TW200619257A - Epoxyresin compositions and articles - Google Patents

Epoxyresin compositions and articles

Info

Publication number
TW200619257A
TW200619257A TW094133580A TW94133580A TW200619257A TW 200619257 A TW200619257 A TW 200619257A TW 094133580 A TW094133580 A TW 094133580A TW 94133580 A TW94133580 A TW 94133580A TW 200619257 A TW200619257 A TW 200619257A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
epoxyresin
articles
compositions
Prior art date
Application number
TW094133580A
Other languages
English (en)
Inventor
Chie Umeyama
Yoshihiro Kawada
Seiko Mitachi
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of TW200619257A publication Critical patent/TW200619257A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
TW094133580A 2004-09-27 2005-09-27 Epoxyresin compositions and articles TW200619257A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004279388 2004-09-27

Publications (1)

Publication Number Publication Date
TW200619257A true TW200619257A (en) 2006-06-16

Family

ID=36118855

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133580A TW200619257A (en) 2004-09-27 2005-09-27 Epoxyresin compositions and articles

Country Status (3)

Country Link
JP (1) JP5270092B2 (zh)
TW (1) TW200619257A (zh)
WO (1) WO2006035709A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101600738B (zh) * 2007-02-02 2012-11-14 日产化学工业株式会社 反应性单体分散硅溶胶、其制备方法、固化用组合物及其固化体
JP2008266609A (ja) * 2007-03-22 2008-11-06 Nippon Shokubai Co Ltd 透明樹脂組成物及びその硬化物
WO2010058754A1 (ja) 2008-11-18 2010-05-27 日産化学工業株式会社 シリカ粒子を含有する重合性有機化合物の組成物の製造方法
JP6120661B2 (ja) * 2012-05-10 2017-04-26 日本合成化学工業株式会社 アニオン硬化性化合物用硬化剤、硬化性組成物、硬化物、及び新規イミダゾール系化合物
JP7162121B2 (ja) * 2019-02-26 2022-10-27 富士フイルム株式会社 内視鏡用接着剤及びその硬化物、並びに内視鏡及びその製造方法
KR102237294B1 (ko) * 2019-06-26 2021-04-07 (주)수 캡슐형 소화약제를 이용한 2액형 초기화재진압용 에폭시계 도료 조성물 및 에어로졸형 에폭시계 도료 조성물
JP7122449B1 (ja) * 2021-05-25 2022-08-19 サンスター技研株式会社 硬化性組成物及び硬化性組成物の製造方法
CN113637439B (zh) * 2021-08-03 2022-11-18 四川天邑康和通信股份有限公司 应用于光模块核心光器件封装的胶水及其制备方法
CN114292614A (zh) * 2022-03-02 2022-04-08 西陇科学股份有限公司 一种改性二氧化硅-环氧树脂复合浆料的制备方法
CN115093819B (zh) * 2022-07-01 2024-03-15 张家港飞腾复合新材料股份有限公司 复合板连接用胶粘剂及其应用方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19512427A1 (de) * 1995-04-03 1996-10-10 Inst Neue Mat Gemein Gmbh Kompositklebstoff für optische und optoelektronische Anwendungen
JPH08337680A (ja) * 1995-06-09 1996-12-24 Hitachi Ltd 熱硬化性樹脂およびその樹脂を用いた半導体装置
JP2005527113A (ja) * 2002-05-23 2005-09-08 スリーエム イノベイティブ プロパティズ カンパニー ナノ粒子充填アンダーフィル
JP4450151B2 (ja) * 2003-02-19 2010-04-14 Ｔｏｔｏ株式会社 エポキシ樹脂成形体からなる人工大理石

Also Published As

Publication number Publication date
JP5270092B2 (ja) 2013-08-21
JPWO2006035709A1 (ja) 2008-05-15
WO2006035709A1 (ja) 2006-04-06

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