TW200620597A - Socket for optical module - Google Patents

Socket for optical module

Info

Publication number
TW200620597A
TW200620597A TW094130057A TW94130057A TW200620597A TW 200620597 A TW200620597 A TW 200620597A TW 094130057 A TW094130057 A TW 094130057A TW 94130057 A TW94130057 A TW 94130057A TW 200620597 A TW200620597 A TW 200620597A
Authority
TW
Taiwan
Prior art keywords
optical module
socket
substrate
disposed
optical
Prior art date
Application number
TW094130057A
Other languages
English (en)
Other versions
TWI371834B (en
Inventor
Yusuke Hayase
Atsushi Ono
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200620597A publication Critical patent/TW200620597A/zh
Application granted granted Critical
Publication of TWI371834B publication Critical patent/TWI371834B/zh

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • G02B6/4271Cooling with thermo electric cooling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
TW094130057A 2004-09-02 2005-09-02 Socket for optical module TWI371834B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004255166A JP4619067B2 (ja) 2004-09-02 2004-09-02 光モジュール用ソケット

Publications (2)

Publication Number Publication Date
TW200620597A true TW200620597A (en) 2006-06-16
TWI371834B TWI371834B (en) 2012-09-01

Family

ID=36000084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130057A TWI371834B (en) 2004-09-02 2005-09-02 Socket for optical module

Country Status (6)

Country Link
US (1) US7738797B2 (zh)
JP (1) JP4619067B2 (zh)
KR (1) KR101082612B1 (zh)
DE (1) DE112005001744T5 (zh)
TW (1) TWI371834B (zh)
WO (1) WO2006025434A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111580227A (zh) * 2020-06-24 2020-08-25 四川华丰企业集团有限公司 一种光模块

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101999198B (zh) * 2008-04-14 2013-07-24 古河电气工业株式会社 光模块安装单元以及光模块
JP5075139B2 (ja) * 2009-01-30 2012-11-14 古河電気工業株式会社 並列光伝送装置
JP5323518B2 (ja) * 2009-01-30 2013-10-23 古河電気工業株式会社 並列光伝送装置
JP5019639B2 (ja) * 2009-01-30 2012-09-05 古河電気工業株式会社 並列光伝送装置
KR101045902B1 (ko) * 2009-12-17 2011-07-04 주식회사 나노베이스 파장 가변 시스템을 위한 광원 모듈 장치 및 이를 적용한 시스템의 동작 방법
DE102011101934B4 (de) 2011-05-18 2017-07-06 Christian-Albrechts-Universität Zu Kiel Großflächiger Biofilmsensor
JP5416269B2 (ja) * 2012-12-11 2014-02-12 古河電気工業株式会社 並列光伝送装置
JP6063880B2 (ja) * 2014-01-31 2017-01-18 京セラドキュメントソリューションズ株式会社 導光体及び照明装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5005939A (en) * 1990-03-26 1991-04-09 International Business Machines Corporation Optoelectronic assembly
JPH0662561U (ja) * 1993-01-31 1994-09-02 第一電子工業株式会社 光半導体モジュール
JPH0730019A (ja) * 1993-07-13 1995-01-31 Seiko Epson Corp Icソケット
JPH07294593A (ja) * 1994-04-28 1995-11-10 Ando Electric Co Ltd リードつきldモジュールの接触保持機構
KR100677065B1 (ko) * 1999-04-29 2007-02-01 삼성전자주식회사 광커넥터 모듈
US6540412B2 (en) * 2000-02-10 2003-04-01 Sumitomo Electric Industries, Ltd. Optical transceiver
US6592269B1 (en) * 2001-08-31 2003-07-15 Cypress Semiconductor Corporation Apparatus and method for integrating an optical transceiver with a surface mount package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111580227A (zh) * 2020-06-24 2020-08-25 四川华丰企业集团有限公司 一种光模块

Also Published As

Publication number Publication date
JP4619067B2 (ja) 2011-01-26
US7738797B2 (en) 2010-06-15
DE112005001744T5 (de) 2007-08-23
KR20070048218A (ko) 2007-05-08
JP2006073781A (ja) 2006-03-16
KR101082612B1 (ko) 2011-11-10
WO2006025434A1 (ja) 2006-03-09
TWI371834B (en) 2012-09-01
US20060269296A1 (en) 2006-11-30

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