    • H01L29/7317—Bipolar thin film transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1004—Base region of bipolar transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234—Bipolar junction transistors [BJT]
    • H01L29/66265—Thin film bipolar transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/36—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the concentration or distribution of impurities in the bulk material
    • H01L29/365—Planar doping, e.g. atomic-plane doping, delta-doping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73—Bipolar junction transistors
    • H01L29/735—Lateral transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
TW094123615A 2004-07-15 2005-07-12 Semiconductor device and method of manufacturing such a device TW200620652A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04103382 2004-07-15

Publications (1)

Publication Number Publication Date
TW200620652A true TW200620652A (en) 2006-06-16

Family

ID=34972814

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123615A TW200620652A (en) 2004-07-15 2005-07-12 Semiconductor device and method of manufacturing such a device

Country Status (7)

Country Link
US (1) US7671447B2 (zh)
EP (1) EP1771887B1 (zh)
JP (1) JP5090163B2 (zh)
AT (1) ATE400063T1 (zh)
DE (1) DE602005007904D1 (zh)
TW (1) TW200620652A (zh)
WO (1) WO2006008689A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8669640B2 (en) * 2009-07-14 2014-03-11 Freescale Semiconductor, Inc. Bipolar transistor
US9059195B2 (en) 2013-05-29 2015-06-16 International Business Machines Corporation Lateral bipolar transistors having partially-depleted intrinsic base
US9496184B2 (en) 2014-04-04 2016-11-15 International Business Machines Corporation III-V, SiGe, or Ge base lateral bipolar transistor and CMOS hybrid technology
US11245639B2 (en) 2014-09-03 2022-02-08 International Business Machines Corporation Composition of persistent object instances linking resources across multiple, disparate systems

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01241156A (ja) * 1988-03-23 1989-09-26 Hitachi Ltd 半導体装置
US5198692A (en) * 1989-01-09 1993-03-30 Kabushiki Kaisha Toshiba Semiconductor device including bipolar transistor with step impurity profile having low and high concentration emitter regions
DE69109884T2 (de) * 1990-02-09 1995-10-26 Canon Kk Tintenstrahlaufzeichnungssystem.
JPH0499328A (ja) * 1990-08-18 1992-03-31 Nec Corp バイポーラトランジスタ
JPH05166825A (ja) * 1991-12-17 1993-07-02 Hitachi Ltd 半導体装置
JP3233690B2 (ja) * 1992-07-16 2001-11-26 ローム株式会社 バイポーラトランジスタの製法
JPH06252158A (ja) * 1993-02-26 1994-09-09 Toshiba Corp 半導体装置
FR2778022B1 (fr) * 1998-04-22 2001-07-13 France Telecom Transistor bibolaire vertical, en particulier a base a heterojonction sige, et procede de fabrication
JP3708881B2 (ja) * 2001-01-31 2005-10-19 松下電器産業株式会社 半導体結晶膜，その製造方法，半導体装置及びその製造方法
JP2002270815A (ja) * 2001-03-14 2002-09-20 Hitachi Ltd 半導体装置及びその半導体装置により構成された駆動回路
DE10160509A1 (de) * 2001-11-30 2003-06-12 Ihp Gmbh Halbleitervorrichtung und Verfahren zu ihrer Herstellung
JP3565274B2 (ja) * 2002-02-25 2004-09-15 住友電気工業株式会社 バイポーラトランジスタ
JP3719998B2 (ja) * 2002-04-01 2005-11-24 松下電器産業株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
US7671447B2 (en) 2010-03-02
JP5090163B2 (ja) 2012-12-05
WO2006008689A1 (en) 2006-01-26
DE602005007904D1 (de) 2008-08-14
EP1771887A1 (en) 2007-04-11
EP1771887B1 (en) 2008-07-02
US20080083968A1 (en) 2008-04-10
JP2008507125A (ja) 2008-03-06
ATE400063T1 (de) 2008-07-15

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